Multistage coupling gate tunneling field effect transistor and manufacturing method thereof
A technology of tunneling field effect and coupled gate, which is applied in the field of microelectronics, can solve problems such as device performance degradation, bipolar off-state leakage, and reliability degradation, so as to reduce device power consumption, increase switching speed, and improve reliability. Effect
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Embodiment 1
[0050] Example 1: Manufacturing a multi-level coupled gate tunneling field effect transistor with one suspended plate and a suspended plate width of 1 nm
[0051] Step 1. Select silicon semiconductor material as substrate 1, such as image 3 a.
[0052] Step 2. Fabricate the body region 2 on the silicon substrate 1, such as image 3 b.
[0053] Using the molecular beam epitaxy technique on the silicon substrate 1, the epitaxy thickness is 5nm, and the in-situ doping concentration is 5×10 9 cm -3 The silicon semiconductor material is used to form the body region 2, wherein the process conditions used for epitaxy are: the degree of vacuum is less than or equal to 1.0×10 -10 mbar, the RF power is 150W, and the reactant uses high-purity silicon source.
[0054] Step 3. Make source area 3, such as image 3 c.
[0055] Make a mask on the body region 2 for the first time, use the mask to dope the concentration of 1×10 18 cm -3 P-type impurities to form a source region 3 with...
Embodiment 2
[0072] Embodiment 2: Fabricate a multi-level coupled gate tunneling field effect transistor with three suspended plates and a suspended plate width of 3 nm
[0073] Step 1. Select InN semiconductor material as substrate 1, such as image 3 a.
[0074] Step 2. Fabricate the body region 2 on the InN substrate 1, such as image 3 b.
[0075] Using molecular beam epitaxy on an InN substrate 1, the vacuum degree is less than or equal to 1.0×10 -10 mbar, the RF power is 150W, and the reactant is N 2 1. Under the process conditions of high-purity indium source, the epitaxial thickness is 30nm, and the in-situ doping concentration is 5×10 15 cm -3 The InN semiconductor material forms the body region 2 .
[0076] Step 3. Make source area 3, such as image 3 c.
[0077] Make a mask on the body region 2 for the first time, use the mask to use the ion implantation process on the left side of the body region 2 at an implant dose of 9×10 13 cm -2 , under the process condition of i...
Embodiment 3
[0097] Embodiment 3: Fabricate a multi-stage coupled gate tunneling field effect transistor with 5 suspended plates and a width of 5 nm.
[0098] Step A. Select InGaN semiconductor material as substrate 1, such as image 3 a.
[0099] Step B. Fabricate the body region 2 on the InGaN substrate 1, such as image 3 b.
[0100] Using molecular beam epitaxy on InGaN substrate 1, the epitaxy thickness is 50nm, and the in-situ doping concentration is 1×10 17 cm -3 The InGaN semiconductor material is used to form the body region 2, wherein the process conditions used for epitaxy are as follows:
[0101] Vacuum degree is less than or equal to 1.0×10 -10 mbar,
[0102] RF power is 150W,
[0103] The reactant adopts high-purity indium source, high-purity gallium source, N 2 .
[0104] Step C. Make source area 3, such as image 3 c.
[0105] Make a mask on the body region 2 for the first time, use the mask to dope the concentration of 1×10 20 cm -3 P-type impurities to form a...
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