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Packaging method for improving image effect and semiconductor device

An encapsulation method and technology for image effects, applied in semiconductor devices, electrical solid-state devices, electrical components, etc., can solve the problems affecting image sensor imaging, difficult to clean, particle falling, etc., to avoid scratches and improve image effects.

Pending Publication Date: 2020-04-14
HUATIAN TECH KUNSHAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, after the image sensor wafer is debonded, during wafer cutting or chip transportation, the photosensitive area of ​​the product is easily scratched. In addition, there will be particles that land on the photosensitive area and are difficult to clean, which affects the imaging of the image sensor.

Method used

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  • Packaging method for improving image effect and semiconductor device
  • Packaging method for improving image effect and semiconductor device
  • Packaging method for improving image effect and semiconductor device

Examples

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Effect test

Embodiment 1

[0046] In this embodiment, a protective layer is provided on the side of the wafer having the photosensitive region before bonding.

[0047] Such as figure 1 As shown, the packaging method for improving the image effect of the embodiment of the present invention includes:

[0048] A first protection layer is provided on the side of the wafer with the photosensitive area. Specifically, the first protective layer is a transparent adhesive layer formed by coating with a transmittance of 99% or more, or the first protective layer is an adhesive layer suitable for elution formed by coating.

[0049] When the transparent adhesive layer with a transmittance of more than 99% is used as the first protective layer, it does not need to be removed before the assembly of the subsequent semiconductor device. However, when the adhesive layer suitable for elution is used as the first protective layer, the first protective layer needs to be washed off with a solvent before the semiconductor ...

Embodiment 2

[0059] In this embodiment, a protective layer is provided on the side of the wafer having the photosensitive region after debonding.

[0060] Such as figure 2 As shown, the packaging method for improving the image effect of the embodiment of the present invention includes:

[0061] Bonding the first protective layer on the side of the wafer with the photosensitive area. Specifically, the first protective layer is a glass slide.

[0062] On the other side of the wafer, wires and solder balls are placed. Specifically, this step includes:

[0063] The other side of the wafer is thinned by grinding or dry etching, and a passivation layer is made on the thinned side by photolithography or chemical vapor deposition;

[0064] Opening the corresponding area of ​​the passivation layer by etching through the oxide layer, exposing the pad below the passivation layer;

[0065] Arrange the circuit layer connected to the pad by combining physical vapor deposition, electroplating / elect...

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Abstract

The invention provides a packaging method for improving an image effect and a semiconductor device, and the method comprises the steps: setting a first protection layer on one side, with a photosensitive region, of a wafer; arranging a second protection layer bonded on the first protection layer on one surface of the wafer, which is provided with the photosensitive area; performing wiring on the other surface of the wafer, and arranging solder balls; de-bonding the second protection layer; and cutting to form a single semiconductor device. In the packaging process, the protection layer is arranged on the face, provided with the photosensitive area, of the wafer to protect the photosensitive area, the photosensitive area is prevented from being scratched or polluted by pollutants such as dust in the cutting or transporting process, and the image effect of the device can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a packaging method for improving image effects and a semiconductor device. Background technique [0002] In the traditional wafer-level chip packaging method for image sensors, the image sensor wafer is bonded to the glass cavity, and the pads of the wafer are opened through the through-holes on the back of the silicon, and then the wiring is re-connected to the pads, and then cut into individual chip. The photosensitive area of ​​this type of image sensor chip needs to pass through the glass layer, which will cause a lot of light loss. The glass is temporarily bonded to the wafer, and after the wafer is packaged, the glass is debonded, and then the wafer is cut into individual chips, which can effectively reduce the optical loss of the image sensor chip. [0003] However, after the image sensor wafer is debonded, the photosensitive area of ​​the product is easily scratc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14687H01L27/1462H01L27/14632
Inventor 马书英刘轶郑凤霞万石保李丰
Owner HUATIAN TECH KUNSHAN ELECTRONICS