Graphic data high-speed transmission device of direct-writing photoetching equipment and transmission method thereof

A graphics data, high-speed transmission technology, used in microlithography exposure equipment, optical fiber transmission, opto-mechanical equipment, etc., can solve the problems of untimely graphics transmission, equipment capacity cannot be improved, etc., to improve the productivity per unit time, fast and accurate exposure. , the effect of improving the transmission rate

Pending Publication Date: 2020-02-21
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-speed transmission device and transmission method for graphic data of direct-writing lithography equipment, which can solve the problem in the prior art that the production capacity of equipment cannot be improved due to untimely transmission of graphics

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Graphic data high-speed transmission device of direct-writing photoetching equipment and transmission method thereof
  • Graphic data high-speed transmission device of direct-writing photoetching equipment and transmission method thereof
  • Graphic data high-speed transmission device of direct-writing photoetching equipment and transmission method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The present invention will be further described below in conjunction with accompanying drawing:

[0030] like figure 1 A high-speed graphic data transmission device for direct writing lithography equipment shown, including a graphic display device (DMD) 1, a data receiving and processing board 4 connected to the graphic display device (DMD) 1 through a rigid-flexible board 2, and a multi-mode The optical fiber 6 is connected to the data conversion board 8 connected to the data receiving and processing board 4 and the host computer 10 connected to the data conversion board 8 . DMD: DigitalMicromirror Device, digital micromirror device; a digital device composed of millions of small micromirrors.

[0031] Specifically, as figure 2 As shown, the data receiving and processing board 4 includes an FPGA chip one 15, a high-speed connector 3, an SFP+ optical module 17 and a QSFP+ optical module one 5. The FPGA chip-15 is connected to the high-speed connector 3, the SFP+ opt...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a graphic data high-speed transmission device of direct-writing photoetching equipment. The device comprises a graphic display device, a data receiving and processing board connected with the graphic display device through a rigid-flex board, a data conversion board connected with the data receiving and processing board through a multimode optical fiber, and a host connected with the data conversion board. The data receiving and processing board comprises a first FPGA chip, a high-speed connector, a DLP module, an SFP+ optical module and a first QSFP+ optical module, wherein the high-speed connector, the DLP module, the SFP+ optical module and the first QSFP+ optical module are connected with the first FPGA chip. The high-speed connector is connected with one end of the rigid-flex board. The data conversion board comprises a second FPGA chip, a second QSFP+ optical module and a PCI-E 3.0 X8 interface. The second FPGA chip is connected with the second QSFP+ optical module and the PCI-E 3.0 X8 interface. The first QSFP+ optical module is connected with the second QSFP+ optical module through a multimode optical fiber. According to the invention, the transmission rate of the graphic data of the direct-writing photoetching equipment can be effectively improved; rapid and accurate exposure of a graph is realized; and the unit time productivity of the direct-writing photoetching equipment is greatly improved.

Description

technical field [0001] The invention relates to the technical field of high-speed transmission of graphic data of direct-writing lithography equipment, in particular to a high-speed transmission device and method for graphic data of direct-writing lithography equipment. Background technique [0002] Laser direct writing lithography equipment is a key equipment in the production of IC (integrated circuit) and high-precision PCB (printed circuit board), in which high-speed transmission of graphic data has always been a key link in the improvement of equipment performance. After the user graphics are input into the lithography equipment, the user's original graphics need to be processed according to the extracted actual substrate parameters. A large amount of processed graphic data needs to be sent to a dedicated graphic display device (DMD) for display exposure in a short time. The speed of graphics sending directly restricts the speed of graphics exposure. [0003] With the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H04B10/25
CPCG03F7/70508
Inventor 刘扬
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products