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Optical transceiver assembly based on silicon light

A technology of optical transceiver components and silicon photonics, which is applied in electromagnetic transceivers, electrical components, electromagnetic wave transmission systems, etc., can solve problems such as laser performance degradation, achieve simplified size and quantity, and achieve good photoelectric performance

Inactive Publication Date: 2020-04-07
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In high-temperature application scenarios, the extinction ratio, chirp, and spectral width of the laser must have good specifications in a wider temperature range. The combination of a silicon photonic chip and a continuous light source in the solution can solve the problem of directly adjusting the laser under high temperature conditions. The problem of degraded performance

Method used

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  • Optical transceiver assembly based on silicon light
  • Optical transceiver assembly based on silicon light
  • Optical transceiver assembly based on silicon light

Examples

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Embodiment 1

[0051] Embodiment 1 of the present invention provides an optical transceiver component based on silicon photonics, such as figure 1 As shown, the optical transceiver component includes a silicon optical chip component 1 and an electrical chip component 2, specifically:

[0052] The silicon photonics chip component 1 includes a silicon photonics chip step 101, a silicon photonic modulator 102, a first detector 103 and a laser driving unit 104; wherein the silicon photonic modulator 102, the first detector 103 and the laser driving unit 104 is fabricated on the silicon photonic chip by semiconductor processing; the improvement of the present invention lies in the matching of corresponding units and components on the silicon photonic element 1 and the electrical chip element 2, and the step 101 of the silicon photonic chip The silicon optical modulator 102 , the first detector 103 and the laser driving unit 104 can be manufactured using a mature semiconductor processing technolog...

Embodiment 2

[0084] Embodiment 2 of the present invention also provides a silicon photonics-based optical transceiver component. Compared with embodiment 1, in the embodiment of the present invention, a processing unit 110 is further introduced into the silicon photonics chip component 1, such as Figure 7 As shown, the optical transceiver component includes a silicon photonic chip component 1 and an electrical chip component 2, specifically: an optical transceiver component based on silicon photonics, which is characterized in that the optical transceiver component includes a silicon photonic chip component 1 and an electrical chip component 2. Specifically:

[0085] The silicon photonics chip component 1 includes a silicon photonics chip step 101, a silicon photonic modulator 102, a first detector 103, a laser drive unit 104, and a processing unit 110; wherein, the silicon photonic modulator 102, the first detector 103 and the laser drive unit 104 are fabricated on the silicon photonics ...

Embodiment 3

[0094] The embodiment of the present invention is based on the transceiving component introduced in Embodiment 1 (similarly, it can also be converted to realize Embodiment 2, which is not specifically developed in the embodiment of the present invention), and its implementation process is demonstrated in combination with a specific scene. In the embodiment of the present invention, the packaging form of COB is used to realize the packaging of optical transceiver components based on silicon photonics technology. Figure 11 It is a top view of the package structure of the embodiment of the present invention, Figure 10 It is a schematic diagram of silicon-optical chip coupling packaging of the present invention, and the specific steps are as follows:

[0095] In step 301, the substrate 6 is fixed on the opening area of ​​the circuit board 7, and the electric chip component 2 is mounted and fixed on the patch pad of the circuit board 7. During the mounting process of the electric...

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Abstract

The invention relates to the technical field of silicon light, and provides an optical transceiver assembly based on silicon light. The optical transceiver assembly comprises a silicon optical chip element and an electric chip element, and specifically, the silicon optical chip element comprises a silicon optical chip step, a silicon optical modulator, a first detector and a laser driving unit; wherein the silicon optical modulator, the first detector and the laser driving unit are manufactured on the silicon optical chip in a semiconductor processing mode; the electric chip element comprisesa microprocessor, a modulator driving unit, a trans-impedance amplifier and a clock data recovery unit; wherein the microprocessor, the modulator driving unit, the transimpedance amplifier and the clock data recovery unit are integrated on a single electric chip and are arranged on a PCB (Printed Circuit Board). The silicon optical chip modulator and the detector achieve modulation and detection of optical signals respectively, the electric chip integrates functions of a plurality of electronic elements such as TIA, LA, CDR and MZM DRIVER, and the size and the number of packaging parts are simplified.

Description

【Technical field】 [0001] The invention relates to the field of silicon photonics technology, in particular to a silicon photonics-based optical transceiver component. 【Background technique】 [0002] With the explosive development of industries such as ultra-high-definition video, mobile Internet, and data centers, there are higher requirements for network speed, low latency, and large capacity. These services, such as autonomous driving and the Internet of Everything, have become important driving forces for the development of 5G. The network rate upgrade of applications such as Ethernet servers, switches, and wireless fronthaul is the general trend. The port rate upgrade from 10Gbit / s to 25Gbit / s, 100Gbit / s or higher has become an industry development trend and necessity. [0003] According to the modulation method of the laser, the optical transceiver module is divided into two types: direct modulation and indirect modulation. Most optical modules are direct modulation s...

Claims

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Application Information

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IPC IPC(8): H04B10/40H04B10/516
CPCH04B10/40H04B10/516
Inventor 杜巍宋琼辉许胜兰
Owner WUHAN TELECOMM DEVICES
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