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Cuttage seedling substrate for tee trees and application of cuttage seedling substrate

A cutting seedling raising and substrate technology, which is applied in the field of tea tree cutting seedling raising substrate, can solve the problems of weak reproduction and low survival rate of tea tree cuttings, achieve uniform growth, reduce the probability of occurrence of diseases and insect pests, and improve the survival rate

Pending Publication Date: 2020-05-12
JIANGSU POLYTECHNIC COLLEGE OF AGRI & FORESTRY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Purpose of the invention: The technical problem to be solved by the present invention is to provide a new tea tree cutting seedling raising substrate and its application to solve the problems of low survival rate and weak reproduction of tea tree cuttings

Method used

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  • Cuttage seedling substrate for tee trees and application of cuttage seedling substrate
  • Cuttage seedling substrate for tee trees and application of cuttage seedling substrate
  • Cuttage seedling substrate for tee trees and application of cuttage seedling substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 1. Experimental materials: The lignified cuttings of the white cockscomb and cookie varieties were used as materials, and the cuttings were trimmed on the same day.

[0037] 2. Experimental design: 5 treatments were designed in this experiment, with peat soil as the control. Detailed processing is shown in Table 1.

[0038] Table 1 Substrate, proportion and substrate cost of tea tree short panicle cutting

[0039]

[0040]

[0041] 3. Experimental method: On September 26, 2019, the cuttings of white cockscomb, cookies, and Yunnan big-leaf tea trees in the hundred tea gardens of Jiangsu Tea Expo Garden were cut, and the cuttings were soaked in 50mg / kg ABT rooting powder solution for 0.5h before cutting. [6] , cuttages were placed in 60-hole plug trays, poured enough root-fixing water, and placed in an artificial climate box for cultivation. The temperature of the artificial climate box was set at 28 degrees and the relative humidity was 75%. The light duration wa...

Embodiment 2

[0061] Embodiment 2: Product working process or principle.

[0062] 1. Propagation method: use cutting propagation technology to raise seedlings;

[0063] 2. Selection of cuttings: cut out 25cm long, 1-year-old reddish-brown, semi-lignified, robust and free from diseases and insect pests, and full axillary buds from the mother tree, and put them in a bucket filled with water in time;

[0064] 3. Cutting cuttings: Cut the cuttings into 3-4cm long cuttings with a leaf and full axillary buds. The cut should be smooth and have a certain oblique direction;

[0065] 4. Treatment of cuttings: In order to improve the germination rate of tea seedlings, the pruned cuttings can be put together at the same time, and the cuttings are soaked in 50mg / kg ABT rooting powder solution for 0.5h.

[0066] 5. Substrate treatment: Treat the substrates with different ratios according to the proportion. After mixing and stirring evenly, the water content will be about 70% (wet but not sticky). Spread...

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Abstract

The invention discloses a cuttage seedling substrate for tee trees, and belongs to the technical field of the breeding of the tee trees. The cuttage seedling substrate contains akadama soil, kanuma soil and leaf mold, wherein the volume ratio of the akadama soil to the kanuma soil to the leaf mold is 5 to 2 to 3. The akadama soil, the kanuma soil and the leaf mold are applied to the cutting propagation of the tee trees for the first time; experiment data shows that the survival rate of the tee tree seedlings cut by virtue of the substrate reaches up to 100%; and the growth vigor of the tee trees is uniform. The cuttage seedling substrate can meet the requirements of different cutting slips to the environment, the germinating time of the cutting slips is relatively uniform, the growth vigorof the tee buds is relatively uniform, the germinating time is shortened, and the cuttage seedling substrate has wide application prospects.

Description

technical field [0001] The invention belongs to the technical field of tea tree breeding, and in particular relates to a tea tree cutting seedling raising substrate and an application thereof. Background technique [0002] Tea tree (Camellia sinensis) is a shrub or small tree belonging to the family Theaceae. It is a perennial evergreen woody plant and an important economic crop in southern my country. It has the characteristics of long growth cycle and self-incompatibility. At present, short spike cuttings of tea trees are the main method for the propagation of tea tree varieties. It can maintain the characteristics of fine varieties, and has the advantages of high variety purity, convenient material selection, long breeding season, fast rooting and seedling growth, and high survival rate. [1] . Although tea tree propagation is mainly divided into sexual propagation and asexual propagation, in order to fully preserve the excellent traits of tea trees, asexual propagation i...

Claims

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Application Information

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IPC IPC(8): A01G24/15A01G24/28A01G2/10
CPCA01G2/10A01G24/15A01G24/28
Inventor 刘敏王润贤周天天葛晋纲张红梅张红艳金洋洋
Owner JIANGSU POLYTECHNIC COLLEGE OF AGRI & FORESTRY
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