Preparation method for copper rotating target material

A technology of rotating target and copper powder, applied in the field of sputtering targets, can solve the problems of uneven structure and performance of extruded products, uneven structure and performance of target materials, uneven metal fluidity, etc., and achieves good structure consistency and copper The powder has the effect of high powder coating rate and convenient operation.

Active Publication Date: 2020-07-28
XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the preparation process of copper rotating target mainly adopts one-piece extrusion molding, and the target prepared by this method has the following disadvantages: 1) The microstructure and properties of the target are not uniform, due to the uneven fluidity of the metal during extrusion, resulting in extrusion Pressed products have the problem of uneven tissue properties between the surface layer and the center, head and tail; 3) To prepare targets with different thicknesses, different molds are required, which greatly increases the cost and the uncontrollability of target thickness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] A method for preparing a copper rotating target, comprising the following steps:

[0027] (1) prepare copper powder;

[0028] (2) Sandblasting the surface of the back pipe;

[0029] (3) Install the back pipe after sandblasting on the frame, the frame drives the back pipe to rotate and move axially, set the cold spraying process parameters, and spray the copper powder to the surface of the back pipe through a spray gun to form Copper coating, after the copper coating reaches the required thickness, a copper rotating target is obtained.

[0030] Compared with the existing integral extrusion molding method, the present invention uses the cold spraying process to prepare the copper rotating target, the preparation process is simple, the operation is convenient, and the size of the target and the thickness of the coating are not limited, the density of the target is high, and the copper powder The comprehensive powder feeding rate is high, which is suitable for large-scale...

Embodiment 1

[0043] A method for preparing a copper rotating target, comprising the following steps:

[0044] (1) preparing average particle diameter is 15 μ m, and the copper powder of oxygen content is less than 1000ppm;

[0045] (2) A 304 stainless steel back tube with a length of 800 mm, an inner diameter of 125 mm, and an outer diameter of 133 mm is used, and the back tube is sandblasted so that the surface roughness Ra of the back tube is 13 μm;

[0046] (3) Install the back pipe after sand blasting on the frame, the frame drives the back pipe to rotate and move axially, the rotating speed of the back pipe is 15r / min, and the axial movement speed of the back pipe is 60mm / min;

[0047] The spray gun is installed 45mm above the central axis of the back tube, and the step-up distance is 0.25mm / time (the back tube moves back and forth axially once);

[0048] Set the cold spraying process parameters: the temperature at the outlet of the spray gun is 530°C, the powder feeding pressure is ...

Embodiment 2

[0050] A method for preparing a copper rotating target, comprising the following steps:

[0051] (1) preparing average particle diameter is 45 μ m, and the copper powder of oxygen content is less than 1000ppm;

[0052](2) Adopt a titanium back tube with a length of 1600 mm, an inner diameter of 125 mm, and an outer diameter of 133 mm, and perform sandblasting on the back tube so that the surface roughness Ra of the back tube is 10 μm;

[0053] (3) Install the back pipe after sandblasting on the frame, the frame drives the back pipe to rotate and move axially, the rotating speed of the back pipe is 25r / min, and the axial movement speed of the back pipe is 60mm / min;

[0054] The spray gun is installed 55mm above the central axis of the back tube, and the step-up distance is 0.5mm / time (the back tube moves back and forth axially once);

[0055] Set the process parameters of cold spraying: the temperature at the outlet of the spray gun is 590°C, the powder feeding pressure is 4.7...

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PUM

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Abstract

The invention discloses a preparation method for a copper rotating target material. The preparation method for the copper rotating target material comprises the following steps that (1) copper powderis prepared; (2) a back pipe is subjected to surface sand blasting treatment; and (3) the back pipe subjected to sand blasting treatment is mounted on a rack, the back pipe is driven to rotate and move in the axial direction by the rack, cold spraying process parameters are set, the copper powder is sprayed to the surface of the back pipe through a spray gun to form a copper coating, and the copper rotating target material is obtained after the copper coating reaches the required thickness. The copper rotating target material prepared through the preparation method is high in relative density,adjustable in coating thickness and high in copper powder comprehensive powdering rate.

Description

technical field [0001] The invention relates to the technical field of sputtering targets, in particular to a method for preparing a copper rotary target. Background technique [0002] Copper target is a kind of sputtering target in vacuum coating industry. It is a product of high-purity copper material after series processing, with specific size and shape. High-purity copper targets, especially ultra-high-purity copper targets, have many excellent properties and have been widely used in cutting-edge fields such as electronics, communications, superconductivity, and aerospace. [0003] At present, the preparation process of copper rotating target mainly adopts one-piece extrusion molding, and the target prepared by this method has the following disadvantages: 1) The microstructure and properties of the target are not uniform, due to the uneven fluidity of the metal during extrusion, resulting in extrusion Pressed products have the problem of uneven tissue properties between...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/04C23C14/14C23C14/34B24C1/00
CPCC23C24/04C23C14/14C23C14/3414B24C1/00Y02P10/20
Inventor 余芳朱刘童培云文崇斌白平平
Owner XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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