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Soldering alloy

A solder alloy, solder joint technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problem of uneven heating operation, etc., and achieve the effect of excellent characteristics

Active Publication Date: 2020-05-08
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Although the solder paste of Patent Document 4 is designed to mix various powders with different compositions and form an alloy after melting, it needs to be heated beyond the melting point of each powder. For example, if Cu powder is used, if Cu powder is not heated to If the melting point is above 1084.6°C, complete melting cannot be expected, and there is concern that it depends on the unevenness of the heating operation during welding.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] Put a specific amount of Bi, Cu, and Sn wafer raw materials into the graphite crucible, set the graphite crucible in the atomization device, and set it in an inert gas environment, and keep it for a certain period of time until the raw materials are evenly melted to obtain a melt .

[0119] Then, the stopper installed at the bottom of the graphite crucible was pulled up to allow the melt to flow into the lower part. At this time, an inert gas is blown to the melt to produce solder powder.

[0120] After accurately weighing 0.5 g of solder powder and dissolving it in acid, the concentration was measured with an ICP emission spectrometer, and the results are shown in Table 1.

[0121] [Measurement of solidus temperature, liquidus temperature and melting point]

[0122] The measurement of the solidus temperature (SPT), liquidus temperature (LPT), and melting point (MP) of the solder alloy was carried out by a method using differential scanning calorimetry (DSC: Different...

Embodiment 2～6

[0138] Solder powder was produced in the same procedure as in Example 1, the concentration was measured by an ICP emission spectrometer, and the solidus temperature, liquidus temperature and melting point were measured by differential scanning calorimetry, and then measured after 1 reflow treatment, 3 times reflow Shear strength after welding treatment and high temperature test. These results are collectively shown in Table 1.

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Abstract

Provided is a novel lead-free soldering alloy that can be used in a high temperature range. This soldering alloy contains Sn, Bi, and Cu, wherein the Sn content is 1.9 to 4.3% by mass, the Cu contentis 1.9 to 4.5% by mass, the remainder is Bi and unavoidable impurities, and the Sn content and the Cu content satisfy the formula: Cu content (% by mass) <= 1.50 * Sn content (% by mass) - 1.00 Cu content (% by mass) >= 1.45 * Sn content (% by mass) - 1.63.

Description

technical field [0001] The present invention relates to a solder alloy. Background technique [0002] Due to environmental concerns, lead-free solder alloys are recommended. Depending on the composition of solder alloys, the temperature range suitable for use as solder varies. [0003] Power devices are used as components for power conversion in a wide range of fields, including hybrid vehicles and power transmission and transformation. Devices using Si wafers are currently available, but in the fields requiring high withstand voltage, high current applications, and high-speed operation, SiC, GaN, etc., which have a band gap larger than Si, have attracted attention in recent years. [0004] In existing power modules, the operating temperature is about 170°C at most, but it is considered that the next-generation SiC, GaN, etc. may become a temperature range of 200°C or higher. Along with this, heat resistance and heat dissipation are required for each material used in a mo...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C12/00H05K3/34
CPCB23K35/26C22C12/00H05K3/34
Inventor 日野英治泽渡广信
Owner JX NIPPON MINING & METALS CO LTD