Trimming-free super-hard grinding wheel for machining hard and brittle materials and preparation method thereof
A technology for hard and brittle materials and grinding wheels, which is applied in the field of dressing-free superhard grinding wheels for processing hard and brittle materials and their preparation, can solve the problems of frequent dressing, easy blockage of grinding wheels, burns, etc. The effect of self-sharpening
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Embodiment 1
[0023] see figure 1 , a dressing-free superhard grinding wheel for processing hard and brittle materials, comprising a base body, the base body is provided with a central hole, and a grinding layer is arranged on one side of the base body, and the grinding layer is composed of an abrasive layer 1, an abrasive layer 2 and abrasive layer 3, the circumferential chip removal groove 1 and the circumferential chip removal groove 2 are respectively arranged between the abrasive layer 1 and the abrasive layer 2 and between the abrasive layer 2 and the abrasive layer 3, and the radial chip removal groove 3 is along the The grinding wheel radially penetrates the abrasive layer 1, the abrasive layer 2 and the abrasive layer 3 and communicates with the circumferential chip removal groove 1 and the circumferential chip removal groove 2, and the abrasive layer 1, the abrasive layer 2 and the abrasive layer 3 are all composed of the following mass parts Made of raw materials: 40 parts of art...
Embodiment 2
[0030] see figure 2 , a dressing-free superhard grinding wheel for processing hard and brittle materials of the present implementation, comprising a base body, the base body is provided with a central hole, and a grinding layer is arranged on one side of the base body, and the grinding layer is composed of an abrasive material layer 1 Composed of the abrasive layer 2, the circumferential chip removal groove 1 is arranged between the abrasive layer 1 and the abrasive layer 2, and the radial chip removal groove 2 runs through the abrasive layer 1 and the abrasive layer 2 along with the radial direction of the grinding wheel at an angle of 60°. The circumferential chip removal groove 1 is connected, and the abrasive layer 1 and the abrasive layer 2 are made of the following raw materials in parts by mass: 28 parts of artificial diamond, 25 parts of phenolic resin, 6 parts of copper-tin alloy powder, 3 parts of iron oxide, 5.5 parts of zinc oxide, 5 parts of heat-expandable micro...
Embodiment 3
[0037] The dressing-free superhard grinding wheel for processing hard and brittle materials in this embodiment is an improvement on the basis of the grinding wheel in Example 2. It includes a base body, the base body is provided with a central hole, and one side of the base body is provided with Grinding layer, the grinding layer is composed of abrasive material layer 1 and abrasive material layer 2, the circumferential chip removal groove 1 is arranged between the abrasive material layer 1 and the abrasive material layer 2, and the radial chip removal groove 2 is 45 degrees apart from the radial direction of the grinding wheel. The angle direction runs through the abrasive layer 1 and the abrasive layer 2 and communicates with the circumferential chip removal groove 1, and the abrasive layer 1 and the abrasive layer 2 are all made of the following raw materials in parts by mass: 35 parts of artificial diamond, 35 parts of phenolic resin , 5 parts of copper powder, 10 parts of ...
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Abstract
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