A kind of polyimide multilayer composite film with high modulus and low thermal expansion coefficient and its preparation method and application

A low thermal expansion coefficient, polyimide layer technology, applied in the direction of coating, etc., can solve the problems that affect the final film performance, decrease the toughness of the composite film, increase the difficulty of blending, etc., achieve low thermal expansion coefficient, low cost, high modulus effect

Active Publication Date: 2021-08-03
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method also has certain limitations, such as: due to the high viscosity of the solution, the difficulty of blending increases, and the poor compatibility of the system may cause phase separation and affect the performance of the final film.
In addition, although the composite of carbon fiber and polymer can significantly reduce the thermal expansion coefficient of the composite film, the toughness of the composite film will be seriously reduced.

Method used

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  • A kind of polyimide multilayer composite film with high modulus and low thermal expansion coefficient and its preparation method and application
  • A kind of polyimide multilayer composite film with high modulus and low thermal expansion coefficient and its preparation method and application
  • A kind of polyimide multilayer composite film with high modulus and low thermal expansion coefficient and its preparation method and application

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preparation example Construction

[0045] The preparation method of the present invention will be further described in detail in conjunction with specific examples below. It should be understood that the following examples are only for illustrating and explaining the present invention, and should not be construed as limiting the protection scope of the present invention. All technologies realized based on the above contents of the present invention are covered within the scope of protection intended by the present invention.

[0046] The experimental methods used in the following examples are conventional methods unless otherwise specified; the reagents and materials used in the following examples can be obtained from commercial sources unless otherwise specified.

[0047] The polyamic acid solutions in the following examples can be prepared as follows, and the specific steps are as follows: under the protection of nitrogen, first dissolve the diamine monomer in an organic solvent to obtain a homogeneous transp...

Embodiment 1

[0048] Embodiment 1, preparation PMDA-ODA / PMDA-PDA / PMDA-ODA system three-layer composite film

[0049] 1) The pyromellitic dianhydride-4,4'-diaminodiphenyl ether (PMDA-ODA) / NMP solution with a mass fraction of 20wt% is evenly coated on a glass plate, and placed in a vacuum drying oven to The temperature was raised to 150°C at a rate of 2°C / min, and then the temperature was naturally cooled to room temperature before being taken out. The thickness of the obtained PMDA-ODA film was about 20 μm.

[0050] 2) The pyromellitic dianhydride-p-phenylenediamine (PMDA-PDA) / NMP solution with a mass fraction of 20wt% is uniformly coated on the PMDA-ODA film prepared in the previous step, and after standing at room temperature for 2h, place In a vacuum drying oven, the temperature was raised to 120°C at a rate of 2°C / min, and then the temperature was naturally cooled to room temperature and taken out. The thickness of the obtained PMDA-PDA film was about 20 μm.

[0051] 3) Evenly coat the ...

Embodiment 2

[0064] Embodiment 2, the preparation upper and lower floors are polyimide (PI), and the middle layer is a three-layer composite film (s-PI-CF) of carbon fiber reinforced polyimide (PI-CF)

[0065] 1) Evenly coat the PMDA-ODA / NMP solution with a mass fraction of 20wt% on a glass plate, place in a vacuum drying oven, heat up to 180°C at a rate of 2°C / min, and then take it out after naturally cooling to room temperature, The thickness of the obtained PMDA-ODA film is about 10 μm.

[0066] 2) The PMDA-ODA / CF blend solution (the mass ratio of CF and polyamic acid is 0.05:0.95) with a mass fraction of 20wt% is evenly coated on the PMDA-ODA film prepared in the previous step, and placed in a vacuum drying oven , the temperature was raised to 180 °C at a rate of 2 °C / min, and then the temperature was naturally cooled to room temperature and taken out. The thickness of the obtained PMDA-ODA / CF film was about 10 μm.

[0067]3) Coat the PMDA-ODA / NMP solution with a mass fraction of 20wt...

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Abstract

The invention provides a polyimide multilayer composite film with high modulus and low thermal expansion coefficient and its preparation method and application. The multilayer composite film includes (1) polyimide layer a, (2) polyimide Layer b or polyimide layer c, (3) polyimide layer a'; said polyimide layer a, polyimide layer b or polyimide layer c, and polyimide layer a' are connected successively to form a multilayer composite film structure; the flexibility of the polyimide layer a and the polyimide layer a' is better, and it can increase the polyimide multilayer composite film as an outer cladding Flexibility provides an important guarantee for the preparation of multilayer composite films with high modulus and low thermal expansion coefficient. Each layer of the obtained polyimide composite film exhibits a good synergistic effect, and has the advantages of high modulus and low thermal expansion coefficient. The composite film prepared by the patented method can well meet the requirements of polyimide materials for flexible packaging applications.

Description

technical field [0001] The invention belongs to the technical field of high-performance polymers, and in particular relates to a polyimide multilayer composite film with adjustable properties and low thermal expansion coefficient, as well as its preparation method and application. Background technique [0002] Polyimide film is a very important film material with very good thermal stability, mechanical properties and electrical properties. It has been widely used in space, microelectronics, new energy and other fields since the 1960s. The polyimide film used as the base of the flexible printed circuit board also has a low coefficient of linear thermal expansion (CTE), which matches the CTE of the metal substrate, thereby avoiding the occurrence of thin films due to too much difference in CTE during heat treatment and cooling. Problems with curling, breaking, peeling, etc. The CTE of the common polyimide film (Kapton film is about 45ppm / K) is usually much higher than the CTE...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L79/08C08K7/06C08G73/10
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J7/042C08J2379/08C08J2479/08C09D179/08C09D7/61C09D7/70C08K7/06
Inventor 刘琛阳陈文娟张宝庆
Owner INST OF CHEM CHINESE ACAD OF SCI
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