Cyanide-free silver-based composite plating solution, silver-based composite plating layer and preparation method thereof
A technology of silver-based composite and plating solution, which is applied in the field of metal surface treatment to achieve good stability, improve Zeta potential, and promote transmission and retention
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Embodiment 1
[0046] This embodiment provides a cyanide-free silver-based composite plating solution and a silver-based composite coating formed on a 20mm×30mm×1mm copper surface by using the cyanide-free silver-based composite plating solution.
[0047] The cyanide-free silver-based composite plating solution includes silver nitrate, multiple complexing agents, conductive salts, buffers, cationic surfactants, additives and micro-nano particles.
[0048] The multi-component complexing agent uses triethylenetetramine as the main complexing agent, and triethylenetetramine sodium hexaacetate and sodium citrate as auxiliary complexing agents.
[0049] The concentration of described silver nitrate is 0.3mol / L, and the concentration ratio of main complexing agent and silver nitrate is 3:1, and the concentration of secondary complexing agent is 0.05mol / L (sodium triethylene tetramine hexaacetate and sodium citrate equimolar concentration), the concentration of the conductive salt is 0.5mol / L, and ...
Embodiment 2
[0056] This embodiment provides a cyanide-free silver-based composite plating solution and a silver plating layer formed on a 20mm×30mm×1mm copper surface by using the cyanide-free silver-based composite plating solution.
[0057] The cyanide-free silver-based composite plating solution includes silver nitrate, multiple complexing agents, conductive salts, buffers, cationic surfactants, additives and micro-nano particles.
[0058] The multi-component complexing agent uses triethylenetetramine as the main complexing agent, and triethylenetetramine sodium hexaacetate and sodium citrate as auxiliary complexing agents.
[0059] The concentration of described silver nitrate is 0.3mol / L, and the concentration ratio of main complexing agent and silver nitrate is 3:1, and the concentration of secondary complexing agent is 0.05mol / L (sodium triethylene tetramine hexaacetate and sodium citrate equimolar concentration), the concentration of the conductive salt is 0.5mol / L, and the buffer...
Embodiment 3
[0066] This embodiment provides a cyanide-free silver-based composite plating solution and a silver-based composite coating formed on a 20mm×30mm×1mm copper surface by using the cyanide-free silver-based composite plating solution.
[0067] The cyanide-free silver-based composite plating solution includes silver nitrate, multiple complexing agents, conductive salts, buffers, cationic surfactants, additives and micro-nano particles.
[0068] The multi-component complexing agent uses triethylenetetramine as the main complexing agent, and triethylenetetraminehexaacetic acid, ethylenediaminetetraacetic acid and citric acid as auxiliary complexing agents.
[0069] The concentration of the silver nitrate is 0.3mol / L, the concentration ratio of the main complexing agent to silver nitrate is 3:1, and the concentration of the auxiliary complexing agent is 0.06mol / L (the three auxiliary complexing agents are equimolar concentrations) , the concentration of the conductive salt is 0.8mol / ...
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