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A kind of bonding sheet and preparation method thereof

A bonding sheet, high thermal conductivity technology, applied in adhesives, adhesive types, film/sheet release liners, etc., can solve problems such as low modulus, improve heat resistance, increase thermal conductivity, and optimize settlement The effect of defects

Active Publication Date: 2021-11-02
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High thermal conductivity can conduct the heat generated by components in time to ensure that the operating temperature of electronic products will not be too high; high elasticity and low modulus characteristics solve the problem of brittle cracking after curing of traditional high thermal conductivity adhesive sheets, and can be absorbed in time Stress caused by long-term thermal expansion and contraction of materials ensures the stability of electronic products

Method used

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  • A kind of bonding sheet and preparation method thereof
  • A kind of bonding sheet and preparation method thereof
  • A kind of bonding sheet and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] Step (1) 30Wt%N, N-dimethylformamide+50Wt% ethyl ketone solvent solvent combination, 1.8Wt% dicyandiamide curing agent, 70Wt% bisphenol F, 22Wt% organosilicon epoxy resin , 13Wt% carboxy-terminated nitrile rubber, 0.4Wt% surface additives are mixed and stirred to obtain pure rubber combination;

[0034] Step (2): Add 550Wt% of the high thermal conductivity powder combination into the pure rubber combination of the step (1); respectively go through 1500 rpm high-speed shear stirring, 500 rpm + forward rotation and reverse rotation for 30 minutes respectively Zirconia ball milling, 400 rpm low-speed defoaming and other steps to obtain uniformly dispersed high thermal conductivity glue;

[0035] Step (3): Coat the high thermal conductivity glue in the step (2) on a 50 μm release film through a wire rod of a specific specification, let it stand at room temperature for 3 minutes, put it in an oven at 160°C for 5 minutes and bake it Drying and pre-curing to obtain a 100μm ad...

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Abstract

The invention discloses a bonding sheet and a preparation method thereof. The bonding sheet of the present invention is formed by coating epoxy-modified high thermal conductivity glue on the release film, and then drying; the high thermal conductivity glue includes: 500-700 parts of high thermal conductivity powder, epoxy resin A15-80 parts, epoxy modified silicone resin 20-50 parts, modified rubber 5-15 parts, curing agent 1-15 parts, surface additive 0.1-0.7 parts, solvent 70-100 parts. The bonding sheet of the present invention has excellent high thermal conductivity properties, high elasticity and low modulus properties at the same time.

Description

technical field [0001] The invention belongs to the technical field of manufacturing metal copper-clad laminates, and in particular relates to an adhesive sheet and a preparation method thereof. Background technique [0002] Due to its excellent heat dissipation capability, metal-based copper-clad laminates have gradually become the main raw material for heat-dissipating PCBs. Especially in recent years, with the high integration and high power of electronic circuits, the heat generated by electronic products has also increased sharply, making PCB manufacturers put forward higher and higher requirements for the heat dissipation capacity of metal-based copper clad laminates. [0003] At the same time, electronic product terminals have increasingly stringent requirements on the reliability of materials. Among them, problems such as solder pin drop-off and pad cracking in components have attracted more and more attention, especially for high-thermal-conductivity metal-based cop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J183/04C09J11/04C09J7/40C09J7/30
CPCC08K2003/2227C08K2003/282C08K2003/385C08K2201/005C08L2201/08C08L2203/20C08L2205/03C09J11/04C09J163/00C09J183/04C09J2203/326C09J7/30C09J7/40C08L83/04C08K3/22C08K3/28C08K3/38C08L63/00
Inventor 应雄锋沈宗华沈丹洋吕迅凯
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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