A multi-point laser shock forming device and forming method
A shock forming and multi-point laser technology, which is applied in the field of laser shock forming, can solve the problems of forming accuracy, complicated processing technology, and low processing efficiency, and achieve the effects of large processing flexibility, high surface quality, and high processing quality
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no. 1 example
[0042] first embodiment ,refer to figure 1 , an example of a multi-point laser shock forming device designed by the present invention, including: including: a laser control system 1, a laser group 2, a workpiece clamping system 4, a workbench 8, and a workbench control system 9.
[0043] Wherein, the laser group 2 is composed of several independent single pulse lasers, and each pulse laser is independently controlled by the laser control system 1, so that each pulse laser can emit laser beams 3 with the same or different parameters at the same time; The laser heads of each pulse laser are on the same plane and are arranged in an array, the workpiece clamping system 4 is used to fix the workpiece to be processed, and the workpiece can accept the impact of the laser beam 3 of the laser group 2; the work The table 8 is used to carry the workpiece to be processed, and the workpiece clamping system is fixed on the workbench. The workbench can move in X, Y, and Z directions under ...
no. 2 example
[0045] second embodiment ,refer to figure 2 , a thin plate profiling process, comprising the steps of:
[0046] (1) Set the plate 7 to be processed as a pure copper plate with a thickness of 0.1mm, use black paint for the energy absorbing layer 6, and use K9 glass for the constraining layer 5, and clamp and fix it on the workbench 8 with the workpiece clamping system in sequence; A profiling die 10 with vent holes 11 is installed under the plate, and the profiling die 10 is clamped and fixed on the workbench 8;
[0047] (2) First turn on the YAG pulse lasers directly above the area to be formed in the laser group 2 (that is, directly above the mouth of the cavity of the profiling die 10), and the output power of each laser is 400mJ, and perform multi-pulse impact.
[0048] When the plate is about to touch the bottom of the die, simultaneously turn on the YAG pulsed laser above the forming area, and the output power of each laser is 500mJ. The emission angles of these lase...
no. 3 example
[0050] third embodiment ,refer to image 3 , a thin plate dieless forming, comprising the steps of:
[0051] (1) Clamp and fix the plate 7 to be processed, the energy absorbing layer 6 and the constraining layer 5 on the workbench 8 in sequence with the workpiece clamping system; the plate 7 is made of pure copper plate with a thickness of 0.2mm, and the energy absorbing layer 6 is made of black Paint, constraining layer 5 uses K9 glass.
[0052] (2) The laser participating in the processing in the laser group 2 is selected as a YAG pulsed laser with a maximum output power of 700mJ. Considering the maximum depth to be formed of the plate 7 as h, the forming depth of the i-th deformation point is h(i), and the forming depth of the j-th deformation point is h(j). Set the laser parameters of each point laser in the laser control system 1. If the number of pulses required at the forming depth h is n, then the number of pulses at i is set to n times h(i) / h and rounded. When th...
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Abstract
Description
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