Packaging structure for improving reliability of SESAM all-fiber mode-locked laser oscillator

Abstract

The invention discloses a packaging structure for improving reliability of a SESAM all-fiber mode-locked laser oscillator, and belongs to the technical field of laser. The packaging structure comprises a SESAM packaging structure and an all-fiber mode-locked laser oscillator structure. The SESAM packaging structure comprises an optical fiber jumper. The optical fiber jumper comprises a polarization maintaining optical fiber and a stud type inserting core. A semiconductor saturable absorption mirror is clamped on the stud type inserting core. A conversion sleeve is connected on the outer side of the stud type inserting core through threads. A ceramic inserting core is inserted into the conversion sleeve. The all-fiber mode-locked laser oscillator structure comprises a laser oscillator bodywhich is internally provided with a single-mode pump laser source and a wavelength division multiplexer connected with the SESAM packaging structure. The output end of the wavelength division multiplexer is sequentially provided with a single-mode ytterbium-doped gain fiber, a broadband chirped fiber grating and a polarization-related isolator. The surface pollution of the semiconductor saturableabsorption mirror can be prevented, the maintenance after the semiconductor saturable absorption mirror is damaged and the replacement when the semiconductor saturable absorption mirror is damaged canbe facilitated, and the maintenance efficiency can be improved.

Description

Technical field [0001] The invention relates to the field of laser technology, and more specifically, to a packaging structure for improving the reliability of a SESAM all-fiber mode-locked laser oscillator. Background technique [0002] Fiber lasers are rapidly emerging in the development of ultrafast laser technology due to their excellent beam quality, good thermal conductivity, and high average power output. As an important laser technology, ultrafast fiber lasers can be used in a variety of research and application fields. In the fields of industry, aerospace and national defense, ultrafast fiber laser manufacturing technology has great application value in precision machining, additive manufacturing, intelligent equipment manufacturing and other fields due to its low energy consumption, high efficiency, digitalization and intelligence. The multi-field application of ultrafast fiber laser source puts forward higher requirements for its own output laser performance. At pres...

AI Technical Summary

Problems solved by technology

[0004] However, due to the strong linear absorption of the semiconductor saturable absorber mirror and the impurity defects on the fiber end face, and the semiconductor saturable absorber mirror and the single-mode fiber are easily polluted by glue during the curing process, the anti-damage threshold of the semiconductor saturable absorber mirror is reduced, resulting in its highly vulnerable to damage

At present, the UV curing technology brings the semiconductor saturable absorbing mirror to the fiber end face. However, due to the close curing of the semiconductor saturable absorbing mirror and the fiber end face, it is relatively difficult to replace the dead point of the semiconductor saturable absorbing mirror. In most cases The semiconductor saturable absorption mirror needs to be replaced with a new one, and the original semiconductor saturable absorption mirror has been damaged during the disassembly process, which makes its maintenance inefficient and increases the cost

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