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A kind of fast bonding method of soft board cover film

A covering film and soft board technology, which is applied to the improvement of the metal adhesion of insulating substrates, manufacturing tools, and machine tools suitable for grinding the edge of workpieces. The effect of improving the adhesion strength, glue adhesion is firm, and reducing the probability of degumming

Active Publication Date: 2021-09-28
BRAIN POWER (QING YUAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing metal substrate and soft film connection process mainly have the following technical problems in the actual use process of these substrates: First, in the soft film lamination process, the glue overflows, resulting in a decrease in the amount of glue actually bonded, and the thickness of the glue layer Second, bubbles are easy to form in the glue, resulting in insufficient adhesion strength of the glue; and the above two problems eventually lead to insufficient adhesion strength, which will lead to the separation of the soft board cover film from the hard board, commonly known as burst board The problem

Method used

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  • A kind of fast bonding method of soft board cover film
  • A kind of fast bonding method of soft board cover film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1 The hard board is an aluminum substrate

[0019] Lay the backing paper and the soft board cover film, and cut the backing paper and the soft board cover film into the same shape by laser cutting. The laser cutting frequency is 50kHz, the cutting speed is 350mm / s, the cutting power is 3W, and the cutting process uses nitrogen gas. As a protective gas, the preset nitrogen pressure is 1.0Mpa before cutting; rinse the soft board cover film with running water for 30s, dry it, and then use a steel brush to brush out the hair on the rubber-coated area of ​​the soft board cover film, and the thickness of the hair layer is 0.3mm;

[0020] Lay the cut backing paper on the rubber-coated surface of the hard board, use the scribe method to locate the milling groove, and then perform the following pretreatment on the rubber-coated surface of the hard board:

[0021] Milling: fix the hard plate on the fixture, use MX230 milling cutter with a diameter of 1mm, the milling c...

Embodiment 2

[0026] Embodiment 2 The copper substrate is a hard board

[0027] Lay the pad paper and the soft board cover film, and cut the pad paper and the soft board cover film into the same shape by laser cutting method. The laser cutting frequency is 60kHz, the cutting speed is 450mm / s, the cutting power is 5W, and the cutting process uses nitrogen gas. As a protective gas, the preset nitrogen pressure is 1.0Mpa before cutting; rinse the soft board cover film with running water for 30s, dry it, and then use a steel brush to brush out the hair on the rubber-coated area of ​​the soft board cover film, and the thickness of the hair layer is 0.5mm;

[0028] Lay the cut backing paper on the rubber-coated surface of the hard board, use the scribe method to locate the milling groove, and then perform the following pretreatment on the rubber-coated surface of the hard board:

[0029] Milling: Fix the hard plate on the fixture, use MX230 milling cutter with a diameter of 1mm, the milling cutte...

Embodiment 3

[0034] Embodiment 3 The nickel-based plate is a hard plate

[0035] Lay the backing paper and the soft board cover film, and cut the backing paper and the soft board cover film into the same shape by laser cutting. The laser cutting frequency is 55kHz, the cutting speed is 400mm / s, the cutting power is 4W, and the cutting process uses nitrogen gas. As a protective gas, the preset nitrogen pressure is 1.0Mpa before cutting; rinse the soft board cover film with running water for 30s, dry it, and then use a steel brush to brush out the hair on the rubber-coated area of ​​the soft board cover film, and the thickness of the hair layer is 0.4mm;

[0036] Lay the cut backing paper on the rubber-coated surface of the hard board, use the scribe method to locate the milling groove, and then perform the following pretreatment on the rubber-coated surface of the hard board:

[0037] Milling: fix the hard plate on the fixture, use MX230 milling cutter with a diameter of 1mm, the milling cu...

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Abstract

The invention discloses a method for quickly laminating the cover film of a flexible board, which relates to the technical field of soft-hard board preparation. The roughening treatment of the surface of the hard board makes the surface of the hard board form uneven micro-planes, increases the contact area between the hard board and the glue, and makes the adhesion of the glue stronger; combined with the roughening treatment of the soft board cover film and the hard board, the soft board is improved. The bonding strength between the cover film and the hard board reduces the probability of degumming between the soft board cover film and the hard board; by setting up a milling groove and a trapezoidal platform, and the sum of the height of the trapezoidal platform and the thickness of the soft board covering film is less than the depth of the milling groove, the surrounding area of ​​the higher milling groove It has a certain blocking effect on the glue, and can basically control the overflow of the glue; through the translational covering pressure, the air between the soft board cover film and the glue can be driven out to avoid air holes affecting the adhesion effect.

Description

technical field [0001] The invention relates to the technical field of preparation of soft and hard boards, in particular to a method for fast bonding of soft board covering films. Background technique [0002] The development of electronic products is inseparable from integrated technology. With the development of integration technology in reducing the installation volume, the shape of electronic products is changing rapidly. The most significant change is that electronic equipment is becoming more and more light in weight, thin in thickness and small in size. The existing integrated technology is mainly based on flexible printed circuits. The main problem in the use of flexible printed boards is that the heat dissipation is relatively slow, so using a metal substrate that is easy to dissipate heat as a support to support the soft-hard combination board can effectively solve the heat dissipation problem. Metal substrates used in the prior art mainly include aluminum subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/38B23K26/38B23K26/402B24B9/04
CPCB23K26/38B23K26/402B24B9/04H05K3/0017H05K3/0044H05K3/38
Inventor 李雪雪张义坤李军李龙
Owner BRAIN POWER (QING YUAN) CO LTD
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