Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Metal packaging shell and manufacturing method thereof and hybrid integrated circuit

A hybrid integrated circuit and metal packaging technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high operating frequency, complex electronic circuits, high assembly density, etc. The effect of reliable work

Pending Publication Date: 2020-07-28
北京飞宇微电子电路有限责任公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

What follows is that the size of the hybrid integrated circuit is getting smaller and smaller, and there are more and more components integrated inside, the assembly density is high and the electronic circuit is complicated, and the operating frequency is high. If it is packaged in a metal package, The distribution parameters generated when the product is working will have an adverse effect on the circuit performance, causing the performance of the hybrid integrated circuit to fail to meet the requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Metal packaging shell and manufacturing method thereof and hybrid integrated circuit
  • Metal packaging shell and manufacturing method thereof and hybrid integrated circuit
  • Metal packaging shell and manufacturing method thereof and hybrid integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] This embodiment provides a method for manufacturing a metal packaging case, the metal packaging case includes a metal case and a metal cover, and the metal case and the metal cover can enclose to form a cavity for accommodating and protecting a circuit. The circuit consists of the components and the metal conductive strips connecting the components. image 3 It is a schematic structural diagram of a hybrid integrated circuit provided by an embodiment of the present invention. For display purposes, image 3 The metal cover is omitted. Such as image 3 As shown, the metal shell has a base 31 , and the base 31 has a first surface and a second surface opposite to each other, wherein the first surface is used to fix the metal conductive strip 34 through the substrate 33 . Specifically, the first surface is provided with an adhesive layer 32 made of adhesive material, and the substrate 33 is bonded and fixed on the first surface of the base 31 through the adhesive layer 32...

Embodiment 2

[0138] This embodiment provides a metal packaging shell for a hybrid integrated circuit, the metal packaging shell includes a metal shell and a metal cover, and the metal shell and the metal cover can be enclosed to form a cavity for accommodating and protecting the circuit . The circuit consists of the components and the metal conductive strips connecting the components. image 3 It is a schematic structural diagram of the metal packaging shell provided by an embodiment of the present invention. For the convenience of display, image 3 The metal cover is omitted. Such as image 3 As shown, the metal shell has a base 31, and the base 31 has an opposite first surface and a second surface, wherein the first surface is used to fix the metal guide strip 34 through the substrate 33; a blind hole 35 is provided on the first surface, And the opening positions of the blind holes 35 correspond to the metal conductive strips 34 .

[0139] Specifically, when the hybrid integrated cir...

Embodiment 3

[0144] This embodiment provides a hybrid integrated circuit, including the circuit and the metal packaging shell for the hybrid integrated circuit described in the second embodiment above. The metal packaging shell includes a metal shell and a metal cover that are sealed and fitted. In the cavity formed by the body and the metal cover. refer to Figure 3 to Figure 5 , the metal shell specifically includes a base 31, the base 31 has a first surface facing the metal cover and a second surface away from the metal cover; On the surface; the substrate 33 is distributed with metal conduction strips 34 . A blind hole 35 is opened on the first surface of the base 31 , and the location of the blind hole 35 corresponds to the metal conduction strip 34 , especially in an area where the metal conduction strip 34 is densely distributed.

[0145] Specifically, for the specific structure of the metal package shell, reference may be made to the relevant expressions in Embodiment 1 and Embod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a metal packaging shell and a manufacturing method thereof, and a hybrid integrated circuit. The metal packaging shell is used for the hybrid integrated circuit and comprises ametal shell and a metal cover body, wherein the metal shell and the metal cover body can define a cavity used for protecting the circuit, the circuit comprises a component and a metal conduction bandconnected with the component, the metal shell comprises a base, the base is provided with a first surface and a second surface which are opposite, and the first surface faces the cavity and is used for fixing the metal conduction band through the base, a blind hole is formed in the first surface, and the forming position of the blind hole corresponds to the metal conduction band. The metal packaging shell is advantaged in that the blind hole is formed in the base, so a problem that performance parameters of a hybrid integrated circuit product cannot reach the standard due to the adoption of ametal packaging shell in the prior art can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a metal packaging shell, a manufacturing method thereof, and a hybrid integrated circuit. Background technique [0002] Hybrid Integrated Circuit (HIC) is a film-forming method that produces thick-film or thin-film components and their interconnections on a substrate, and mixes discrete semiconductor chips, monolithic integrated circuits or micro-components on the same substrate. Assembled and packaged. Compared with semiconductor integrated circuits, hybrid integrated circuits have the characteristics of short design cycle and good flexibility, and can be flexibly adapted to small, medium and large-scale production. It has obvious advantages such as volume, so it has been widely used. [0003] The packaging shell is an important part of the hybrid integrated circuit. It not only plays the role of mechanical protection and transition connection of the electrodes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/48H01L23/055H01L23/06H01L23/10
CPCH01L21/4817H01L23/055H01L23/06H01L23/10
Inventor 成国瑞姜贵云
Owner 北京飞宇微电子电路有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com