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Preparation method of polymer metal composite microsphere

A metal composite and polymer technology, applied in the direction of microsphere preparation, microcapsule preparation, metal material coating technology, etc., can solve the problems of metal layer peeling, etc., and achieve the effect of strong binding force, large deformation ability, and not easy to break

Inactive Publication Date: 2020-09-29
CHANGCHUN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the phosphate groups introduced on the surface of the microspheres can enhance the interfacial bonding force between the polymer and the metal layer, and ensure the close bonding degree of the metal layer during the deformation process of the microspheres, thereby increasing the conductive microspheres in Reliability during electronic packaging and solves the problem of metal layer peeling during microsphere compression

Method used

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  • Preparation method of polymer metal composite microsphere
  • Preparation method of polymer metal composite microsphere
  • Preparation method of polymer metal composite microsphere

Examples

Experimental program
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Effect test

Embodiment 1

[0039] A method for preparing polymer-metal composite microspheres, specifically comprising the following steps:

[0040] (1) Put 5 g of polyvinylpyrrolidone, 10 g of styrene monomer, and 1 g of polybutyl acrylate into the reactor, add 100 g of ethanol to dissolve them completely, then replace the air in the reactor with nitrogen for 2 times, and then raise the temperature of the reactor To 70°C, add 0.2g of initiator azobisisobutylcyanide to react for 6 hours, add dropwise 10g of styrene monomer and 3g of polybutyl acrylate to the reactor, and dropwise add the reaction monomer vinyl phosphoric acid to the reactor after reacting for 18h 1g of ester, continue to react for 3h after the dropwise addition, centrifuge at 5000rpm and wash with methanol alcohol for 3 times, then dry in a vacuum oven at 40°C for 24h to obtain a styrene acrylate copolymer with phosphate groups on the surface Microspheres;

[0041] (2) Add 5 g of the copolymer microspheres obtained in the step (1) to 100...

Embodiment 2

[0050] A method for preparing polymer-metal composite microspheres, specifically comprising the following steps:

[0051] (1) Put 5 g of polyvinyl alcohol, 10 g of styrene monomer, and 1 g of polybutyl acrylate into the reactor, add a mixed solution of 90 g of ethanol and 10 g of water to dissolve it completely, and then replace the air in the reactor with nitrogen for 2 times , then the reactor was heated to 80°C, 0.5g of benzoyl peroxide initiator was added to react for 5 hours, 10g of styrene monomer and 3g of polybutyl acrylate were added dropwise to the reactor, and after 18 hours of reaction, the reactant was added dropwise to the reactor Monomer vinyl phosphate 1g, after the dropwise addition, continue to react for 3h to discharge, centrifuge at 6000rpm and wash with methanol for 3 times, then dry in a vacuum oven at 35°C for 36h to obtain styrene with phosphate groups on the surface Acrylate copolymer microspheres;

[0052] (2) Add 5 g of the copolymer microspheres ob...

Embodiment 3

[0061] A method for preparing polymer-metal composite microspheres, specifically comprising the following steps:

[0062] (1) Put 5 g of polyvinylpyrrolidone, 10 g of styrene monomer, and 1 g of isooctyl polyacrylate into the reactor, add a mixed solution of 90 g of methanol and 10 g of water to dissolve it completely, and then replace the air in the reactor with nitrogen for 2 After that, the temperature of the reactor was raised to 75°C, 0.2 g of potassium persulfate was added to react for 5 hours, 12 g of styrene monomer and 1 g of isooctyl polyacrylate were added dropwise to the reactor, and the reactant was added dropwise to the reactor after 18 hours of reaction. Monomer vinyl phosphate 0.5g, continue to react for 3h after the dropwise addition, centrifuge at 5000rpm and wash with ethanol for 3 times, then dry in a vacuum oven at 45°C for 48h, you can get phosphate groups on the surface Styrene acrylate copolymer microspheres;

[0063] (2) Add 5 g of the copolymer micro...

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Abstract

The invention discloses a preparation method of a polymer metal composite microsphere, belonging to the field of new materials. Different from the preparation of a traditional polymer metal compositemicrosphere, the preparation method is characterized in that a flexible monomer is introduced in situ to reduce the surface modulus of polymer microspheres, phosphate groups are constructed on the surfaces of the polymer microspheres, the polymer metal composite microspheres are agglomerated to obtain higher deformability, and the interface bonding force between a polymer layer and a metal layer is enhanced, so metal interface glass does not easily occur in the application process of an anisotropic conductive adhesive film, and the reliability of the anisotropic conductive adhesive film is improved.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing polymer-metal composite microspheres used for anisotropic conductive adhesive films. Background technique [0002] Anisotropic conductive adhesive film is a new type of green packaging material, which can achieve insulation in the XY plane and conduction in the Z-axis direction, and is widely used in the field of chip packaging. The anisotropic conductive adhesive film is initially cured by epoxy resin doped with polymer metal composite microspheres. The polymer metal composite microspheres act as its conductive particles and are also the core component of the anisotropic conductive adhesive film. [0003] At present, the polymer conductive microspheres used in the anisotropic conductive adhesive film in the literature are based on polystyrene microspheres as a template, and a metal layer is constructed on the surface of the microspheres by elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F285/00C08F257/02C08F212/08C08F220/18C08F230/02C08F8/36C23C18/32C23C18/28B01J13/14
CPCC08F285/00C08F257/02C08F8/36B01J13/14C23C18/32C23C18/285C23C18/30
Inventor 刘伯军杨斌斌张明耀张会轩徐璐白阳吴高澄胡艺伟刘香池
Owner CHANGCHUN UNIV OF TECH