Low-thermal-resistance and low-temperature luminescent powder layer LED

Abstract

A low-thermal-resistance and low-temperature luminescent powder layer LED includes at least one LED chip and a metal substrate with high thermal conductivity, such as a metal-based circuit board. TheLED chip is mounted or flip-chip mounted on the metal substrate. The electrodes of the LED chip are led out by leads and a conductor insulated from a metal base. The light-emitting surface of the LEDchip has a light-transmitting medium layer which contains light-scattering powders. A light-transmitting cover is disposed on the light-transmitting medium layer. A luminescent powder layer is disposed on the inner surface of the light-transmitting cover. The luminescent powders have a simple coating process, are uniform, and good in consistency. The luminescent powder layer has a large area, is not directly contact with the LED chip, is low in temperature, high in light-emitting efficiency, and low in light attenuation. The LED has a long service life and a simple manufacturing process, and can be produced in large batches. The LED can be used for lighting, decorative lamps, solar lamps, mining lamps, table lamps, bedside lamps, vehicle and ship lamps and displays.

Description

technical field [0001] The invention relates to a high-power, low-thermal-resistance, low-temperature luminescent powder layer light-emitting diode, which is used for lighting, decorative lights, solar lights, miner's lamps, lighting projects and displays. Background technique [0002] In the prior art white light power type light emitting diodes, the light emitting diode chip emitting blue light or ultraviolet light is usually flipped on the silicon wafer first, and then installed on the metal base; there are luminescent powders on the light emitting surface of the chip and its surroundings, which can absorb blue light And emit yellow light, and then mix with blue light to produce white light, or absorb ultraviolet light to emit white light. At present, because about 80% of the electric energy input into the LED will be converted into heat energy, the heat mainly comes from the p-n junction of the LED chip, the temperature around the chip is very high, and the luminescent p...

AI Technical Summary

Problems solved by technology

At present, because about 80% of the electric energy input into the LED will be converted into heat energy, the heat mainly comes from the p-n junction of the LED chip, the temperature around the chip is very high, and the luminescent powder layer is just here. The area load power is more than 2,000 times that of ordinary fluorescent lamps, and its surface brightness is as high as 6 million cd / m 2 Above, such a high surface brightness will be detrimental to the human eye, and high temperature will lead to a decrease in the luminous efficiency of the luminescent powder, accelerated light decay, and shortened life of the LED;

[0003] Secondly, the coating uniformity of the luminescent powder of the current white light power LED is poor, the process is complicated, and the consistency is poor. This is another problem in the current manufacture of high-power white power LEDs.

[0004] In addition, the manufacturing process of white light power type LEDs is complicated, difficult to produce in large quantities, and the cost is high.

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