Production device and method of large oxygen-free copper ingot applied to target material

Abstract

The invention provides a production device for a large high-purity and high-density oxygen-free copper ingot applied to a target material. The device comprises a lifting mechanism, wherein in the production process of the oxygen-free copper ingot, after raw copper is melted, a lifting mechanism can drive an intermediate frequency coil, an insulating layer and an air cooling assembly to move upwards to realize directional solidification of copper liquid from bottom to top. In the solidification process of the copper liquid, as the cooling mechanism is located below a crucible assembly and the air cooling assembly moves slowly and evenly from bottom to top, the copper liquid starts to solidify from the bottom of a crucible, solid copper is located at the bottom of the crucible, uncooled liquid copper is located at the upper part, coexistence of solid and liquid is achieved, and liquid copper exists on the surface of the solid copper or the copper being solidified all the time; when defects such as holes are produced in the solid copper at the bottom, liquid copper at the upper part can be used for replenishment in time, and thus, the effect of feeding is achieved, internal defects ofthe copper ingot are reduced, density of the copper ingot is improved, and the obtained oxygen-free copper ingot has high purity, high density, large size and small defects.

Description

technical field [0001] The invention belongs to the field of non-ferrous metal processing and new materials, and in particular relates to a production mechanism and production method of large-size, high-purity, high-density oxygen-free copper ingots applied to magnetron sputtering rotating targets. Background technique [0002] With the continuous development of the new display industry, the size and technology of display screens and touch screens have been further increased and improved. In order to meet the continuous progress and demands of the display industry, the size and sputtering power of the magnetron sputtering target are also increasing, and the requirements for the purity and microstructure of the target are getting higher and higher. Because copper has excellent electrical and thermal conductivity and excellent ductility, it is one of the key materials in the display industry. At present, in order to obtain the best electrical and thermal conductivity in the d...

AI Technical Summary

Problems solved by technology

The production device uses a deoxidation mechanism, a lifting mechanism and a cooling and heat preservation mechanism to solve the problems of insufficient copper ingot size, low deoxidation efficiency, and internal defects such as holes and shrinkage cavities caused by the process and crystallization method during the oxygen-free copper production process.

Images