Adhesive film backboard integrated packaging material and processing technology thereof
A processing technology and packaging material technology, applied in the field of solar cells, can solve the problems that the weather resistance and sand resistance performance cannot reach the photovoltaic backplane, achieve good adhesion performance, reduce production costs, and reduce the effect of use
Inactive Publication Date: 2020-06-19
广东保均应用材料有限公司
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Problems solved by technology
However, the barrier performance to external moisture, weather resistance and wind and sand resistance of the prepared backsheet layer cannot meet the requirements of photovoltaic backsheets.
Method used
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] see figure 1 , the present invention provides a kind of processing technology of adhesive film backboard integrated packaging material, comprising the following steps:
[0028] S1: Provide a backsheet layer, the backsheet layer includes a structural reinforcement layer and a weather-resistant layer, and the structural reinforcement layer and the weather-resistant layer are bonded by an adhesive.
[0029] The back sheet layer is mainly used to provide s...
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The invention provides a processing technology of an adhesive film backboard integrated packaging material. The processing technology comprises the following steps: a backboard layer is provided, wherein the backboard layer comprises a structure enhancement layer and a weather-proof layer, and the structure enhancement layer and the weather-proof layer are bonded through an adhesive; materials aremixed, melted and subjected to tape casting, and the adhesive film layer is obtained, wherein the material comprises the following components: 90 to 100 parts of modified EVA resin, 0.3 to 1.5 partsof a cross-linking agent, 0.4 to 2.0 parts of an auxiliary cross-linking agent, 0.4 to 2.0 parts of a coupling agent, 0.01 to 1.0 part of an ultraviolet absorbent, 0.01 to 1.0 part of an antioxidant,0.01 to 1.0 part of a light stabilizer and 0 to 15 parts of titanium dioxide; the backboard layer and the adhesive film layer are compounded and formed, so that the structure enhancement layer and theadhesive film layer are bonded in a thermal compounding mode; and after cooling, drawing and rolling, the adhesive film backboard integrated packaging material is obtained. The invention also provides an adhesive film backboard integrated packaging material. The adhesive film backboard integrated packaging material provided by the invention has relatively good bonding performance.
Description
【Technical field】 [0001] The invention relates to the technical field of solar cells, in particular to an adhesive film backplane integrated packaging material and a processing technology. 【Background technique】 [0002] The solar battery module is the core part of the solar power generation system. Its function is to convert solar energy into electrical energy, which is directly integrated into the grid or sent to the energy storage system for storage. The packaging materials used in the lamination and packaging process of conventional solar modules are, from bottom to top, photovoltaic glass, packaging film, crystalline silicon cell, packaging film and photovoltaic backplane. The packaging film is generally made of ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), ethylene-α-olefin copolymer (POE) and other films, the main function of which is to bond glass, battery and back plate. It is required to have good light transmittance, adhesion, weather resistan...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C09J7/30C09J7/29C09J7/25C09J123/08C09J11/04C09J11/06H01L31/048H01L31/049H01L31/18
CPCC08K2003/2241C09J11/04C09J11/06C09J123/0892C09J2203/322C09J2423/04C09J2427/006C09J2433/006C09J2467/006C09J2477/006C09J7/25C09J7/255C09J7/29C09J7/30H01L31/048H01L31/0481H01L31/18H01L31/049C08K13/02C08K3/22C08K5/14C08K5/3475Y02E10/50Y02P70/50
Inventor 张好宾梁晓军李艳
Owner 广东保均应用材料有限公司