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Cerium oxide polishing liquid and its preparation method and application

A technology of polishing liquid and cerium oxide, applied in the field of polishing liquid, can solve the problems such as hindering the uniform and effective contact between cerium oxide and glass substrate, reducing polishing efficiency, etc., so as to enhance hardness and mechanical properties, improve polishing efficiency and utilization rate high effect

Active Publication Date: 2021-10-22
HUIZHOU BYD IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] (2) Severe foaming: During the use of the current polishing liquid, due to the debris mixed with the substrate and abrasives, the organic or inorganic macromolecular additives added to the polishing liquid, and the friction generated during the polishing process The high heat causes more foam to be generated during the recycling of the polishing liquid, which seriously hinders the uniform and effective contact between the cerium oxide and the glass substrate, greatly reducing the polishing efficiency

Method used

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  • Cerium oxide polishing liquid and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] This example is to illustrate the cerium oxide polishing solution prepared by the preparation method of the present invention.

[0062] (1) Each component and weight percentage

[0063] Abrasive: particle size D 50 = 1.0 μm, D 100 = 8.6 μm;

[0064] 360 parts by weight of cerium oxide; 150 parts by weight of lanthanum oxide; 30 parts by weight of lanthanum fluoride; 28 parts by weight of lanthanum oxyfluoride; 32 parts by weight of titanium oxide;

[0065] Dispersant:

[0066] 38 parts by weight of allyl polyoxyethylene ether; 18 parts by weight of triethylhexyl phosphoric acid; 8 parts by weight of vinylbisstearamide; 6 parts by weight of sodium styrene sulfonate;

[0067] Defoamer:

[0068] 8 parts by weight of polyoxyethylene polyoxypropylene alcohol amine ether; 6 parts by weight of polyether dimethyl siloxane copolymer;

[0069] Water: 2400 parts by weight.

[0070] (2) Preparation method

[0071] ①Prepare 2400 parts of water, stir with a 1500r / min high-spe...

Embodiment 2

[0075] This example is to illustrate the cerium oxide polishing solution prepared by the preparation method of the present invention.

[0076] (1) Each component and weight percentage

[0077] Abrasive: particle size D 50 = 1.6 μm, D 100 = 9.4 μm;

[0078] 320 parts by weight of cerium oxide; 170 parts by weight of lanthanum oxide; 40 parts by weight of lanthanum fluoride; 32 parts by weight of lanthanum oxyfluoride; 38 parts by weight of titanium oxide;

[0079] Dispersant:

[0080] 38 parts by weight of polyoxyethylene octylphenol ether; 18 parts by weight of triethylhexyl phosphoric acid; 8 parts by weight of vinylbisstearamide; 6 parts by weight of sodium styrene sulfonate.

[0081] Defoamer:

[0082] 10 parts by weight of polyoxyethylene polyoxypropylene alcohol amine ether; 8 parts by weight of polyether dimethyl siloxane copolymer;

[0083] Water: 2400 parts by weight.

[0084] (2) Preparation method

[0085] ①Prepare 2400 parts of water, stir with a 1500r / min hig...

Embodiment 3

[0089] This example is to illustrate the cerium oxide polishing solution prepared by the preparation method of the present invention.

[0090] (1) Each component and weight percentage

[0091] Abrasive: particle size D 50 = 1.0 μm, D 100 = 5.4 μm;

[0092] 310 parts by weight of cerium oxide; 182 parts by weight of lanthanum oxide; 22 parts by weight of lanthanum fluoride; 42 parts by weight of lanthanum oxyfluoride; 44 parts by weight of titanium oxide;

[0093] Dispersant:

[0094] 20 parts by weight of allyl polyoxyethylene ether; 20 parts by weight of polyoxyethylene octylphenol ether; 16 parts by weight of triethylhexyl phosphoric acid; 10 parts by weight of vinylbisstearamide; 8 parts by weight of sodium styrene sulfonate;

[0095] Defoamer:

[0096] 6 parts by weight of polyoxyethylene polyoxypropylene alcohol amine ether; 12 parts by weight of polyether dimethyl siloxane copolymer;

[0097] Water: 2400 parts by weight.

[0098] (2) Preparation method

[0099] ①...

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Abstract

The invention relates to the technical field of polishing liquid, and discloses a cerium oxide polishing liquid, a preparation method and application thereof. Wherein, the polishing liquid contains abrasive, dispersant, defoamer and water, wherein the abrasive is a mixture of cerium oxide, lanthanum oxide, lanthanum fluoride, lanthanum oxyfluoride and titanium oxide; the dispersant is allyl poly A mixture of oxyethylene ether and / or polyoxyethylene octylphenol ether and triethylhexyl phosphoric acid, vinyl bisstearamide, sodium styrene sulfonate; the defoamer is polyoxyethylene polyoxypropylene alcohol amine ether and poly Ether Dimethicone Copolymer. The polishing liquid is applied to the glass surface for polishing, and has high polishing efficiency, strong dispersion ability, good long-lasting defoaming effect and long-term defoaming effect.

Description

technical field [0001] The invention relates to the technical field of polishing liquid, in particular to a cerium oxide polishing liquid and its preparation method and application. Background technique [0002] At present, chemical mechanical polishing (CMP) technology is recognized as the only global planarization technology, which is widely used in the manufacture of advanced electronic products such as integrated circuit silicon wafers and optical glass. The chemical mechanical polishing fluid is a key element in CMP. At present, the excellent chemical mechanical polishing fluid mainly depends on imports, which seriously limits the development of precision machining technology in China. Chemical-mechanical polishing liquid is a research hotspot in China. The current production method is mainly to uniformly mix polishing powder and a certain proportion of additives by chemical dispersion or mechanical dispersion or a combination of chemical and mechanical methods. [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 游容曹昆鹏段水亮
Owner HUIZHOU BYD IND
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