Nitride catalyst and method for manufacturing same
A technology of catalysts and nitrides, which is applied in the field of catalyst materials and its preparation, and can solve problems such as high prices
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preparation example 1
[0041] A Pt catalyst was deposited on a glassy carbon electrode (5mm OD×4mm H) using a reactive magnetron sputtering machine. Put the Pt target into the sputtering machine, apply power to the Pt target, and pass argon gas (flow rate of 20 sccm) into the machine, and the pressure inside the machine is 30 mTorr. Argon ions are used to strike the Pt target, and sputtering is carried out at room temperature for 5 to 6 minutes to form a Pt catalyst with a film thickness of about 100 nm on the glassy carbon electrode, and the coating amount of the catalyst is 0.042 mg.
preparation example 2
[0043] Using a reactive magnetron sputtering machine, deposit Ni with different element ratios on glassy carbon electrodes (5mm OD×4mm H) x Ru y catalyst. Put the Ni target and the Ru target into the sputtering machine, adjust the power applied to the Ni target between 10 and 200W and the power of the Ru target between 10 and 200W, and pass argon (flow rate of 20sccm) Enter the machine table, and the pressure in the machine table is 20mTorr. Hit the Ni target and the Ru target with argon ions, and perform reactive sputtering at room temperature for 5 to 6 minutes to form a Ni film with a thickness of about 100nm. x Ru y The catalyst is on the glassy carbon electrode, and the coating amount of the catalyst is 0.024 mg. Analysis of Ni by EDS x Ru y Catalyst, x between about 0.065 to 0.85, for example: x is 0.0656 to 0.1408, 0.1408 to 0.1498, 0.1498 to 0.2872, 0.2872 to 0.2888, 0.2888 to 0.2938, 0.2938 to 0.496, 0.496 to 0.5332, or 0.53432 to 0.53432 y is between about 1.9...
preparation example 3
[0045] Using a reactive magnetron sputtering machine, deposit Ni with different element ratios on glassy carbon electrodes (5mm OD×4mm H) x Ru y N 2 catalyst. Put the Ni target and the Ru target into the sputtering machine, adjust the power applied to the Ni target between 10 and 200W and the power of the Ru target between 10 and 200W, and nitrogen and argon (flow rate is 20sccm ) into the machine, nitrogen / (argon+nitrogen)=50%, and the pressure in the machine is 20mTorr. Hit the Ni target and the Ru target with argon ions, and perform reactive sputtering at room temperature for 5 to 6 minutes to form a Ni film with a thickness of about 100nm. x Ru y N 2 The catalyst is on the glassy carbon electrode, and the coating amount of the catalyst is 0.024mg. Analysis of Ni by EDS x Ru y N 2 Catalyst, x is between about 0.069-1.086, for example: x is 0.0692-0.1128, 0.1128-0.1258, 0.1258-0.2012, 0.2012-0.318, 0.318-0.4672, 0.4672-0.6816, or 0.6816-1.086, and y is about Betwee...
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