High-heat-resistance bismaleimide resin as well as preparation method and application thereof

A technology of maleimide resin and bismaleimide, which is applied in the direction of organic chemistry, can solve the problems of heat resistance decline, and achieve the effects of improving brittleness, easy operation, and simple preparation process

Inactive Publication Date: 2020-04-17
艾蒙特成都新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thereby provide a kind of high heat-resistant bismaleimide resin that can be used directly without modification treatment, and the preparation method and application of this high heat-resistant bismaleimide resin; Bismaleimide of the present invention The resin bridging group has active functional groups, which can directly react with epoxy resin to form an interpenetrating network structure similar to bismaleimide resin, epoxy resin and diallyl bisphenol A or diamine system, It can simplify the use process of BMI, improve the technical problems of BMI brittleness and the decrease of heat resistance after BMI modification, and has excellent comprehensive performance and processing performance

Method used

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  • High-heat-resistance bismaleimide resin as well as preparation method and application thereof
  • High-heat-resistance bismaleimide resin as well as preparation method and application thereof
  • High-heat-resistance bismaleimide resin as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation of high heat-resistant bismaleimide resin, implementation steps are:

[0022] Add 0.1mol hydroxyaromatic amine and 100ml solvent into reactor A equipped with stirrer, thermometer, reflux condenser and constant pressure dropping funnel, stir and dissolve; put 0.22~0.3mol maleic anhydride in vessel B Dissolve in 100-150ml of solvent, and configure it as a maleic anhydride solution; drop the dissolved maleic anhydride solution into the reactor through a constant-pressure dropping funnel at a rate of 1-2ml / min in a water bath In A, continue to stir for 2-3 hours after the dropwise addition; then add 0.25-0.38mol acetic anhydride, 0.0001-0.001mol catalyst, heat up to 60°C-65°C, react for 3-4h, cool down, use a large amount of tap water to precipitate, The high heat-resistant bismaleimide resins of Examples 1-1 to 1-4 were obtained by filtration, washing and recrystallization.

[0023] Wherein the hydroxy aromatic amine is 3,3'-dihydroxy-4,4'-diaminodiphenylm...

Embodiment 2

[0028] The preparation of high heat-resistant laminates, the implementation steps are:

[0029] (1) 75-134 parts by mass of high heat-resistant bismaleimide resin, 100 parts by mass of epoxy resin, 0-20 parts by mass of curing agent, 0.3-0.8 parts by mass of curing accelerator, 18-94 parts by mass of inorganic The filler is uniformly mixed with an appropriate amount of solvent to make a resin composition with a solid content of 60% to 70%. Use 1080E glass fiber cloth to control the resin content to 68%, and bake it at 130°C to 170°C for 1 to 10 minutes to make a prepreg;

[0030] (2) Use 10 prepregs and attach copper foil on both sides, place them in a vacuum hot press, increase the temperature from room temperature to 170°C at a rate of 3°C / min, and press from 0.5MPa to 0.1MPa / 1min Increase the speed to 4MPa, evacuate to within 50torr, keep pressing for 2h, then raise the temperature to 200°C for 2h, then heat up to 250°C for 2h, release the pressure and cool naturally to 150...

Embodiment 3

[0084] A kind of high heat-resistant bismaleimide resin, this high heat-resistant bismaleimide resin has the general chemical structure formula shown in (I):

[0085]

[0086] In formula (I): R is-SO 2 -, -CH 2 -, -O-, -C(CH 3 ) 2 - Any one of the above, the high heat-resistant bismaleimide resin is a light yellow powder, with a melting range of 162°C to 253°C and an acid value of 0.3 to 0.7mgKOH / g.

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Abstract

The invention discloses high-heat-resistance bismaleimide resin represented by a formula (I), as well as a preparation method and application thereof. The preparation method of the high-heat-resistance bismaleimide resin comprises the steps: adding 0.1 mol of hydroxyl aromatic diamine and 100 ml of a solvent into a reactor A, and stirring for dissolving; dissolving 0.22-0.3 mol of maleic anhydridein 100-150 ml of a solvent in a container B to prepare a maleic anhydride solution; dropwise adding the maleic anhydride solution into the reactor A under a water bath condition, and stirring for 2-3h after dropwise adding is finished; then adding 0.25-0.38 mol of acetic anhydride and 0.0001-0.001 mol of a catalyst, heating to 60 DEG C-65 DEG C, reacting for 3-4 h, cooling, precipitating with water, filtering, washing and recrystallizing to obtain the high-heat-resistance bismaleimide resin. The high-heat-resistance bismaleimide resin disclosed by the invention is suitable for preparing laminated boards for high-heat-resistance electronics and electrical appliances, and is high in practicability.

Description

technical field [0001] The invention belongs to the preparation and application of maleimide resin, in particular to a high heat-resistant bismaleimide resin, a preparation method and application. The high heat-resistant bismaleimide resin (specifically, the phenylhydroxy ortho-bismaleimide resin) of the present invention is suitable for the preparation of high heat-resistant electronic and electrical laminates. Background technique [0002] Thin and portable, multi-functional, high-performance and high-reliability are the directions for the continuous development of electronic complete machine products. Increased components, reduced volume, reduced weight, and improved integration have great impact on printed circuit board substrates carrying electronic components. The material also puts forward higher requirements for high heat resistance, excellent dielectric properties, low water absorption, and good processability, so as to adapt to the development of electronic signal ...

Claims

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Application Information

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IPC IPC(8): C07D207/452C08G73/12C08L63/00C08L79/08
CPCC07D207/452C08G73/12C08L63/00C08L79/08C08L2201/08C08L2203/20
Inventor 邹静易强周友陈立兴宋贤锋
Owner 艾蒙特成都新材料科技有限公司
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