A method for stacking multilayer aluminum/copper composite boards with copper atoms deposited on the surface

A surface deposition and composite board technology, applied in chemical instruments and methods, manufacturing tools, layered products, etc., can solve the problems of uneven distribution of composite board interfaces, unsatisfactory mechanical properties, low interface bonding strength, etc., and achieve interface bonding Good, enhanced mechanical properties, improved interfacial bonding strength

Active Publication Date: 2021-12-24
LANZHOU UNIVERSITY OF TECHNOLOGY
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-layer aluminum / copper composite plate stacking method with copper atoms deposited on the surface, which solves the problems of uneven interface distribution, low interface bonding strength and unsatisfactory mechanical properties of the composite plate in the existing preparation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for stacking multilayer aluminum/copper composite boards with copper atoms deposited on the surface
  • A method for stacking multilayer aluminum/copper composite boards with copper atoms deposited on the surface
  • A method for stacking multilayer aluminum/copper composite boards with copper atoms deposited on the surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Take the original aluminum plate with a thickness of 1mm, wash it with acetone, remove the oxide film on the surface of the original aluminum plate with a stainless steel brush with a steel wire diameter of 0.2mm, and then use 800# sandpaper, 1000# sandpaper, and 2000# sandpaper to polish the surface of the original aluminum plate. Then clean it with ethanol aqueous solution in an ultrasonic cleaning machine, dry it, put the original aluminum plate after surface treatment into the electroplating solution, at room temperature, under the electric current 2A / dm 2 , Under the condition of voltage 1V, electroplating for 1h, such as figure 2 Shown; each liter of plating solution contains 20mL of H 2 SO 4 and 240g of CuSO 4 ·5H 2 O; Copper atoms are evenly deposited on the surface of the treated original aluminum plate by electroplating, see image 3 , to get a copper-plated aluminum plate; along the thickness of the 2mm aluminum plate to be rolled, use a stainless steel ...

Embodiment 2

[0031]Take the original aluminum plate with a thickness of 2mm, wash it with acetone, remove the oxide film on the surface of the original aluminum plate with a stainless steel brush with a steel wire diameter of 0.1mm, and then use 800# sandpaper, 1000# sandpaper, and 2000# sandpaper to polish the surface of the original aluminum plate. Then clean it with ethanol aqueous solution in an ultrasonic cleaning machine, dry it, put the original aluminum plate after surface treatment into the electroplating solution, at room temperature, under the electric current 2A / dm 2 , Under the condition of voltage 5V, electroplating for 8 minutes; each liter of electroplating solution contains 20mL of H 2 SO 4 and 240g of CuSO 4 ·5H 2 O; Copper atoms are uniformly deposited on the surface of the treated original aluminum plate by electroplating to obtain a copper-plated aluminum plate; the aluminum plate with a thickness of 1.5 mm is to be rolled along the direction to be rolled with a stai...

Embodiment 3

[0033] Take the original aluminum plate with a thickness of 1.5mm, wash it with acetone, and then use a stainless steel brush with a diameter of 0.15mm to remove the oxide film on the surface of the original aluminum plate, and then use 800# sandpaper, 1000# sandpaper, and 2000# sandpaper to polish the surface of the original aluminum plate , and then cleaned with ethanol aqueous solution in an ultrasonic cleaning machine, dried, and put the original aluminum plate after surface treatment into the electroplating solution, at room temperature, at a current of 2A / dm 2 , Under the condition of voltage 3V, electroplating for 30min; each liter of electroplating solution contains 20mL of H 2 SO 4 and 240g of CuSO 4 ·5H 2 0; Copper atoms are evenly deposited on the surface of the treated original aluminum plate by electroplating to obtain a copper-plated aluminum plate; along the aluminum plate with a thickness of 1 mm, the stainless steel brush with a steel wire diameter of 0.15 m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Tensile strengthaaaaaaaaaa
Tensile strengthaaaaaaaaaa
Tensile strengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a multi-layer aluminum / copper composite board stacking method for depositing copper atoms on the surface. Copper is electroplated on the surface of the original aluminum board to obtain a copper-coated aluminum board; The layer is an aluminum plate, forming a laminated plate, bundled and fixed, and evenly preheated; the first rolled aluminum plate-copper-coated aluminum composite plate is obtained by hot rolling; After the two plates are decontaminated, they are superimposed and bundled, and the process of cutting, lamination and rolling is repeated many times to obtain a multi-layer aluminum / copper composite board with copper atoms deposited on the surface. In the stacking method, the copper is evenly distributed in the aluminum matrix through multiple stacking and multiple rolling methods, the interface is well bonded, and the bonding strength of the aluminum-copper interface is improved, thereby enhancing the mechanical properties of the material.

Description

technical field [0001] The invention belongs to the technical field of metal composite material preparation, and relates to a multilayer aluminum / copper composite board stacking method for depositing copper atoms on the surface. Background technique [0002] As a commonly used material in industry and aerospace, aluminum has many outstanding characteristics, such as low metal density, light weight, good ductility, strong plasticity, and small elastic coefficient; copper has excellent ductility, thermal conductivity, and electrical conductivity. It is the most commonly used material for cables, electrical and electronic components; copper is also often used for electroplating. [0003] Electroplating copper on the surface of the aluminum plate can obtain a copper layer with strong adhesion and good uniformity combined atomically; the uniformity of the copper layer obtained by this method is beyond the reach of other methods, and the improvement of uniformity will further opti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B32B15/01B32B15/20B32B33/00C25D3/38C25D5/44B21B1/38B21B47/00
CPCB32B15/016B32B33/00C25D3/38C25D5/44B21B1/38B21B47/00B32B2250/05B32B2307/50B32B2311/24B21B2001/386
Inventor 张晓波冯佰刚张潇万雄斌张全鑫任军强
Owner LANZHOU UNIVERSITY OF TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap