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Substrate laminate and method for manufacturing substrate laminate

A manufacturing method and laminated body technology, which is applied in semiconductor/solid-state device manufacturing, chemical instruments and methods, coatings, etc., can solve the problem that circuit miniaturization is difficult to fully cope with, and achieve the effect of inhibiting peeling

Active Publication Date: 2019-12-06
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, miniaturization of circuits is difficult to sufficiently meet this requirement

Method used

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  • Substrate laminate and method for manufacturing substrate laminate
  • Substrate laminate and method for manufacturing substrate laminate
  • Substrate laminate and method for manufacturing substrate laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0275] As compound (A), 4.0 g of 3-aminopropyldiethoxymethylsilane (3APDES; (3-Aminopropyl)diethoxymethylsilane) was prepared, added to 56.0 g of 1-propanol (1PrOH), and further 8.8 After dissolving 20.0 g of an aqueous solution of formic acid (FA) in % by mass so that 3APDES becomes 5% by mass, it was stirred at room temperature for 1 hour, and then heated in a 60° C. water bath for 1 hour to obtain a compound (A) containing solution. In this solution, 3APDES exists in the form of hydrolyzate. In the hydrolyzate of 3APDES, one non-crosslinkable methyl group, two crosslinkable hydroxyl groups, and one crosslinkable aminopropyl group are bonded to Si. That is, (non-crosslinkable group) / Si is 1.

[0276] As a crosslinking agent (B), 1-propyl half ester trimellitic acid (1PrheTMA; 1-propyl half esterTMA) was prepared. 1PrheTMA is produced by adding trimellitic anhydride to 1-propanol to completely dissolve trimellitic anhydride powder.

[0277] Next, a solution containing the...

Embodiment 2

[0283] Prepare 2.0 g of solution 1 prepared in Example 1, add it to 12.0 g of 1PrOH, and further add 6.0 g of water to prepare a solution containing compound (A), crosslinking agent (B) and acid (C-1) 2.

[0284] In addition, in Table 1, the concentration in parentheses in 3APDES (0.2% by mass) represents the concentration of 3APDES in the solution containing the compound (A) and the crosslinking agent (B).

[0285] The number in parentheses in 1PrheTMA[1.03] represents the ratio (COOH / N) of the number of carboxyl groups in 1PrheTMA as a crosslinking agent (B) to the number of all nitrogen atoms in 3APDES as a compound (A).

[0286] The value 1.83 in parentheses of FA represents the ratio (COOH / N) of the number of carboxyl groups in FA as acid (C-1) to the number of all nitrogen atoms in 3APDES as compound (A).

[0287] The concentration in parentheses in 1PrOH (68.6% by mass) represents the concentration of 1PrOH in the solution containing the compound (A) and the crosslinki...

Embodiment 3

[0289] As the compound (A), polyethyleneimine (Mw=70,000, primary nitrogen atom / secondary nitrogen atom / tertiary nitrogen atom=31 / 40 / 29).

[0290] As a crosslinking agent (B), 7.0 g of trimellitic acid (TMA) was added to 12.67 g of water, and ammonia (NH 3 ) 8.4 mass % aqueous solution 30.33g, TMA was completely dissolved, and it manufactured.

[0291] Next, the solution containing the compound (A) and the solution containing the crosslinking agent (B) were mixed so as to have the concentrations shown in Table 1 to prepare a solution containing the compound (A) and the crosslinking agent (B). 3.

[0292] In addition, in Table 1, the concentration in parentheses in BPEI (0.15% by mass) represents the concentration of BPEI in the solution containing the compound (A) and the crosslinking agent (B).

[0293] The values ​​in parentheses in TMA [1.5] represent the ratio (COOH / N) of the number of carboxyl groups in TMA as the crosslinking agent (B) to the number of all nitrogen a...

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Abstract

Provided is a substrate laminate comprising a first substrate, an adhesive layer, and a second substrate that are laminated in this order, the adhesive layer containing a reaction product of a compound (A) having a cationic functional group that includes at least one of a primary nitrogen atom and a secondary nitrogen atom and having a weight average molecular weight of 90-400000, and a crosslinking agent (B) having a weight average molecular weight of 200-600 and including three or more -C(=O)OX groups (where X denotes a hydrogen atom or a C1-6 alkyl group) in a molecule, one to six groups among the three or more -C(=O)OX groups being -C(=O)OH groups. The compound (A) includes at least one type selected from the group consisting of an aliphatic amine having a weight average molecular weight of 10000-400000 and a compound having a siloxane bond (a Si-O bond) and an amino group and having a weight average molecular weight of 130-10000.

Description

technical field [0001] The present invention relates to a substrate laminate and a method for manufacturing the substrate laminate. Background technique [0002] As electronic devices are made smaller, lighter, and more functional, higher integration of semiconductor chips and the like is required. However, miniaturization of circuits is difficult to sufficiently meet this requirement. Therefore, in recent years, a method of high integration by vertically laminating a plurality of semiconductor substrates (wafers), semiconductor chips, etc. to form a multilayer three-dimensional structure has been proposed. As a method for stacking semiconductor substrates (wafers), semiconductor chips, etc. (hereinafter, sometimes referred to as "semiconductor substrates, etc."), direct bonding (fusion bonding) of substrates, methods using adhesives, and the like have been proposed. methods and the like (for example, refer to Patent Documents 1 to 3 and Non-Patent Documents 1 to 2). [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/12C09J11/06C09J179/02C09J183/04C09J201/02H01L21/02H10N30/073
CPCB32B7/12C09J11/06C09J179/02C09J183/04C09J201/02B32B15/08B32B15/098B32B15/20B32B27/28B32B27/42B32B27/18B32B27/20B32B2250/03B32B2250/40B32B2307/50B32B2457/00B32B27/34H01L2224/32145H01L25/50H01L2224/94H01L24/29H01L24/32H01L24/83H01L2224/83097H01L2224/8385H01L2224/83862H01L2224/08145H01L2224/05647H01L2224/80903H01L2224/2919H01L2224/83203H01L2224/83075H01L2224/83009H01L2224/83H01L2924/00014H01L2924/0665H01L21/02B32B2457/14H01L2924/12041H01L2924/1434H01L2924/146H01L2924/1461B32B2255/26H01L24/00
Inventor 镰田润高村一夫茅场靖刚
Owner MITSUI CHEM INC