A kind of colored glass and preparation method thereof
A technology for colored glass and glass substrate, applied in vacuum evaporation plating, coating, sputtering plating, etc., can solve the problems of high cost, great influence on product performance uniformity, non-conformity, etc., and achieve color acid and alkali resistance. Corrosion, good chemical stability, color stable effect
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[0039] The present invention provides the preparation method of colored glass described in above-mentioned scheme, comprises the following steps:
[0040] Corresponding to the structure of colored glass, the magnetron sputtering method is used to alternately coat layer A and layer B on the surface of the glass substrate, and finally coat a Ti alloy layer on the surface of layer B to obtain colored glass;
[0041] The A layer is in contact with the glass substrate; the A layer is a SiC or NiO layer; the B layer is AlN, GaN, ZrO 2 or Nb 2 o 5 layer.
[0042] In the present invention, the first layer A is coated on the surface of the glass substrate by magnetron sputtering to form the first layer A.
[0043] The present invention has no special requirements on the equipment used in the magnetron sputtering, and the magnetron sputtering equipment well known in the art can be used. In the embodiment of the present invention, the model of the magnetron sputtering coating equipme...
Embodiment 1
[0061] The laminated structure of colored glass is a double-layer structure. When preparing the first layer, the sputtering target used is a high-purity SiC target. The power of magnetron sputtering is 90W, the sputtering pressure is 0.7Pa, and the flow rate of argon gas is 40sccm. The main component is SiC, and the film thickness is 50nm.
[0062] During the preparation of the second layer, the sputtering target used is a high-purity Al target, the power of magnetron sputtering is 90W, the sputtering pressure is 0.7Pa, the flow rate of argon gas is 40 sccm, the main component is AlN, and the argon gas during sputtering The flow ratio with nitrogen is 4:1, and the film thickness is 40nm.
[0063] When preparing the Ti alloy layer, the sputtering target used is Ti / Al alloy target (atomic ratio 1:1), the power of magnetron sputtering is 60W, the sputtering pressure is 0.7Pa, the flow rate of argon gas is 50sccm, and the film layer The thickness is 30nm.
[0064] The prepared s...
Embodiment 2
[0066] The laminated structure of colored glass is a four-layer structure. When preparing the first layer, the sputtering target used is a high-purity SiC target. The power of magnetron sputtering is 90W, the sputtering pressure is 0.7Pa, and the flow rate of argon gas is 40sccm. The main component is SiC, and the film thickness is 90nm.
[0067] When preparing the second layer, the sputtering target used is a high-purity Ga target, the power of magnetron sputtering is 90W, the sputtering pressure is 0.7Pa, the flow rate of argon gas is 40 sccm, the main component is GaN, and argon gas is used during sputtering. The flow ratio of nitrogen is 8:1, and the film thickness is 40nm.
[0068] When preparing the third layer, the sputtering target used is a high-purity SiC target, the magnetron sputtering power is 90W, the sputtering pressure is 0.7Pa, the argon flow rate is 40sccm, the main component is SiC, and the film thickness is 90nm .
[0069] When preparing the fourth layer,...
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