Graphene nano three-proofing adhesive and preparation method thereof

Abstract

The invention discloses a graphene nano three-proofing adhesive, which is prepared from the following components in percentage by mass: 20 to 30 percent of modified polyurethane resin; 20 to 30 percent of functional two-dimensional nano flake graphene; 20 to 30% of a polyurethane curing agent MDI; 1-5% of a defoaming agent; 1-5% of hydrophobic fumed silica; and 15-25% of a graphene dispersant. Thepreparation method of the graphene nano three-proofing adhesive comprises the following steps: preparing materials according to the mass percent; adding the prepared modified polyurethane resin intoa reaction kettle; adding the graphene dispersing agent and the functional two-dimensional nanosheet graphene under the condition that the temperature is raised to 50-55 DEG C, fully and uniformly stirring, cooling to 20-25 DEG C, then respectively adding the hydrophobic fumed silica, the defoaming agent and the polyurethane curing agent MDI, completely and uniformly stirring and mixing to obtaina finished product, testing and sub-packaging. The adhesive is high in bonding strength and good in salt spray resistance and physical protection performance, can be applied to appearance surface coatings of electronic products, daily household appliances, steel structures, ships, warships and the like, and fills up the domestic blank.

Description

technical field [0001] The invention relates to the field of coatings, in particular to a graphene nano three-proof adhesive and a preparation method thereof. Background technique [0002] Three-proof glue, also known as circuit board protective glue or coating glue, has outstanding "moisture-proof", "anti-salt spray" and "insulation" properties; the film layer still does not lose its good dielectric properties in a humid environment; Strong oxidation resistance, aging resistance, corrosion resistance of various concentrations of acids, alkalis, and salts, cured at room temperature or low temperature, dense and bright film, no cracks, and decorative. Widely used in (flexible, rigid) circuit boards, aviation instrumentation, computer control boards, industrial control boards, semiconductor crystal circuit protection, home appliance controllers, and other electronic parts and protective coatings for various circuits. [0003] Conventional three-proof adhesives on the existing...

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Problems solved by technology

[0003] Conventional three-proof adhesives on the existing market have the following defects: 1. Low bonding strength: market products have poor adhesion to metal, glass, and plastic materials; 2. Slow curing speed: it takes 30 minutes to cure at room temperature, 72 3. Poor bending resistance: the products in the existing market are basically made of epoxy resin, and the products are brittle and easy to crack; 4. Poor salt spray resistance: the test time can withstand the maximum concentration of 3.5% NaCl within 200H (thickness of 100UM) ;5. Physical protection: market products can only achieve the effect of shielding, not chemical action; 6. Internal compactness: the market adhesive density is not good, and cannot form a stable chemical bond; 7. High VOC emission: VOC content is higher, Great impact on the environment; 8. Poor surface scratch resistance: market products have poor adhesive density, poor friction and scratch resistance, and are prone to poor appearance

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