Electrocoppering plating solution and electrocoppering method

Abstract

The invention belongs to the technical field of electroplating, and particularly relates to an electrocoppering plating solution and an electrocoppering method. The electrocoppering plating solution is composed of copper sulfate pentahydrate, sulfuric acid, chloridions, a brightener, a leveling agent, lauryl L-Arginine ethyl ester dihydrochloride, deionized water and other components. The electrocoppering method comprises the four steps of surface treatment, electrocoppering plating solution preparing, electroplating and drying. By means of the electrocoppering plating solution, electrocoppering can be carried out under the high-density current, a coppered layer of an obtained coppered workpiece is bright and smooth, adhesive force is good, the electroplating time of the low current density under the same condition can be shortened, work efficiency can be improved, and cost can be saved. The formula components of the electrocoppering plating solution are simple, the electrocoppering method is easy to achieve, and industrialization can be achieved easily.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a copper electroplating bath and a copper electroplating method. Background technique [0002] In recent years, people have higher and higher requirements for electronic equipment. While ensuring good performance, they are required to be smaller and lighter. The key to this is to ensure that the thickness of the copper plating layer is uniform and combined with the substrate. Strong, good conductivity and ductility, with a certain brightness and leveling properties. [0003] Acid copper plating has important applications in the electronics industry, especially in the manufacture of printed circuit boards and semiconductors. The composition of electroplating copper plating solution (including the content of copper ions, sulfuric acid, chloride ions, additives, etc.) and process conditions will affect the discharge and electrocrystallization process of copper io...

AI Technical Summary

Problems solved by technology

However, this patent only studies the deep plating ability, and does not study the surface properties of the copper plating layer, and the surface properties of the copper plating layer will affect the application of electroplating copper

[0005] Therefore, there are generally technical defects in the prior art such as the coating is not bright, not smooth, poor adhesion or even decopper, and poor surface performance of the coating during high current density electroplating.

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