A kind of cyanate ester adhesive with low curing temperature and high thermal stability and preparation method thereof

Abstract

The invention discloses a cyanate adhesive with low curing temperature and high thermal stability and a preparation method thereof, comprising a cyanate resin, a modifier and a transition metal catalyst; the modifier is selected from 2-[(4 One or more of -nitrophenoxy)methyl]oxirane, 4-nitrostyrene, 1,4-bis(4-nitrostyryl)benzene; the modifier The dosage of the catalyst and the transition metal catalyst is as follows: 1-7g of the modifying agent and 0.02-0.5g of the transition metal catalyst are added to every 100g of the cyanate resin. The cyanate adhesive of the present invention can be completely cured at a relatively low temperature, and the cured product has low dielectric constant and dielectric loss, high thermal decomposition temperature, good thermal stability, and the thermal stability can even exceed that of orthocyanate . The cyanate ester adhesive of the invention has a simple preparation process, does not use toxic and harmful raw materials or solvents, is environmentally friendly and pollution-free, has low production costs, simple equipment requirements, and can realize large-scale industrial production, and is worthy of popularization and use.

Description

technical field [0001] The invention belongs to the technical field of polymer compound materials, in particular to a cyanate ester adhesive with low curing temperature and high thermal stability and a preparation method thereof. Background technique [0002] Cyanate Ester Resin (Cyanate Ester Resin) is a kind of resin with -OCN chemical group in the end group. Because it can form a triazine ring after curing, it has low dielectric constant, low dielectric loss, low moisture absorption rate, low Excellent properties such as volume shrinkage and high heat resistance, it is an ideal adhesive for electronic products. However, due to the highly symmetrical structure, high crystallinity, and high crosslinking density of the triazine ring formed after curing of the cyanate resin, common cyanate resins require relatively high temperatures (generally ≥ 220°C) to fully cure. [0003] However, when using adhesives to bond electronic products, it is required that the curing temperatur...

AI Technical Summary

Problems solved by technology

[0008] Although the above-mentioned several strategies can reduce the curing temperature of cyanate ester, there are also the following problems: epoxy and imine modifiers will seriously reduce the heat resistance and dielectric properties of cyanate ester; Such modifiers will also reduce the heat resistance of cyanate esters; although the use of transition metal catalysts can effectively improve the curing performance of cyanate esters, too many residual metal ions will reduce the dielectric properties of the product, so the amount of addition is very limited , otherwise the dielectric properties of cyanate esters will be severely reduced

Images