A test device for online detection of polishing pad contact characteristics and its application method

Abstract

The invention discloses a test device for on-line detection of the contact characteristics of a polishing pad and a method for using the same. The test device includes a base, a monocular microscope, a CCD camera, an XY two-way movable workbench, a sapphire observation window, a fixed ring, Counterweights, motion control systems and computers. The invention belongs to an on-line detection method. During measurement, the assembled sapphire observation window only needs to be placed on the surface of the polishing pad, and removed after the measurement is completed. The entire measurement process does not damage the surface structure of the polishing pad and does not affect the subsequent polishing process. The invention uses an optical microscope to directly obtain the real contact image of the polishing pad, and the test result is more accurate and reliable. The present invention can process microscopic contact images in batches, and use image processing software to obtain real-time microscopic contact feature information: including real contact area ratio, number of contact points, average size of contact points, distribution of contact points, etc., which is convenient for the guidance of subsequent trimming processes.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a test device for on-line detection of the contact characteristics of a polishing pad and a use method thereof. [0002] technical background [0003] Chemical Mechanical Polishing (CMP) technology, as an ultra-precision processing method, has been widely used in semiconductor preparation, optical parts processing and other fields. The polishing pad is one of the important participating parts in the chemical mechanical polishing process. Existing chemical mechanical polishing devices such as figure 1 As shown: under the action of the clamping head 2, the workpiece 1 is pressed on the surface of the polishing pad 3 with a given polishing pressure, and with the participation of the polishing liquid 4, the workpiece 1 and the polishing pad 3 move relative to each other to achieve material removal . It can be seen that during the polishing process, the polishi...

AI Technical Summary

Problems solved by technology

However, this test is an offline measurement method, which cannot meet the requirements of online measurement

And the measurement sample in this method needs to be cut from the surface of the polishing pad, which is a destructive detection method, and the damaged polishing pad will not be able to continue to be put into the subsequent polishing process

Therefore, the contact feature information obtained by this method lacks guidance for the trimming process

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