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Macromolecular heat conduction composite material and preparation method thereof

A technology of thermally conductive composite materials and polymer materials, applied in the field of materials, can solve the problems of not increasing but decreasing thermal conductivity, easy formation of holes, and poor processability, etc., to promote close packing, dense internal structure and tight contact. Effect

Inactive Publication Date: 2020-03-06
TIANJIN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to obtain higher thermal conductivity, the filling amount of thermally conductive filler is usually very high, which often leads to high viscosity and poor fluidity when raw materials are mixed, it is not easy to mix fully, and holes are easily formed inside, poor processability, thermal conductivity The rate does not increase but decreases, etc.

Method used

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  • Macromolecular heat conduction composite material and preparation method thereof
  • Macromolecular heat conduction composite material and preparation method thereof
  • Macromolecular heat conduction composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Mix 10g of graphite (10000 mesh), 15g of simethicone oil (auxiliary, the same below), 10g of raw silicone rubber, and 1g of vulcanizing agent in a mortar, then transfer the mixture to a centrifuge tube, and centrifuge at 10000rpm for 30 Minutes, open the cover of the centrifuge tube, put it into a blast oven, vulcanize at 80°C for 1 hour, and vulcanize at 120°C for 2 hours to prepare a graphite / silicone rubber heat-conducting composite material.

[0048] figure 1 A digital photograph of a graphite / silicone thermally conductive composite in a centrifuge tube after vulcanization.

[0049] The above composite material was taken out from the centrifuge tube and sliced. figure 2 Digital photograph of a slice (thickness 2mm) of graphite / silicone rubber thermally conductive composite. It can be seen that the material is generally dense and has no obvious pores.

[0050] image 3 It is a scanning electron microscope picture of the cross-section of the graphite / silicone ru...

Embodiment 2

[0053] Mix 100g spherical alumina (average particle size 20 μm), 16g epoxy resin prepolymer and 4g curing agent in a beaker, then transfer the mixture to a centrifuge tube, centrifuge at 6000rpm for 20 minutes, and open the centrifuge tube cover , placed in a blast oven, vulcanized at 60°C for 2 hours, and vulcanized at 120°C for 2 hours to prepare an alumina / epoxy resin thermally conductive composite material.

[0054] Figure 4 It is a scanning electron microscope picture of the cross-section of the alumina / epoxy resin thermally conductive composite material, and it can be seen that the alumina particles form relatively close contacts in the epoxy resin.

[0055] The thermal conductivity of the alumina / epoxy resin thermally conductive composite was tested by the steady-state heat flow method, and it was 2.5W / mK.

Embodiment 3

[0057] Mix 5g spherical boron nitride (average particle size 18μm), 8g simethicone oil, 4.8g raw silicone rubber and 0.2g vulcanizing agent in a beaker, then transfer the mixture to a centrifuge tube and centrifuge at 10000rpm for 40 minutes , open the cover of the centrifuge tube, put it into a blast oven, vulcanize at 80°C for 1 hour, and vulcanize at 120°C for 2 hours to prepare a boron nitride / silicone rubber heat-conducting composite material. Take out and slice.

[0058] Figure 5 It is a digital photo of a slice (thickness 2mm) of the above-mentioned boron nitride / silicone rubber heat-conducting composite material.

[0059] The thermal conductivity of the above-mentioned boron nitride / silicone rubber thermal conductive composite material was tested by a steady-state heat flow method, and it was 4.5 W / mK. In contrast, the thermal conductivity of the boron nitride / silicone rubber thermally conductive composite obtained from the mixture without centrifugation was 2.5 W / m...

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Abstract

The invention relates to a macromolecular heat conduction composite material and a preparation method thereof. The macromolecular heat conduction composite material consists of heat conduction fillers, macromolecular materials and additives. The preparation method for the macromolecular heat conduction composite material comprises the following steps of: evenly mixing the heat conduction fillers,the raw materials of the macromolecular materials and the additives to form a mixture; through "centrifugal force" generated by a centrifugation device, enabling the heat conduction fillers to form tight accumulation in the mixture; carrying out aggregation or drying on the mixture to obtain the macromolecular heat conduction composite material; and carrying out further segmentation or processingto obtain a required shape and size. The invention can be applied to fields, including heat conduction, heat emission, thermal interface materials, heat management and the like.

Description

technical field [0001] The invention relates to the field of materials, in particular to a polymer heat-conducting composite material and a preparation method thereof. [0002] technical background [0003] With the development of electronics, information, energy and other industries, the integration of chips, integrated circuits, communication equipment, radio frequency devices, mobile phones, batteries and other products is getting higher and higher. important factor. [0004] In addition to being related to the heat-generating device (heat source) and the radiator itself, heat dissipation is also significantly affected by the contact state between the device and the radiator. The surface of the heating element and the heat sink has a certain roughness, and there are a lot of gaps between the surfaces when the two are in contact, which are filled with air. Air is a poor conductor of heat, with a thermal conductivity of only about 0.02W / mK, resulting in a large interface t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K3/04C08L63/00C08K7/18C08L25/06C08F112/08C08K3/08C08L29/04C08L67/04C08K7/24
CPCC08F112/08C08K3/08C08K7/06C08K7/18C08K2003/085C08K2003/385C08K2201/003C08L83/04C08L2205/025C08K3/041C08K3/042C08K3/04C08L63/00C08K3/38C08L25/06C08L29/04C08L67/04C08K7/24
Inventor 包晨露张松迪袁涛俞康康刘建平
Owner TIANJIN POLYTECHNIC UNIV
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