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A method of improving piezoelectric performance and mechanical performance of piezoelectric ceramics by grinding

A piezoelectric ceramic, mechanical performance technology, applied in the direction of grinding workpiece supports, grinding/polishing equipment, grinding machines, etc., can solve the problem of density, mechanical strength and piezoelectric performance reduction, affecting the mechanical performance of the driver, piezoelectric ceramic thickness limitation and other problems, to achieve the effect of improving fracture strength and fracture toughness, suitable for large-scale production and low cost

Active Publication Date: 2021-07-20
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, low-temperature sintering often needs to lower the sintering temperature to about 900°C, and the preparation cost is relatively high.
In addition, the tape-casting method reduces the density, mechanical strength and piezoelectric properties of the traditional tablet ceramics, which greatly affects the mechanical properties of the driver. Unavailable
Another commonly used mechanical method for processing piezoelectric ceramic sheets is mechanical cutting. The disadvantage is that the thickness of the cut piezoelectric ceramics is limited by the cutter. It is difficult to cut below 0.5mm with general equipment, and the scrap rate is high, which is difficult to be widely used and to promote
Grinding, as a commonly used finishing method in machining technology, is usually used to change the surface morphology and surface quality of workpiece materials. The stress generated during the grinding process is usually a side effect of it. Generally, it should be reduced or avoided as much as possible. , at present, there is no use of grinding stress in actual production

Method used

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  • A method of improving piezoelectric performance and mechanical performance of piezoelectric ceramics by grinding
  • A method of improving piezoelectric performance and mechanical performance of piezoelectric ceramics by grinding
  • A method of improving piezoelectric performance and mechanical performance of piezoelectric ceramics by grinding

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Effect test

Embodiment 1

[0031] A mechanical processing method for improving the piezoelectric performance of piezoelectric ceramic sheets. An ordinary grinder is used, a diamond grinding wheel is used, and lead-free piezoelectric ceramic potassium sodium niobate prepared by a traditional solid-state reaction method is used as the grinding object. The thickness of the piezoelectric ceramic is 2mm, including the following:

[0032] (1) First, use structural glue Loctite 315 to stick piezoelectric ceramics on a glass plate, and then fix the glass plate on the grinding machine workbench through the positioning block;

[0033] (2) Because the thickness of piezoelectric ceramics is 2mm, 300-mesh diamond is used, and the grinding depth is 0.3mm each time, and the ceramics are ground to 1mm;

[0034] (3) Select a 500-mesh diamond grinding wheel, and continue to grind the piezoelectric ceramics in a down-grinding manner, with a grinding depth of 0.1 mm each time, and grind the ceramics to 0.5 mm;

[0035] (4...

Embodiment 2

[0041] A mechanical processing method for improving the piezoelectric performance of piezoelectric ceramic sheets. An ordinary grinder is used, a diamond grinding wheel is used, and lead-free piezoelectric ceramic potassium sodium niobate prepared by a traditional solid-state reaction method is used as the grinding object. The thickness of the piezoelectric ceramic is 1.5mm, including the following:

[0042] (1) First, use structural glue Loctite 315 to stick piezoelectric ceramics on a glass plate, and then fix the glass plate on the grinding machine workbench through the positioning block;

[0043] (2) Because the thickness of piezoelectric ceramics is 1.5 mm, 350-mesh diamond is used, and the grinding depth is 0.3 mm each time, and the ceramics are ground to 1 mm;

[0044] (3) Select a 500-mesh diamond grinding wheel, and continue to grind the piezoelectric ceramics in a down-grinding manner, with a grinding depth of 0.2 mm each time, and grind the ceramics to 0.4 mm;

[0...

Embodiment 3

[0051] A mechanical processing method for improving the piezoelectric performance of piezoelectric ceramic sheets. An ordinary grinder is used, a diamond grinding wheel is used, and lead-free piezoelectric ceramic potassium sodium niobate prepared by a traditional solid-state reaction method is used as the grinding object. The thickness of the piezoelectric ceramic is 1.5mm, including the following:

[0052] (1) First, use structural glue Loctite 315 to stick piezoelectric ceramics on a glass plate, and then fix the glass plate on the grinding machine workbench through the positioning block;

[0053] (2) Because the thickness of piezoelectric ceramics is 1.5mm, 400-mesh diamond is used, and the grinding depth is 0.5mm each time, and the ceramics are ground to 1mm;

[0054] (3) Select a 500-mesh diamond grinding wheel, and continue to grind the piezoelectric ceramics in a down-grinding manner, with a grinding depth of 0.2 mm each time, and grind the ceramics to 0.3 mm;

[0055...

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Abstract

The invention belongs to the technical field of piezoelectric ceramic processing, and relates to a method for improving piezoelectric performance and mechanical performance of piezoelectric ceramics by grinding; Grinding with several grinding wheels; when the thickness of piezoelectric ceramics is greater than 1mm, use 300-400 mesh grinding wheels for grinding; when the thickness is 0.5-1mm, use 400-500 mesh grinding wheels for grinding; thickness is less than 0.5mm 500-600 mesh grinding wheels are used for grinding; after the grinding is completed, the piezoelectric ceramics are removed, boiled in water, rinsed with warm water, and dried to obtain the finished product, which is the piezoelectric ceramic sheet after grinding. The invention realizes the utilization of side effect grinding stress, utilizes the grinding stress to make piezoelectric ceramics change from tetragonal phase to orthorhombic phase, enhances ceramic piezoelectric performance, and simultaneously improves ceramic fracture strength, fracture toughness and ceramic compactness.

Description

technical field [0001] The invention belongs to the technical field of processing piezoelectric ceramics, and in particular relates to a method for improving piezoelectric performance and mechanical performance of piezoelectric ceramics by grinding. Background technique [0002] Piezoelectric ceramics are a class of functional ceramic materials that can convert mechanical energy and electrical energy into each other. The drivers or sensors made of them have the advantages of high control precision, fast response, good linearity, and low power consumption. Precision machining and many other fields have been more and more widely used. However, with the development of science and technology, single-layer piezoelectric ceramic devices have shortcomings such as high driving voltage and small displacement, which can no longer meet the needs of current mechanical and electronic components such as chipping, integration, and high performance. In order to overcome these shortcomings,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B19/22B24B1/00B24B41/06C04B41/88
CPCB24B1/00B24B19/22B24B41/06C04B41/009C04B41/5116C04B41/88C04B35/495
Inventor 张幼明王树林王凤秀杨帆徐锦霖陈彩凤
Owner JIANGSU UNIV