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A dynamic balance test and correction system for diamond micro-diameter milling cutter

A diamond and balance detection technology, which is applied in the field of tool manufacturing, can solve the problems of reduced precision and achieve the effects of improving dynamic balance precision, processing quality and dynamic characteristics

Active Publication Date: 2022-03-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a dynamic balance test and correction system for diamond micro-diameter milling cutters, which can detect the dynamic balance of micro-milling cutters and handle the unbalanced amount, and can solve the problem of diamond micro-milling cutters due to The problem that the dynamic unbalance leads to the reduction of precision in the process of micro-milling

Method used

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  • A dynamic balance test and correction system for diamond micro-diameter milling cutter
  • A dynamic balance test and correction system for diamond micro-diameter milling cutter
  • A dynamic balance test and correction system for diamond micro-diameter milling cutter

Examples

Experimental program
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Effect test

Embodiment

[0048] The present embodiment carries out the dynamic balance test and correction of the diamond micro-diameter milling cutter according to the following steps:

[0049] Step 1: Install the tool shank of the diamond micro-milling cutter 24 to be dynamically balanced on the pneumatic chuck B23, fix the two vibration sensors 21 on the two planes of the dynamic balance spindle 22 by magnetic attraction, and install the photoelectric The sensor 19 is magnetically mounted on the precision air-floating vibration isolation platform 1, and the probe is aligned with the fluorescent sticker on the pneumatic chuck B23.

[0050] Step 2: Start the dynamic balance spindle 22, and detect the dynamic balance state of the diamond micro-milling cutter 24 to be dynamically balanced under the working condition of the dynamic balance spindle 22 at 10,000 rpm, and obtain an unbalanced mass size of 28 mg and a phase of 10 from the reference phase. °And mark the position of the unbalanced mass on the...

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Abstract

The invention discloses a dynamic balance test and correction system for a diamond micro-diameter milling cutter. The system includes two parts: a micro-grinding workbench and a dynamic balance measurement workbench, wherein: the micro-grinding workbench includes a precision air-floating spacer Vibration platform, base, precision motion table, piezoelectric ceramics, electric control rotary table, collet, CCD camera, CCD mounting frame, vertical one-dimensional precision guide rail, connecting plate, two-dimensional precision motion platform A, grinding axis Mounting frame, high-speed grinding spindle, pneumatic chuck A, grinding wheel grinding head, two-dimensional precision motion platform B; the dynamic balance measurement table includes photoelectric sensor, industrial computer, vibration sensor, dynamic balance spindle, pneumatic chuck B and Dynamic balancer. The system can detect the dynamic balance of the micro-milling cutter and deal with the unbalanced amount, and can solve the problem that the precision of the diamond micro-milling cutter is reduced during the micro-milling process due to the dynamic unbalanced amount after the diamond micro-milling cutter is prepared or worn.

Description

technical field [0001] The invention belongs to the technical field of tool manufacturing, and relates to a dynamic balance testing and correction device for a diamond micro-diameter milling cutter. Background technique [0002] With the continuous improvement of the industrial level, in the fields of aerospace, electronic technology, medical technology, optics and other fields, higher requirements have been put forward for micro-structures and high-precision machining methods. Micro-milling and other micro-machining technologies are irreplaceable in these fields. It is increasingly becoming the focus of subject and engineering research. [0003] At present, the preparation processes of micro-milling tools are mainly precision micro grinding, ultrasonic vibration grinding, focused ion beam sputtering, laser processing, wire electrode EDM grinding, etc. Since machining or wear will cause dynamic unbalance and affect the machining quality, the research on the dynamic balance ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01M1/38
CPCG01M1/16G01M1/34
Inventor 宗文俊张海军武文超赵学森胡振江孙涛
Owner HARBIN INST OF TECH
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