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Preparation system and method of high-strength and high-conductivity heterogeneous copper wire

A high-conductivity, copper wire technology, applied in the direction of manufacturing tools, heat treatment equipment, furnaces, etc., can solve the problems of easy oxidation of alloy powder, low production efficiency, long time consumption of alloy powder, etc., to achieve synergistic improvement of strength and toughness, and production efficiency High, time-consuming effect

Active Publication Date: 2020-08-04
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are still the following deficiencies in this patent: (1) the preparation of alloy powder takes a long time, and the production efficiency is low; (2) the alloy powder is easily oxidized, and the density after sintering is poor; (3) the powder sintering temperature is high, and energy consumption larger
However, this technology also has the following problems: (1) It is difficult to control the oxidation of the interface; (2) The size of the sample obtained by high-pressure torsion is small, and the requirements for equipment and molds are high, which is not conducive to industrial production and application

Method used

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  • Preparation system and method of high-strength and high-conductivity heterogeneous copper wire
  • Preparation system and method of high-strength and high-conductivity heterogeneous copper wire
  • Preparation system and method of high-strength and high-conductivity heterogeneous copper wire

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preparation example Construction

[0049] The preparation method of the present invention is specifically as follows: firstly, two kinds of copper / copper alloy plates are alternately mixed and superimposed, and then crimped and deformed into a rod in a crimping deformation device to realize the preliminary mechanical bonding of the interface. Subsequently, by rotating and drawing, the interface between the materials is plastically formed to form a dense interface structure, and the heterogeneous copper wires with alternately distributed components in the radial direction are prepared. After the wire is coiled, the difference in the recrystallization temperature of the dissimilar alloy is used to perform multi-polar recrystallization on the obtained wire to adjust the micro-grain size, and realize the multi-grain size feature with the grain size alternating radially. The alternately distributed soft and hard phase interfaces of coarse and fine crystals produce mutual restraint, so that the material can obtain back...

Embodiment 1

[0057] In this embodiment, pure copper and Cu-Zn alloy are taken as specific embodiments.

[0058] In the first step, the mixture is laminated, and three pure copper plates (99.9wt.%) with a length of 3m, a width of 1.5m and a thickness of 3cm are selected and three Cu-Zn alloy plates of the same size (Cu-10wt. % Zn), surface treatment is performed respectively to remove the oil stain and oxide film on the surface, and polish until the surface is bright. The processed two metal plates are mixed and laminated in a vertical direction alternately, such as figure 2 Shown. The ends and tails of the blank are tied and fixed with copper wires with a diameter of 6mm to prevent looseness and confusion.

[0059] The second step is crimping, sending the bundled and fixed metal sheet to the crimping device, and adjusting the height of the lower rollers so that the vertical height spacing between the upper and lower rollers is 1.8m. The resistance wire in the detachable support 3 is used to ...

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Abstract

The invention belongs to the field of material preparation, and specifically relates to a preparation system and method of a high-strength and high-conductivity heterogeneous copper wire. The system comprises a crimping device used for crimping a mixed material plate into a bar, wherein the mixed material plate is formed by alternately stacking two different compositions of copper / copper alloy plates; a rotating and drawing deformation device used for simultaneously rotating and performing drawing deformation on the crimped bar; a wire winding device used for winding the copper wire obtained after rotating and drawing deformation; and an annealing device used for annealing the wound copper wire, regulating a heterogeneous microstructure of the grain size, and obtaining a high-strength andhigh-conductivity heterogeneous copper wire material. Through the preparation process of "mixed material laminating-crimping-rotating and drawing" and the subsequent multi-stage recrystallization treatment of the invention, the high-strength and high-conductivity heterogeneous copper wire can be prepared, and the microstructure has great flexibility and directivity.

Description

Technical field [0001] The invention belongs to the field of material preparation, and specifically relates to a system and method for preparing a high-strength and high-conductivity heterogeneous copper wire. Background technique [0002] Compared with other metal materials, copper and its alloys have excellent electrical conductivity, thermal conductivity, ductility and corrosion resistance, and are widely used in electrical engineering, communications, new energy and other products. The copper wire prepared by the conventional process has low mechanical strength, poor resistance to deformation, and poor service performance stability of the product, which affects the service life of the product to a certain extent. [0003] Chinese invention patent CN108251684A proposes a high-conductivity and high-strength copper-iron alloy and its preparation method. The copper-iron alloy powder is prepared by an atomization method. After the alloy powder is sintered, the sintered billet obtain...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C21D1/26C21D9/52C22F1/08B21C37/04
CPCB21C37/047C21D1/26C21D9/525C22F1/08
Inventor 周浩任许乐刘亿许梦凝陈雪飞徐涛肖礼容李玉胜曹阳
Owner NANJING UNIV OF SCI & TECH