Enrichment device chip structure and preparation method thereof
A chip structure and concentrator technology, applied in microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of uneven distribution of gas flow field and limited enrichment rate, so as to improve the bearing capacity and improve the Uniformity, effect of extending the gas flow path
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Embodiment 1
[0076] Such as Figure 1-9 Shown, the present invention provides a kind of preparation method of concentrator chip structure, and described preparation method comprises the following steps:
[0077] providing a substrate 100, and preparing a groove structure 101 in the substrate 100;
[0078] Several microcolumn structures 102 are prepared in the substrate 100, the microcolumn structures 102 are located in the groove structure 101, and the microcolumn structures 102 include a first extension part 102a, a connecting part 102b and The second extension part 102c, the first extension part 102a, the connecting part 102b and the second extension part 102c enclose a space area with an opening, and the adjacent micro-column structures 102 are nested based on the opening set up;
[0079] Prepare at least two microfluidic ports 103 in the substrate 100, the microfluidic ports 103 communicate with the groove structure 101; and
[0080] A cover plate 106 is provided, and the cover plat...
Embodiment 2
[0138] Additionally, if Figure 11-12 shown, see Figure 1-10 , the present invention also provides another method for preparing the chip structure of the concentrator. The difference from the first embodiment is that the formation sequence and method of the adsorption material layer 111 are different. In this embodiment, in the preparation of the The adsorption material layer 111 is prepared before the cover plate 106, wherein the method of preparing the adsorption material layer 111 includes at least one of evaporation, sputtering, atomic layer deposition, and molecular vapor deposition, that is, the formation of the mesoporous oxidation After the silicon layer 105, an adsorption material layer 111 (such as aluminum oxide, etc.) is deposited (such as by evaporation, sputtering, atomic layer deposition, and molecular vapor deposition). In one example, when the micro-pillar structure 102 is formed based on a patterned mask layer In the case of other structures, the patterned ...
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