Specific acidic plastic plate for photovoltaic diamond wire cutting and preparation method thereof

A photovoltaic diamond and wire cutting technology, which is applied in the field of plastic plate preparation, can solve the problems of sticking rigid wires, inconvenient recycling of silicon materials and backing plates, and easy occurrence of clogged filter bags, so as to prevent air bubbles and static electricity, facilitate cutting and silicon materials Effects of recycling and cost reduction of raw materials

Inactive Publication Date: 2020-01-21
广西拓源新材料有限公司
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a specific photovoltaic diamond wire cutting acidic plastic board and its preparation method to solve the problems that the traditional resin board is easy to block the filter bag, stick to the steel wire, and is inconvenient to recycle the silicon material and backing board during use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Specific acidic plastic plate for photovoltaic diamond wire cutting and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0036] 1. Experimental equipment

[0037] Mixer (with adjustable speed stirring device), twin-screw extrusion granulator (with automatic temperature control device, cooling device, vacuum device), dryer (with adjustable speed stirring device, automatic Temperature control device, cooling device), single screw extrusion molding machine (with automatic temperature control device, cooling device, vacuum device).

[0038] 2. Preparation before the experiment

[0039] Clean the mixer, twin-screw extrusion granulation, dryer, and single-screw extruder to ensure that there are no other materials or impurities that affect the reaction.

[0040] 3. Preparation formula of specific photovoltaic diamond wire cutting acidic plastic board: in mass percentage, including ABS resin 72.3-87.4%, PMMA resin 5.615.9%, EAA resin 2.9-5.6%, compatibilizer 2-4%, Organic acid 0.5-0.8%, antioxidant 0.2-0.8%, inorganic filler 0.5-5%, surfactant 0.2-0.6%;

[0041] The compatibilizer includes MBS resin;

[0042] Th...

Embodiment 1

[0052] 1. Experimental equipment

[0053] Mixer (with adjustable speed stirring device), twin-screw extrusion granulator (with automatic temperature control device, cooling device, vacuum device), dryer (with adjustable speed stirring device, automatic Temperature control device, cooling device), single screw extrusion molding machine (with automatic temperature control device, cooling device, vacuum device).

[0054] 2. Preparation before the experiment

[0055] Clean the mixer, twin-screw extrusion granulation, dryer, and single-screw extruder to ensure that there are no other materials or impurities that affect the reaction.

[0056] 3. Preparation formula of specific photovoltaic diamond wire cutting acidic plastic board: in mass percentage, including ABS resin 81.8%, PMMA resin 6.3%, compatibilizer 2%, EAA resin 5.6%, organic acid 0.8%, antioxidant 0.6%, inorganic filler 2.3%, surfactant 0.6%;

[0057] The compatibilizer is MBS resin;

[0058] The organic acid is phthalic acid;

[...

Embodiment 2

[0067] 1. Experimental equipment

[0068] Mixer (with adjustable speed stirring device), twin-screw extrusion granulator (with automatic temperature control device, cooling device, vacuum device), dryer (with adjustable speed stirring device, automatic Temperature control device, cooling device), single screw extrusion molding machine (with automatic temperature control device, cooling device, vacuum device).

[0069] 2. Preparation before the experiment

[0070] Clean the mixer, twin-screw extrusion granulation, dryer, and single-screw extruder to ensure that there are no other materials or impurities that affect the reaction.

[0071] 3. Preparation formula of specific photovoltaic diamond wire cutting acidic plastic board: in mass percentage, including ABS resin 72.3%, PMMA resin 15.9%, compatibilizer 2.8%, EAA resin 4.3%, organic acid 0.6%, antioxidant 0.5%, 3.2% inorganic filler, 0.4% surfactant;

[0072] The compatibilizer is MBS resin;

[0073] The organic acid is succinic acid;...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
densityaaaaaaaaaa
Login to view more

Abstract

The invention discloses a specific acidic plastic plate for photovoltaic diamond wire cutting and a preparation method thereof. The plastic plate comprises the following raw materials: matrix resin and an auxiliary agent, and is prepared through the steps of raw material mixing, granulation, extrusion molding, polishing, cutting, detection, packaging and the like. The plastic plate prepared by theinvention meets the requirement of a large circulation system of a diamond wire cutting process, is easy to recycle, can be recycled, and meets the environmental protection requirement of continuousutilization; in a silicon rod cutting process using the diamond wire, impurities adhering to the diamond wire are reduced, the abrasion probability of the diamond wire is reduced, the cost is saved, the superior product rate of silicon wafers is increased, and therefore the production efficiency is effectively improved. Compared with the prior art, the prepared plastic plate is better in shore hardness and equivalent in pH value and conductivity, and has remarkable progress.

Description

Technical field [0001] The invention belongs to the technical field of plastic board preparation, and specifically relates to a specific photovoltaic diamond wire cutting acidic plastic board and a preparation method thereof. Background technique [0002] In the field of solar photovoltaic power generation, when processing silicon ingots to form silicon wafers, it is necessary to slice through diamond wires, and it is necessary to use resin plate auxiliary materials to bond with silicon ingots. The density of traditional resin plates is 1.5-2.0g / cm 3 , After each cut, the resin board needs to be scrapped. The weight of each resin board is about 1.3kg. According to the cutting capacity of different volumes, the processing weight of the resin board produced per month can reach about 15 tons. This brings higher processing costs to environmental protection. In addition, traditional resin plates are prone to breakage, disconnection, filter bag blocking, rigid wires, and inconvenient re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L55/02C08L33/12C08L23/08C08L51/04C08L71/02C08K13/02C08K5/134C08K5/526C08K3/34C08K5/092
CPCC08L55/02C08L2201/08C08L2205/035C08L2205/08C08L33/12C08L23/0869C08L51/04C08L71/02C08K13/02C08K5/1345C08K5/526C08K3/34C08K5/092
Inventor 梁羽潘永强苏光临陈韬
Owner 广西拓源新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap