Thermoelectric separation copper substrate production method
A production method and technology of thermoelectric separation, applied in the direction of assembling printed circuits with electrical components, can solve the problems of high-quality finished products, low degree of automation, and a lot of labor, and achieve excellent viscoelastic performance, improve welding efficiency, and reduce demand. amount of effect
Pending Publication Date: 2020-05-08
安徽全照电子有限公司
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Problems solved by technology
[0003] The traditional copper substrate production process has low efficiency, low degree of automation, and requires a lot of manual assistance, and the rate of high-quality finished products is disclosed. Therefore, the present invention designs a thermoelectric separation copper substrate production method to solve the problems existing in the prior art
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0025] see Figure 1-3 , an embodiment provided by the present invention: a method for producing a thermoelectrically separated copper substrate, comprising the following steps: material cutting step: cutting the copper plate, FR-4 substrate and PP simultaneously according to the cutting size, and grinding the substrate Plate treatment and cleaning of the layout;
[0026] Copper plate processing steps: Remove unnecessary copper by exposure etching on the copp...
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The invention discloses a thermoelectric separation copper substrate production method. The method comprises the steps: simultaneously cutting a copper plate, an FR-4 substrate and a PP according to acutting size; performing the grinding of the substrate, and cleaning the surface of the substrate, removing unnecessary copper from the copper plate through exposure etching, enabling the copper plate to stand for 15 min after exposure, and exposing a boss with the needed height size, wherein at the moment, the ink on the boss cannot be removed, so the boss is protected against gluing in the pressing process. According to the invention, welding is carried out through an intelligent spot welding machine; automatic cleaning equipment and packaging equipment are used for packaging; the welding efficiency and the operation automation are improved; according to the manufacturing method, the tin demand is reduced, the production cost is reduced, the environment-friendly effect is improved, theheating time is shortened, the welding efficiency is improved, the core heat conduction component of the copper substrate manufactured through the manufacturing method is composed of aluminum oxide, silicon powder and a polymer filled with epoxy resin, the heat resistance is small, the viscoelastic property is excellent, and the heat aging resistance is achieved.
Description
technical field [0001] The invention relates to the technical field of copper substrates, in particular to a method for producing thermoelectric separation copper substrates. Background technique [0002] Copper substrate is the most expensive kind of metal substrate, and its heat conduction effect is many times better than that of aluminum substrate and iron substrate. There are immersion gold copper substrates, silver-plated copper substrates, tin-sprayed copper substrates, anti-oxidation copper substrates and other categories. [0003] The traditional copper substrate production process has low efficiency and low degree of automation, requires a lot of manual assistance, and the high-quality rate of finished products is disclosed. Therefore, the present invention designs a thermoelectric separation copper substrate production method to solve the problems existing in the prior art. Contents of the invention [0004] The purpose of the present invention is to provide a m...
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IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor周正信蔡宗建
Owner安徽全照电子有限公司