Formula of lead-free core-free soft wire product for IC power device

A technology of power devices and soft soldering wires, applied in the direction of welding media, welding equipment, welding/cutting media/materials, etc., to achieve the effects of high innovation, enhanced components, and wide applicability

Inactive Publication Date: 2020-06-09
上海锡喜材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a lead-free flux-cored soft soldering wire for IC power devices in view of the problems in the prior art that the current soldering wire materials are mainly imported, and there is no such content in domestic new searches. product formulation

Method used

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Embodiment Construction

[0013] The technical solution adopted in this specific embodiment is: the composition of the material formula of the present invention is as follows: -1%) trace elements (Ga, Ge P<2500ppm) are mixed and smelted.

[0014] Further, the technology used in the finished product produced by the present invention is metal smelting and extrusion liquid forming technology. The use of metal smelting and extrusion liquid forming technology ensures the uniformity of alloy composition and low oxidation rate, which is more advantageous than the mainstream foreign extrusion forming process.

[0015] Further, the high temperature required to achieve the finished product process of the present invention needs to reach 320~380°C. Through the high temperature of the production process, it can reduce the generation of oxides, ensure the uniform distribution of alloy components and the consistency of welding wire molding, solve the problems of easy oxidation, voids, oxidation, etc., and meet the ...

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Abstract

The invention discloses a formula of a lead-free core-free soft wire product for an IC power device, and relates to the field of a chip bonding material manufacturing industry. The formula of the material comprises the step that the product is formed through mixing and smelting of Sn tin (remaining) Sb (10%)+ / -1%, AG 25%(+ / -1%) and microelements (Ga, Ge P smaller than 2500 ppm). The formula has the beneficial effects that the formula is wide in adaptation and high in creation, through adding of the microelements, the wetting is effectively improved, the change range of chip tilting BLT (BOND,LEVEL THICKNESS) can be reduced, reduction of voidage in the chip welding process can be solved, through production process creation, oxidation is reduced, the potential layering of the chip bottom and the welding material can be avoided, the welding wire forming stability is improved, and high-end power device quality needs in the IC packaging process can be met.

Description

technical field [0001] The invention relates to the field of chip bonding material manufacturing industry, in particular to a formulation of a lead-free and flux-cored soft soldering wire product for IC power devices. Background technique [0002] With the rapid development of power chips from consumer electronics to industrial control, automotive electronics and other fields, especially in recent years, power devices represented by MOSFETs and IGBTs have evolved towards high frequency, high power, and integration. High density of heat; there is a difference in the coefficient of thermal expansion (CTE) between the gold-backed wafer and the lead frame, which is more likely to cause uneven deformation, which requires a more complete soldering material during the die-bonding process of the power device package to solve the problem of heat dissipation The two major technical problems of thermal fatigue and thermal fatigue, and the current soft welding wire materials are mainly ...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/0227B23K35/262
Inventor 吴斌
Owner 上海锡喜材料科技有限公司
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