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A low-cost copper-chromium composite contact preparation method

A composite contact, low-cost technology, applied in electrical components, electrical switches, circuits, etc., can solve the problems of complex process, complex production process, long production process, etc., to simplify the process flow, the production process is simple, and the joint surface is flat. Effect

Active Publication Date: 2021-03-30
SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent needs to pre-treat the raw materials with hydrogen, which is not in line with the current environmental protection and safety development, and the copper powder after hydrogen reduction treatment needs to be crushed in a protective atmosphere, and the process is complicated
At the same time, the patented method does not give a practical treatment method for the strength and flatness of the joint surface of the copper-chromium / copper composite layer, and does not have the feasibility of mass production
The above two patents are all preparation methods designed for copper-chromium composite contacts, but the first patent needs to make copper-chromium powder into a slurry and coat it on a pure copper plate for electron beam cladding. The production process is complicated and the production Low efficiency and high cost cannot be applied to industrial production
The preparation method proposed by the second patent does not conform to the current national environmental protection and safety policies because the raw materials need to be reduced by hydrogen respectively, and the copper powder is not easily broken after hydrogen sintering. This patent also does not provide a solution for the copper-chromium / copper composite surface Combined strength and flatness treatment plan
This patent has a long production process, requires flammable and explosive hydrogen treatment, and does not have the most critical bonding surface strength treatment method for composite contacts, so it cannot meet the current market demand for low cost and mass production.

Method used

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  • A low-cost copper-chromium composite contact preparation method
  • A low-cost copper-chromium composite contact preparation method
  • A low-cost copper-chromium composite contact preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] like figure 1 As shown, a low-cost copper-chromium composite contact preparation method mainly includes the following steps:

[0030] S1: Raw material selection, choose pure copper powder and pure chromium powder as raw materials, the pure copper powder is less than 150 microns, the pure chromium powder is 20~100 microns, and the pure copper powder is electrolytic copper powder or atomized copper powder less than 150 microns; The present invention adopts conventional pure copper powder and chromium powder, the raw materials do not need to be reprocessed, and the technological process is simplified; the pure copper powder is less than 150 microns, the pure chromium powder is 20-100 microns, and the pure copper powder is selected below 150 microns Electrolytic copper powder or atomized copper powder can make it unnecessary to reprocess the raw materials in the preparation and simplify the process flow.

[0031] S2: Powder mixing, weighing and proportioning pure copper po...

Embodiment 2

[0037] like figure 1 As shown, a low-cost copper-chromium composite contact preparation method mainly includes the following steps:

[0038] S1: Raw material selection, choose pure copper powder and pure chromium powder as raw materials, the pure copper powder is less than 150 microns, the pure chromium powder is 20~100 microns, and the pure copper powder is electrolytic copper powder or atomized copper powder less than 150 microns; The present invention adopts conventional pure copper powder and chromium powder, the raw materials do not need to be reprocessed, and the technological process is simplified; the pure copper powder is less than 150 microns, the pure chromium powder is 20-100 microns, and the pure copper powder is selected below 150 microns Electrolytic copper powder or atomized copper powder can make it unnecessary to reprocess the raw materials in the preparation and simplify the process flow.

[0039] S2: Powder mixing, weighing and proportioning pure copper po...

Embodiment 3

[0045] like figure 1 As shown, a low-cost copper-chromium composite contact preparation method mainly includes the following steps:

[0046] S1: Raw material selection, choose pure copper powder and pure chromium powder as raw materials, the pure copper powder is less than 150 microns, the pure chromium powder is 20~100 microns, and the pure copper powder is electrolytic copper powder or atomized copper powder less than 150 microns; The present invention adopts conventional pure copper powder and chromium powder, the raw materials do not need to be reprocessed, and the technological process is simplified; the pure copper powder is less than 150 microns, the pure chromium powder is 20-100 microns, and the pure copper powder is selected below 150 microns Electrolytic copper powder or atomized copper powder can make it unnecessary to reprocess the raw materials in the preparation and simplify the process flow.

[0047] S2: Powder mixing, weighing and proportioning pure copper po...

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Abstract

The invention discloses a low-cost copper-chromium composite contact terminal preparation method. The method mainly comprises the following steps: S1: selecting pure copper powder and pure chromium powder as raw materials; S2: weighing and formulating the pure copper powder and the pure chromium powder in proportion, placing the pure copper powder and the pure chromium powder in a blender mixer for ball milling to obtain copper-chromium mixed powder; S3: pre-pressing the copper-chromium mixed powder in a mold at first, and then filling the pure copper powder in a mold space reserved after pressing, and performing secondary pressing; S4: sintering a pressed green body; S5: re-pressing the sintered blank; and S6: re-sintering the re-pressed blank. The low-cost copper-chromium composite contact terminal preparation method disclosed by the invention has the advantages of low cost and high reliability, and is suitable for mass production market demands, and a prepared copper-chromium composite contact terminal has high mechanical strength of a copper-chromium / copper junction surface, a smooth junction surface, a simple production process, a low cost and high feasibility in batch production.

Description

technical field [0001] The invention relates to the technical field of alloy contact preparation, in particular to a method for preparing a low-cost copper-chromium composite contact. Background technique [0002] The CuCr contact material with high Cr content, due to the small mutual solubility between Cu and Cr, forms a two-phase "pseudo-alloy", so that both Cu and Cr fully retain their good properties, that is, they have a lower melting point, The Cu component with high electrical conductivity and thermal conductivity is beneficial to improve the breaking capacity of the vacuum switch; the Cr component has a high melting point, mechanical strength and low cut-off value, which ensures that the vacuum switch has good voltage resistance and resistance Ablation, anti-welding and low interception characteristics. Therefore, it is widely used in contact materials of 126kV and below vacuum circuit breakers. With the advancement of technology, vacuum circuit breakers are develo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H11/04C22C9/00C22C27/06B22F3/02B22F3/10
CPCB22F3/02B22F3/1007B22F2998/10C22C9/00C22C27/06H01H11/048B22F3/10
Inventor 刘凯师晓云王小军张石松贺德永李鹏李刚
Owner SHAANXI SIRUI ADVANCED MATERIALS CO LTD