Target material assembly forming method

A target and component technology, which is applied in the direction of welding/cutting medium/material, welding medium, manufacturing tools, etc., can solve the problem that the welding strength of target components needs to be improved, and achieve small differences in thermal expansion coefficients, reduce thermal stress, and enhance bonding The effect of intensity

Inactive Publication Date: 2020-03-31
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology

[0005] However, the welding strength of the target asse

Method used

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  • Target material assembly forming method

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Embodiment Construction

[0025] It can be seen from the background art that the welding strength of the target assembly manufactured in the prior art needs to be improved.

[0026] The analysis is now combined with a method for forming a target assembly. The process steps of forming a target assembly mainly include: providing a ceramic target, the ceramic target has a target welding surface; providing a metal back plate, and the metal back plate has a back plate welding surface; brazing material is placed on the target welding surface and the back plate welding surface, and the ceramic target and the metal back plate are welded to form a target assembly.

[0027] The welding strength of the target assembly prepared by the above method for forming the target assembly is poor. After analysis, it is found that the reasons for the poor welding strength of the target assembly include: On the one hand, during the welding process of the ceramic target and the metal back plate In this case, the wetting and sp...

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Abstract

The invention relates to a target material assembly forming method, which comprises: providing a ceramic target material, wherein the ceramic target material is provided with a target material weldingsurface; providing a metal back plate, wherein the metal back plate is provided with a back plate welding surface; plating nickel on the welding surface of the target material to form a nickel plating layer; placing a solder on the surface of the nickel plating layer and the welding surface of the back plate, and welding the ceramic target material and the metal back plate to form the target material assembly. According to the invention, the welding strength between the ceramic target material and the metal back plate can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for forming a target component. Background technique [0002] Sputtering coating is one of the processes for preparing thin films by physical vapor deposition. Specifically, it refers to the use of high-energy particles to bombard the surface of the target, so that the atoms or molecules of the target obtain enough energy to escape and deposit on the surface of the substrate or workpiece, thereby forming film. [0003] According to different materials, targets can be divided into: metal targets, alloy targets and ceramic targets. Among them, ceramic targets can be divided into ceramic targets such as oxides, silicides, carbides, and sulfides according to different chemical compositions. Thin films prepared by ceramic targets are widely used in the field of electronics and information industry, such as integrated circuits, electronic control devices,...

Claims

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Application Information

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IPC IPC(8): C04B37/02B23K35/26
CPCC04B37/026B23K35/26
Inventor 姚力军潘杰王学泽罗明浩占卫君
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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