Prepreg, laminated board and printed wiring board

A prepreg and composition technology, applied in the direction of printed circuit, printed circuit, printed circuit components, etc., can solve the problems of signal delay, corrosiveness, toxic gas, environmental pollution, etc., and achieve the elimination of transmission delay and optimal glass transition The effect of temperature

Inactive Publication Date: 2020-01-24
ITEQ WUXIELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally reinforced materials are mostly woven glass materials, such as low dielectric constant (Dk) glass, E-type glass, R-type glass, ECR-type glass, S-type glass, C-type glass and Q-type glass, however, woven glass The glass material and the polymer material are heterogeneous materials, resulting in signal delay, this phenomenon is known in the field of digital engineering as "skew"
[0004] In addition, flame retardants containing halogen components (especially brominated flame retardants), such as tetrabromocyclohexane, hexabromocyclodecane and 2,4,6-tri(tri Bromophenoxy)-1,3,5-triazabenzene and other halogen-containing flame retardants have the advantages of good flame retardancy and less addition. However, halogen products are used in product manufacturing, use, and even recycling Or it is easy to cause pollution to the environment when discarded. In addition, halogen-containing electronic equipment waste will produce corrosive and toxic gases and smoke when burned, and dioxins and dibenzofurans will be detected in the products after burning other carcinogens

Method used

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  • Prepreg, laminated board and printed wiring board
  • Prepreg, laminated board and printed wiring board
  • Prepreg, laminated board and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment E1 to E6

[0072] The compositions of Examples E1 to E6 are shown in Table 1 below. Examples E1 to E6 use non-woven PTFE mats as reinforcing materials, which are continuously passed through a series of rollers and enter the gluing tank, where the halogen-free epoxy resin composition of the present invention is loaded (as shown in Table 1). In the gluing tank, the reinforcing material is fully infiltrated by the halogen-free epoxy resin composition, and then the excess halogen-free epoxy resin composition is scraped off by the metering roller, and then baked in the gluing furnace for 100 to 180 minutes to evaporate the solvent and make it The resin is solidified, then cooled and rolled to form a resin substrate. The resin substrate and two 18μm copper foils were laminated in the order of copper foil, resin substrate, and copper foil, and then pressed at 220°C for 2 hours under vacuum to form a copper foil substrate.

[0073] Table 1

[0074]

[0075]

[0076] *NPTE4000 naphthalene...

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PUM

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Abstract

The invention discloses a prepreg, a laminated board and a printed circuit board. The prepreg includes a halogen-free epoxy resin composition and a partially cured nonwoven reinforcing material impregnated therein. The nonwoven reinforcing material has a dielectric strength of 1.5-4.8 and a loss factor of below 0.003 at 10 GHz, and the halogen-free epoxy resin composition includes, by weight, (a)100 parts of a halogen-free naphthalene type epoxy resin, (b) 10-25 parts of a DOPO modifying hardener, (c) 25-45 parts of a cyanate ester resin, (d) 35-60 parts of bismaleimide, (e) 45-65 parts of anon-DOPO flame retardant and (f) 0.5-15 parts of a hardening accelerator. The prepreg effectively improves the delay effect, and has the characteristics of high glass transition temperature, low dielectric loss, high heat resistance and high storage modulus.

Description

technical field [0001] The invention relates to a prepreg, a laminate and a printed circuit board, in particular to a prepreg, a laminate and a printed circuit board using a halogen-free epoxy resin composition. Background technique [0002] A printed circuit board (PCB) is usually impregnated with a reinforcing material in a polymer material to form a composite material, and then further laminated (clad) with a metal layer on one or both sides of the composite material to form a composite material for the PCB. Laminates in applications. [0003] Generally reinforced materials are mostly woven glass materials, such as low dielectric constant (Dk) glass, E-type glass, R-type glass, ECR-type glass, S-type glass, C-type glass and Q-type glass, however, woven glass The glass material and the polymer material are heterogeneous materials, thus causing signal delay. This phenomenon is known as "skew" in the field of digital engineering. [0004] In addition, flame retardants cont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08L79/08C08K5/5397C08K5/06C08J5/24B32B15/20B32B15/085B32B27/06B32B27/38B32B27/20B32B27/04B32B33/00H05K1/03
CPCB32B15/085B32B15/20B32B27/06B32B27/20B32B27/38B32B2260/021B32B2260/046B32B2262/0253B32B2307/204B32B2307/206B32B2307/306B32B2307/3065B32B2457/08C08J5/24C08J2363/00C08J2463/00C08J2479/04C08J2479/08C08K5/06C08K5/5397H05K1/0353B32B5/022B32B5/028B32B5/26B32B7/12B32B15/12B32B15/14B32B19/02B32B19/04B32B19/041B32B19/06B32B29/005B32B2250/03B32B2250/40B32B2262/10B32B2262/101B32B2264/10B32B2264/102B32B2264/104B32B2264/108B32B2307/30B32B2307/302B32B2307/308B32B2307/51B32B2307/724C08J5/246H05K1/0366H05K2201/015H05K2201/0293H05K1/09
Inventor 刘明翁宗烈苑绍杰陈凯杨于达元
Owner ITEQ WUXIELECTRONICS TECH
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