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A large-area two-dimensional gallium nitride thin film and its preparation method

A gallium nitride, large-area technology, applied in the field of gallium nitride materials, can solve problems such as the difficulty of single-layer thickness of GaN, and achieve the effects of strong thickness controllability, reduced time consumption, and good uniformity

Active Publication Date: 2022-03-18
GUANGDONG UNIV OF PETROCHEMICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although it is currently reported that ultra-thin GaN films can be synthesized, how to grow single-layer GaN is still a difficult problem
[0011] Finally, there is the issue of film quality
The currently reported methods for growing 2D GaN thin films are the above three methods, but when the thin film is reduced to a few nanometers or even a few tenths of a nanometer, the uniformity and compactness of the thin film are also facing important challenges.

Method used

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  • A large-area two-dimensional gallium nitride thin film and its preparation method
  • A large-area two-dimensional gallium nitride thin film and its preparation method

Examples

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Effect test

Embodiment 1

[0043] The invention discloses a method for preparing a large-area two-dimensional gallium nitride film. A tube furnace with dual temperature zones is used as a reaction device. A porcelain boat with built-in urea and a ceramic boat coated with urea are respectively placed in the two temperature zones in the tube furnace. For the sapphire substrate of gallium nitrate solution, under the condition of protective atmosphere, the temperature of the porcelain boat and the sapphire substrate were respectively raised, and the heating rate was controlled to reach 138°C at the porcelain boat while the temperature at the sapphire substrate was 900°C. The decomposition product of gallium nitrate solution was vapor-phase deposited to form a large-area two-dimensional gallium nitride film.

[0044] In this embodiment, the gallium nitrate solution is coated on the sapphire substrate by spin coating, and the spin coating rate is 10000 RPM. The concentration of gallium nitrate solution is 15w...

Embodiment 2

[0048] The invention discloses a method for preparing a large-area two-dimensional gallium nitride film. A tube furnace with dual temperature zones is used as a reaction device. A porcelain boat with built-in urea and a ceramic boat coated with urea are respectively placed in the two temperature zones in the tube furnace. For the sapphire substrate of gallium nitrate solution, under the condition of protective atmosphere, the temperature of the porcelain boat and the sapphire substrate were respectively raised. Large-area two-dimensional gallium nitride thin films were formed by vapor deposition of gallium nitrate solution decomposition products.

[0049] In this embodiment, the gallium nitrate solution is coated on the sapphire substrate by spin coating, and the spin coating rate is 8000 RPM. The concentration of gallium nitrate solution is 10wt%. The gallium nitrate solution is a solution formed by dissolving gallium nitrate in water, and dilute nitric acid is added dropwis...

Embodiment 3

[0053] The invention discloses a method for preparing a large-area two-dimensional gallium nitride film. A tube furnace with dual temperature zones is used as a reaction device. A porcelain boat with built-in urea and a ceramic boat coated with urea are respectively placed in the two temperature zones in the tube furnace. For the sapphire substrate of gallium nitrate solution, under the condition of protective atmosphere, the temperature of the porcelain boat and the sapphire substrate were respectively raised, and the heating rate was controlled to reach 130°C at the porcelain boat while the temperature at the sapphire substrate was 950°C. The decomposition product of gallium nitrate solution was vapor-phase deposited to form a large-area two-dimensional gallium nitride film.

[0054] In this embodiment, the gallium nitrate solution is coated on the sapphire substrate by spin coating, and the spin coating rate is 6000 RPM. The concentration of gallium nitrate solution is 20wt...

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Abstract

The invention discloses a method for preparing a large-area two-dimensional gallium nitride film. A tube furnace with dual temperature zones is used as a reaction device. A porcelain boat with built-in urea and a ceramic boat coated with urea are respectively placed in the two temperature zones in the tube furnace. For the sapphire substrate of gallium nitrate solution, under the condition of protective atmosphere, the temperature of the porcelain boat and the sapphire substrate are respectively raised, and the heating rate is controlled to reach 130-138°C at the porcelain boat and 850-950°C at the sapphire substrate. The gas and the gallium nitrate solution decomposition product of the sapphire substrate are vapor-phase deposited to form a large-area two-dimensional gallium nitride film. The preparation method of the large-area two-dimensional gallium nitride thin film of the present invention has the characteristics of strong thickness controllability, large area, good uniformity and fast growth speed.

Description

technical field [0001] The invention relates to the technical field of gallium nitride materials, in particular to a large-area two-dimensional gallium nitride thin film and a preparation method thereof. Background technique [0002] Semiconductors are important products directly related to national interests, and are also important core components related to integrated circuits. The chips made by semiconductors are related to the economic lifeline of the country and the foundation of national rejuvenation. According to the data, the current cost of importing domestic chips has far exceeded the cost of crude oil imports. That is to say, the semiconductor chip manufacturing technology with integrated circuits as the main body has received more and more attention from the state. However, there is still a large gap between my country's semiconductor chip manufacturing technology and developed countries such as the United States, Britain, and Japan. How to further narrow this g...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/34C23C16/448
CPCC23C16/303C23C16/4485
Inventor 陈星源汪潇涵李治文徐祥福
Owner GUANGDONG UNIV OF PETROCHEMICAL TECH
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