Ball grid array millimeter wave broadband matching structure in wafer level packaging and design method

Abstract

The invention discloses a ball grid array millimeter wave broadband matching structure in wafer-level packaging and a design method, and belongs to the technical field of microwave and millimeter wavepackaging circuit systems. A first branch signal line, a multistage stepped impedance resonator and a front-end circuit transmission line are sequentially connected with an upper surface of a microwave dielectric substrate in the positive direction of the x axis, a central signal BGA solder ball connection structure outputs millimeter wave signals, the signals are transmitted to a multi-stage stepped impedance resonator through a first branch signal line to realize broadband matching, the signals are transmitted to a front-end circuit transmission line for output by the multi-stage stepped impedance resonator, broadband matching between the central signal BGA solder ball connection structure and the front-end circuit transmission line is realized, a problem that impedance between a silicon through hole BGA interconnection impedance compensation structure and the front-end circuit signal line is not matched due to the fact that the size of the bottom of a BGA solder ball is larger thanthe width of a signal line of a front-end circuit of a microwave dielectric substrate in the silicon through hole BGA interconnection impedance compensation structure in three-dimensional wafer levelpackaging is solved.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter wave packaging circuit systems, and in particular relates to a ball grid array millimeter wave broadband matching structure and design method in wafer level packaging. Background technique [0002] With the rapid development of modern communication technology and radar technology, the circuit system is developing in the direction of high integration, high speed, miniaturization, and low power consumption. The size of the interconnection structure connecting the chip and the substrate has been compared with The wavelength of the signal is of the same magnitude, which makes the signal fluctuate on the transmission line, which has an adverse effect on signal transmission. Therefore, packaging has become a key factor restricting the development of high-frequency integrated circuits. Advanced 3D wafer-level packaging interconnection provides a feasible technical solution for the rapid...

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Problems solved by technology

[0014] The invention realizes the broadband matching between the center signal BGA solder ball connection structure and the front-end circuit transmission line through the adjustment function of the multi-stage ladder impedance resonator, and solves the problem in the impedance compensation structure of the through-silicon via BGA interconnection in the three-dimensional wafer level packaging. The size of the bottom of the BGA solder ball is larger than the width of the signal line of the front-end circuit of the microwave dielectric substrate, which causes the impedance mismatch between the impedance compensation structure of the TSV BGA interconnection and the signal line of the front-end circuit

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