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A multi-point laser shock forming device and forming method

A shock forming and multi-point laser technology, which is applied in the field of laser shock forming, can solve the problems of forming accuracy, complicated processing technology, and low processing efficiency, and achieve the effects of large processing flexibility, high surface quality, and high processing quality

Active Publication Date: 2021-01-15
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the inventors found that although this method can efficiently achieve plastic deformation and local fine deformation of materials, the point-by-point impact method is too inefficient for large-area forming.
Moreover, since the laser energy usually has a Gaussian distribution, it still has a radiation effect on the material at the periphery of the light spot. The hardening of the material caused by the previous impact is likely to affect the forming effect of the second impact, and the shape changes such as bending of the plate caused by the impact are also increased. The difficulty of secondary impact is increased. For workpieces with complex shapes, the processing technology is cumbersome and the forming accuracy is also affected.

Method used

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  • A multi-point laser shock forming device and forming method
  • A multi-point laser shock forming device and forming method
  • A multi-point laser shock forming device and forming method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0042] first embodiment ,refer to figure 1 , an example of a multi-point laser shock forming device designed by the present invention, including: including: a laser control system 1, a laser group 2, a workpiece clamping system 4, a workbench 8, and a workbench control system 9.

[0043] Wherein, the laser group 2 is composed of several independent single pulse lasers, and each pulse laser is independently controlled by the laser control system 1, so that each pulse laser can emit laser beams 3 with the same or different parameters at the same time; The laser heads of each pulse laser are on the same plane and are arranged in an array, the workpiece clamping system 4 is used to fix the workpiece to be processed, and the workpiece can accept the impact of the laser beam 3 of the laser group 2; the work The table 8 is used to carry the workpiece to be processed, and the workpiece clamping system is fixed on the workbench. The workbench can move in X, Y, and Z directions under ...

no. 2 example

[0045] second embodiment ,refer to figure 2 , a thin plate profiling process, comprising the steps of:

[0046] (1) Set the plate 7 to be processed as a pure copper plate with a thickness of 0.1mm, use black paint for the energy absorbing layer 6, and use K9 glass for the constraining layer 5, and clamp and fix it on the workbench 8 with the workpiece clamping system in sequence; A profiling die 10 with vent holes 11 is installed under the plate, and the profiling die 10 is clamped and fixed on the workbench 8;

[0047] (2) First turn on the YAG pulse lasers directly above the area to be formed in the laser group 2 (that is, directly above the mouth of the cavity of the profiling die 10), and the output power of each laser is 400mJ, and perform multi-pulse impact.

[0048] When the plate is about to touch the bottom of the die, simultaneously turn on the YAG pulsed laser above the forming area, and the output power of each laser is 500mJ. The emission angles of these lase...

no. 3 example

[0050] third embodiment ,refer to image 3 , a thin plate dieless forming, comprising the steps of:

[0051] (1) Clamp and fix the plate 7 to be processed, the energy absorbing layer 6 and the constraining layer 5 on the workbench 8 in sequence with the workpiece clamping system; the plate 7 is made of pure copper plate with a thickness of 0.2mm, and the energy absorbing layer 6 is made of black Paint, constraining layer 5 uses K9 glass.

[0052] (2) The laser participating in the processing in the laser group 2 is selected as a YAG pulsed laser with a maximum output power of 700mJ. Considering the maximum depth to be formed of the plate 7 as h, the forming depth of the i-th deformation point is h(i), and the forming depth of the j-th deformation point is h(j). Set the laser parameters of each point laser in the laser control system 1. If the number of pulses required at the forming depth h is n, then the number of pulses at i is set to n times h(i) / h and rounded. When th...

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Abstract

The invention relates to the technical field of laser shock forming, in particular to a multi-point laser shock forming device and method. According to the structure of the multi-point laser shock forming device, a laser device group is composed of a plurality of independent single pulse laser devices, each pulse laser device is independently controlled by a laser device control system, and the pulse laser devices can send laser beams with same or different parameters at the same time; the pulse laser devices are arranged in the two-dimension plane, a workpiece clamping system is used for fixing a workpiece, and the workpiece can receive laser shocks; and a workbench is used for bearing a to-be-machined workpiece. According to the provided multi-point laser forming technology, the multiplelaser devices are integrated for simultaneous operation, the principle of the forming effect is decided through laser parameters, the individual laser devices generate local deformation at corresponding acting sites, parallel stacking is conducted, then, integral panel forming can be achieved, and local bulging, bending, panel veneer leveling, profiling and other forming machining of metal materials, inorganic materials, high molecular materials, composite materials and the like can be achieved.

Description

technical field [0001] The invention relates to the technical field of laser shock forming, in particular to a multi-point laser shock forming device and a forming method. Background technique [0002] The information disclosed in the Background of the Invention is only intended to increase the understanding of the general background of the invention, and is not necessarily to be taken as an acknowledgment or any form of suggestion that the information constitutes the prior art that is already known to those skilled in the art. [0003] Plastic forming of sheet metal plays an important role in the automotive industry, aerospace and other fields. At present, the commonly used metal sheet forming method at home and abroad is stamping forming, which realizes the precise forming of the sheet through the cooperation of the punch movement and the mold, but it has the disadvantages of high mold cost, long production cycle, low efficiency, and limited processing materials. [0004]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D31/00
CPCB21D31/00
Inventor 季忠丁可心卢国鑫刘韧
Owner SHANDONG UNIV
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