High-temperature-resistant release ink

A technology with high temperature resistance and release type, which is applied in the field of ink, can solve the problems of ink peeling, achieve the effect of shortening the cycle, saving the amount of pigment, and good compatibility

Inactive Publication Date: 2020-02-07
惠州市韵点新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the high-temperature resistant ink on the market is a liquid adhesive with certain fluidity. After being stirred and mixed evenly, after printing and drying on the substrate, the printed matter can withstand a temperature of more than 200°C, which can protect the base ink and prevent adhesion. effect, but it is easy to peel off the ink with the mold film during molding

Method used

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  • High-temperature-resistant release ink

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Experimental program
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Effect test

Embodiment 1

[0017] A kind of high-temperature-resistant light-curable ink, comprising the following components in parts by weight: modified phenolic resin 10, polyurethane modified acrylic resin 35, talc powder 5, mica powder 7, nanometer barium sulfate 10, solvent 23, curing agent 7, Auxiliary agent 3, said auxiliary agent includes 1 part of leveling agent, 1 part of defoamer, and 1 part of dispersant.

[0018] Further, the solvent is isoamyl acetate.

[0019] Further, the curing agent is isophorone diisocyanate.

[0020] The invention provides a high-temperature-resistant release ink, which can solve the problems caused by the stickiness or dry cracking of the ink during high-temperature and high-pressure molding, which leads to the reduction of defects during release.

Embodiment 2

[0022] This embodiment provides a high temperature resistant release ink, which is characterized in that it includes the following components in parts by weight: resin 40, solvent 15, curing agent 5, auxiliary agent 3, and functional filler 12.

[0023] Further, the resin is polyurethane modified acrylic resin.

[0024] Further, the solvent is butanol.

[0025] Further, the curing agent is hexamethylenetetramine.

[0026] Further, the auxiliary agent includes 1 part of leveling agent, 1 part of defoamer, and 1 part of dispersant.

[0027] Further, the functional filler is nano barium sulfate.

Embodiment 3

[0029] This embodiment provides a high temperature resistant release ink, which is characterized in that it includes the following components in parts by weight: resin 58, solvent 27, curing agent 10, auxiliary agent 5, and functional filler 33.

[0030] Further, the resin is a modified phenolic resin.

[0031] Further, the solvent is dipropylene glycol dimethyl ether.

[0032] Further, the curing agent is isophorone diisocyanate.

[0033] Further, the auxiliary agent includes 1.5 parts of leveling agent, 1.5 parts of defoamer, and 2 parts of dispersant.

[0034] Further, the functional filler is a combination of mica powder and nano barium sulfate, including mica powder 8 and nano barium sulfate 15.

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Abstract

The invention provides high-temperature-resistant release ink. The high-temperature-resistant release ink is characterized by comprising the following components in parts by weight: 40 to 58 parts ofresin, 15 to 27 parts of solvent, 5 to 10 parts of curing agent, 3 to 5 parts of assistant and 12 to 33 parts of functional filler. The invention provides the ink which can resist to a high temperature and be easy to release in the forming process in the manufacture procedure of a mobile phone back cover. The high-temperature-resistant release ink can resist to a high temperature of over 300 DEG C, and is superior to existing similar products in the market.

Description

technical field [0001] The invention belongs to the technical field of inks, and in particular relates to a high-temperature-resistant release ink. Background technique [0002] At present, the high-temperature resistant ink on the market is a liquid adhesive with certain fluidity. After being stirred and mixed evenly, after printing and drying on the substrate, the printed matter can withstand a temperature of more than 200°C, which can protect the base ink and prevent adhesion. effect, but it is easy to peel off the ink with the mold film during molding. Contents of the invention [0003] In view of this, the purpose of the present invention is to provide an ink that can withstand high temperature and good release during the molding process of the mobile phone back cover. Its temperature resistance exceeds 300 ° C, which is better than similar products currently on the market. [0004] Technical scheme of the present invention is: [0005] A high temperature resist...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/103C09D11/107C09D11/10C09D11/03C09D11/033
CPCC09D11/103C09D11/107C09D11/10C09D11/03C09D11/033
Inventor 丁国晏周勋阳光国
Owner 惠州市韵点新材料科技股份有限公司
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