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Preparation method of dispensing electrode platform for ceramic packaging base, fixing method of resonator wafer and printing metal slurry

A technology of ceramic encapsulation and metal paste, applied in electrical components, impedance networks, etc., can solve the problems of easy falling off of glue dots, weak glue fixing method, etc., to improve the fixing firmness, good applicability and application effect, Satisfy the effect of low resistance

Active Publication Date: 2020-06-05
瓷金科技(河南)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a preparation method of a dispensing electrode platform for a ceramic packaging base, to solve the problem that the glue points are easy to fall off after dispensing and fixing the wafer
[0007] The second purpose of the present invention is to provide a method for fixing the resonator wafer, so as to solve the problem that the existing way of dispensing glue is not firm

Method used

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  • Preparation method of dispensing electrode platform for ceramic packaging base, fixing method of resonator wafer and printing metal slurry
  • Preparation method of dispensing electrode platform for ceramic packaging base, fixing method of resonator wafer and printing metal slurry
  • Preparation method of dispensing electrode platform for ceramic packaging base, fixing method of resonator wafer and printing metal slurry

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Embodiment 1

[0037] The preparation method of the dispensing electrode platform for the ceramic packaging base of this embodiment includes the following steps: printing the dispensing electrode platform with a printed metal paste at a predetermined position, and the printed metal paste forms a honeycomb shape after sintering at 1550°C The electrode platform substrate with a porous structure (the height of the electrode platform substrate is 30 μm), and then electroplated with nickel and gold in turn to obtain a dispensing electrode platform; the thickness of the nickel coating is 2-8 μm, and the thickness of the gold coating is 0.1-1 μm.

[0038] The printing metal paste is composed of the following weight percentages: 72% of tungsten powder; 6% of inorganic additives, including 5.6% of aluminum oxide, 0.3% of silicon dioxide, 0.05% of kaolin, and 0.05% of talcum powder; 10% of carbon powder, particle size 15μm; 12% organic vehicle, including 9% terpineol, 1.5% butyl carbitol, 0.05% plastic...

Embodiment 2

[0043] The difference between the preparation method of the glue dispensing electrode platform for the ceramic packaging base of this embodiment and the embodiment 1 is that the sintering temperature is 1600° C.

[0044] The printing metal paste is composed of the following components in weight percentage: 80% tungsten powder; 5% inorganic additives, including 4.65% aluminum oxide, 0.3% silicon dioxide, and 0.05% talcum powder; 5% starch, with a particle size of 40 μm; organic The carrier is 10% in total, including 7.5% of terpineol, 1.2% of butyl carbitol, 0.15% of hydrogenated castor oil as a thixotropic agent, 0.15% of lecithin as a leveling agent, and 1% of ethyl cellulose as a binder.

Embodiment 3

[0046] The difference between the preparation method of the dispensing electrode platform for the ceramic packaging base of this embodiment and the first embodiment is that the printing metal paste is composed of the following components in weight percentage: 60% of tungsten powder; 5% of inorganic additives, wherein 4.65% aluminum, 0.3% silicon dioxide, 0.05% talcum powder; 20% carbon powder, particle size 10μm; 15% organic carrier, including 11% terpineol, 2% butyl carbitol, thixotropic agent Hydrogenated castor oil 0.3%, leveling agent lecithin 0.2%, binder ethyl cellulose 1.5%.

[0047] In the above embodiments, the metal powder is described as tungsten powder, which may also be common electronic paste metals such as molybdenum powder and nickel powder, and its type is not limited.

[0048] Two, the specific embodiment of the fixing method of the resonator chip of the present invention

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Abstract

The invention, which belongs to the field of electronic components, particularly relates to a preparation method of a dispensing electrode platform for a ceramic packaging base, a fixing method of a resonator wafer and a printing metal slurry. The preparation method of the electrode platform comprises the following steps: printing a printing metal slurry for a dispensing electrode platform at a preset position, sintering the printing metal slurry to form an electrode platform substrate with a honeycomb porous structure, and plating a metal coating for an electrode on the surface of the electrode platform substrate to obtain the dispensing electrode platform with honeycomb porous morphology. According to the invention, the dispensing electrode platform is made into one with a honeycomb porous structure by adopting the specific printing metal slurry, and glue points can conveniently permeate into the porous structure when the wafer is fixed in the later period, so that the wafer fixing firmness is improved, and the application requirements of high frequency and high reliability of the resonator are met.

Description

technical field [0001] The invention belongs to the field of electronic components, and in particular relates to a preparation method of a dispensing electrode platform for a ceramic packaging base, a method for fixing a resonator chip and printing metal paste. Background technique [0002] Quartz crystal resonators are referred to as crystal oscillators for short. They are resonant elements made of the piezoelectric effect of quartz crystals. They are used with semiconductor devices and resistance-capacitance components to form quartz crystal oscillators. [0003] The Chinese utility model patent with the notification number CN205609495U records the typical structure of a quartz crystal resonator, which includes a ceramic package base and a quartz wafer installed in the ceramic package base. The ceramic package base is provided with a conductive connection with a printed conductive circuit The dispensing electrode platform, the quartz wafer is fixed on the dispensing electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/19H03H9/02
CPCH03H9/19H03H9/02
Inventor 潘亚蕊刘永良赵鑫李玉雷
Owner 瓷金科技(河南)有限公司
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