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Trimming-free super-hard grinding wheel for machining hard and brittle materials and preparation method thereof

A technology for hard and brittle materials and grinding wheels, which is applied in the field of dressing-free superhard grinding wheels for processing hard and brittle materials and their preparation, can solve the problems of frequent dressing, easy blockage of grinding wheels, burns, etc. The effect of self-sharpening

Inactive Publication Date: 2020-01-31
郑州伯利森新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a dressing-free superhard grinding wheel for processing hard and brittle materials and a preparation method thereof in order to solve the problems of large cutting depth of hard and brittle materials, easy clogging and burning of the grinding wheel during fast-feed grinding, and frequent dressing.

Method used

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  • Trimming-free super-hard grinding wheel for machining hard and brittle materials and preparation method thereof
  • Trimming-free super-hard grinding wheel for machining hard and brittle materials and preparation method thereof
  • Trimming-free super-hard grinding wheel for machining hard and brittle materials and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] see figure 1 , a dressing-free superhard grinding wheel for processing hard and brittle materials, comprising a base body, the base body is provided with a central hole, and a grinding layer is arranged on one side of the base body, and the grinding layer is composed of an abrasive layer 1, an abrasive layer 2 and abrasive layer 3, the circumferential chip removal groove 1 and the circumferential chip removal groove 2 are respectively arranged between the abrasive layer 1 and the abrasive layer 2 and between the abrasive layer 2 and the abrasive layer 3, and the radial chip removal groove 3 is along the The grinding wheel radially penetrates the abrasive layer 1, the abrasive layer 2 and the abrasive layer 3 and communicates with the circumferential chip removal groove 1 and the circumferential chip removal groove 2, and the abrasive layer 1, the abrasive layer 2 and the abrasive layer 3 are all composed of the following mass parts Made of raw materials: 40 parts of art...

Embodiment 2

[0030] see figure 2 , a dressing-free superhard grinding wheel for processing hard and brittle materials of the present implementation, comprising a base body, the base body is provided with a central hole, and a grinding layer is arranged on one side of the base body, and the grinding layer is composed of an abrasive material layer 1 Composed of the abrasive layer 2, the circumferential chip removal groove 1 is arranged between the abrasive layer 1 and the abrasive layer 2, and the radial chip removal groove 2 runs through the abrasive layer 1 and the abrasive layer 2 along with the radial direction of the grinding wheel at an angle of 60°. The circumferential chip removal groove 1 is connected, and the abrasive layer 1 and the abrasive layer 2 are made of the following raw materials in parts by mass: 28 parts of artificial diamond, 25 parts of phenolic resin, 6 parts of copper-tin alloy powder, 3 parts of iron oxide, 5.5 parts of zinc oxide, 5 parts of heat-expandable micro...

Embodiment 3

[0037] The dressing-free superhard grinding wheel for processing hard and brittle materials in this embodiment is an improvement on the basis of the grinding wheel in Example 2. It includes a base body, the base body is provided with a central hole, and one side of the base body is provided with Grinding layer, the grinding layer is composed of abrasive material layer 1 and abrasive material layer 2, the circumferential chip removal groove 1 is arranged between the abrasive material layer 1 and the abrasive material layer 2, and the radial chip removal groove 2 is 45 degrees apart from the radial direction of the grinding wheel. The angle direction runs through the abrasive layer 1 and the abrasive layer 2 and communicates with the circumferential chip removal groove 1, and the abrasive layer 1 and the abrasive layer 2 are all made of the following raw materials in parts by mass: 35 parts of artificial diamond, 35 parts of phenolic resin , 5 parts of copper powder, 10 parts of ...

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Abstract

The invention discloses a trimming-free super-hard grinding wheel for machining hard and brittle materials. The trimming-free super-hard grinding wheel comprises a base body, a grinding layer is composed of a plurality of layers of abrasive layers; the grinding layer is provided with a circumferential chip removing groove and a radial chip removing groove; each abrasive layer is prepared from thefollowing components in parts by mass of 20-55 parts of super-hard abrasive, 10-35 parts of resin powder, 3-15 parts of metal powder, 2-10 parts of filler, 2-6 parts of pore forming agent, 1-3 parts of calcium sulfate whisker and 1-2 parts of wetting agent; and during preparation, the raw materials of the abrasive layer components are uniformly mixed, hot-pressed and formed, cured, cooled to roomtemperature along with the furnace to obtain each abrasive layer blank, the abrasive layer blank is bonded to the base body, the grinding wheel is machined according to requirements, and the corresponding chip removing groove is cut out on the abrasive layer to obtain the finished product of the grinding wheel. The grinding wheel has excellent chip removal capability, heat dissipation capability and excellent self-sharpening performance, can ensure the machining quality of the workpiece and does not need to be trimmed, greatly improves the machining efficiency, and is low in production cost and simple in preparation process.

Description

technical field [0001] The invention relates to the field of grinding abrasives, in particular to a dressing-free superhard grinding wheel for processing hard and brittle materials and a preparation method thereof. Background technique [0002] In the grinding of hard and brittle materials, when the workpiece needs to be removed with a large allowance, in order to improve the processing efficiency, the single depth of cut is usually increased and the cutting speed is increased. Under these conditions, a large amount of grinding debris and heat will be generated during the grinding process. However, the existing grinding wheel will produce problems such as large grinding noise, high load of the machine tool, clogging of the grinding wheel, and easy burns during large-depth cutting and fast-feeding processing, resulting in poor surface quality and even substandard dimensions of the processed workpieces. Frequent grinding wheel inspections are required. Trimming to solve the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/34B24D18/00
CPCB24D3/346B24D18/0072
Inventor 马尧史冬丽
Owner 郑州伯利森新材料科技有限公司