High-thermal-conductivity modified polyphenyl ether material and preparation method thereof

Abstract

The invention provides a high-thermal-conductivity modified polyphenyl ether material and a preparation method thereof, and relates to the technical field of polyphenyl ether preparation. The high-thermal-conductivity modified polyphenyl ether material comprises the following raw materials in parts by weight: 15-80 parts of a high-temperature thermal-conductivity resin material, 15-80 parts of modified polyphenyl ether, 5-50 parts of a curing agent, 1-3 parts of a mixture of tri-n-butylamine and triphenylphosphine, 5-45 parts of polytetrafluoroethylene powder and 5-25 parts of a flame retardant. According to the high-thermal-conductivity modified polyphenyl ether material and the preparation method thereof, the heat-resistant temperature of the modified polyphenyl ether is increased through the reaction of the polyphenyl ether, the heptamethylcyclotetrasiloxane compound of carborane and the aluminum hydroxide, so that the heat conductivity coefficient is prevented from being reduced when the heat-conducting filler is mixed with other raw materials; the tubular graphene material is added into the rubber body, so that the overall distribution structure of the rubber layer is improved, the bonding strength is improved, the compatibility of polyphenyl ether and thermosetting resin is improved, and the preparation cost is reduced.

Description

technical field

[0001] The invention relates to the technical field of polyphenylene ether preparation, in particular to a modified polyphenylene ether material with high thermal conductivity and a preparation method thereof. Background technique

[0002] The prior art modified polyphenylene ether material and its preparation method have the following problems:

[0003] First, the modified polyphenylene ether material in the prior art needs to be mixed with fillers to increase the fluidity of the material. When the thermally conductive filler is mixed with the rest of the raw materials, its thermal conductivity is reduced, resulting in a sharp drop in the bonding strength, making the polyphenylene ether resistant to resistance. The thermal temperature is not high, and it is easy to decompose when the temperature is too high. In addition, graphene has good thermal conductivity, but when applied to ordinary thermally conductive fillers, the product is brittle and easy to crack...

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