Transparent photosensitive polyimide resin, polyimide film and preparation method of polyimide resin

A technology of photosensitive polyimide resin and polyimide resin, applied in the field of transparent photosensitive polyimide resin, polyimide film and preparation thereof, can solve the problem of non-recyclable, high cost, flexible circuit board manufacturing Complex process and other issues
CN110804181AActive Publication Date: 2020-02-18SUN YAT SEN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUN YAT SEN UNIV
Publication Date
2020-02-18

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Abstract

The invention relates to a transparent photosensitive polyimide resin, a polyimide film and a preparation method of the polyimide resin. The polyimide resin has a structure as shown in a formula (I) or formula (II) shown in the specification. The polyimide resin and the film have photosensitivity, can change color under the irradiation of ultraviolet rays, have the characteristics of intuitive visual observation of light-induced modification area, are soluble, can be recycled, are colorless and transparent, have good flexibility, and can be used to prepare circuit boards for flexible electronic devices. The surface pattern of the film can be metalized, and metal in a plating layer on the film can be recovered.
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Description

technical field

[0001] The invention belongs to the technical field of photosensitive resin materials, and in particular relates to a transparent photosensitive polyimide resin, a polyimide film and a preparation method thereof. Background technique

[0002] With the development of flexible electronics, microelectronic packaging, biochemical sensors and communication technology (5G) towards lightness, miniaturization and high frequency, the substrate material of the device is required to have flexibility, good heat resistance, low dielectric constant, Strong resistance to electromigration, low resistivity of metal plating wiring and other characteristics. Polyimide film has the characteristics of good flexibility, low dielectric constant, high mechanical strength, good bending resistance, high temperature resistance and strong electrical resistance. It is an ideal flexible substrate for electronic packaging and flexible electronic device substrate. It has been widely used i...

Claims

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