A wafer dicing machine

Abstract

The invention relates to the technical field of semiconductor processing, and discloses a wafer dicing machine. A magnetic ring is installed on the support seat, and a ferrule located at the inner ring of the magnetic ring is installed in the support seat. The ferrule The interior of the main shaft is filled with a rubber plate, the top of the rubber plate is bonded to the bottom of the wafer, a magnetic rod is fixedly connected to the outer ring of the main shaft, and a first magnetic ring is fixedly connected to the end of the magnetic rod. The wafer can be fixed without additional fixing devices. At the same time, the top of the wafer is wrapped by the adhesive ring through the cooperation of the positioning ring and the adhesive ring, which reduces the cutting force of the wafer and slows down the cutting process of the wafer. At the same time, the debris after cutting is absorbed by the adhesive ring, so that the front and back of the wafer are protected in real time during the cutting process, and the force on the wafer is slowed down by flexible materials, thereby reducing the phenomenon of wafer damage. Increase the utilization rate of the wafer, so that the wafer remains in a stable state during dicing.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a wafer dicing machine. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and becomes an integrated circuit with specific electrical functions. circuit products. [0003] On a wafer, there are usually hundreds to thousands of chips connected together. There is a gap of 80um to 150um between them. This gap is called a dicing block. The working principle of the existing wafer dicing machine is as follows Figure 4 Shown: The scribing knife cuts the block part of the wafer at a high speed of 30,000 to 40,000 revolutions per minute, and at the same time, the workbench carrying the wafer moves in a straight line at a certain speed along the tangential d...

AI Technical Summary

Problems solved by technology

There is a gap of 80um to 150um between them. This gap is called a dicing block. The working principle of the existing wafer dicing machine is as follows Figure 4 Shown: The scribing knife cuts the block part of the wafer at a high speed of 30,000 to 40,000 revolutions per minute, and at the same time, the workbench carrying the wafer moves in a straight line at a certain speed along the tangential direction of the contact point between the blade and the wafer , during the cutting process of the wafer, because the silicon material itself is relatively fragile, the mechanical cutting method will generate mechanical stress on the front and back of the wafer, resulting in front chipping and back chipping on the edge of the chip, front chipping and back chipping It will reduce the mechanical strength of the chip, and the initial chip edge cracks will further diffuse in the subsequent packaging process or in the use of the product, which may cause the chip to break and lead to electrical failure. The electrical performance and reliability of the chip will be affected when the internal circuit and the sealing ring to prevent scribing damage are affected. At the same time, the scribing knife moves along with the wafer during cutting, so the contact surface between the slide rail and the spindle is rubbed. The friction causes wear debris on the contact surface of the slide rail, and the generation of wear debris further aggravates the wear of the slide rail. In addition, the slide rail is located on the upper part of the wafer. When the wear debris is generated, it is affected by gravity and sliding friction, and part of the grinding It falls off the slide rail and falls directly on the wafer, resulting in residual wear debris on the wafer, which intensifies the wear of the wafer and further affects the use of the wafer

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