Preparation method of silver powder with low heat shrinkage rate

A technology of shrinkage and silver powder, applied in metal processing equipment, transportation and packaging, etc., can solve problems such as inability to apply miniaturized and high-reliability circuits well

Active Publication Date: 2020-10-20
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The method for preparing low-shrinkage silver powder reported above has a silver powder particle size D100 greater than 5 μm, and a heat shrinkage rate of greater than 5% at 700°C, which cannot be well applied to miniaturized high-reliability circuits.

Method used

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  • Preparation method of silver powder with low heat shrinkage rate
  • Preparation method of silver powder with low heat shrinkage rate
  • Preparation method of silver powder with low heat shrinkage rate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Step 1: Dissolve 40kg of high-purity silver nitrate crystals with 80L of deionized water in a temperature-controllable dissolving tank to prepare a 500g / L silver nitrate aqueous solution, and turn on the heating device to stabilize the temperature of the silver nitrate aqueous solution at 50°C; Dissolve 24kg of ascorbic acid crystals in 160L of deionized water in a temperature-controllable dissolving tank, adjust the pH value of the solution with sodium hydroxide, prepare a reducing agent solution with pH=3, and turn on the heating device to stabilize the temperature of the reducing agent solution at 50°C Add 440L deionized water in the reactor, turn on the stirring motor and set the rotating speed as 100r / min, open the heating device, make the temperature of the deionized water stable at 50°C, then add 1.25kg gum arabic in the reactor, after stirring The gum arabic was fully dissolved to make an aqueous dispersant solution; the speed of the silver nitrate aqueous soluti...

Embodiment 2

[0053] Step 1: Dissolve 25kg of high-purity silver nitrate crystals in 80L of deionized water in a temperature-controllable dissolving tank to prepare a 312.5g / L silver nitrate aqueous solution, and turn on the heating device to stabilize the temperature of the silver nitrate aqueous solution at 25°C; Dissolve 20kg of hydroquinone crystals with 160L of deionized water in a temperature-controllable dissolving tank to prepare a reducing agent solution with pH=6, and turn on the heating device to stabilize the temperature of the reducing agent solution at 25°C; Add 440L of deionized water, turn on the stirring motor and set the rotation speed to 300r / min, turn on the heating device to stabilize the temperature of the deionized water at 25°C, and then add 0.8kg of polyethylene glycol with a molecular weight of 1000 to the reaction kettle. The polyethylene glycol is fully dissolved to make a dispersant aqueous solution; the silver nitrate aqueous solution feeding peristaltic pump sp...

Embodiment 3

[0058] Step 1: Dissolve 30kg of high-purity silver nitrate crystals with 50L of deionized water in a temperature-controllable dissolving tank to prepare a 600g / L silver nitrate aqueous solution, and turn on the heating device to stabilize the temperature of the silver nitrate aqueous solution at 60°C; Dissolve 8kg of sodium hypophosphite crystals with 55L of deionized water in a temperature-controllable dissolving tank, adjust the pH value of the solution with sodium hydroxide, prepare a reducing agent solution with pH=8, and turn on the heating device to stabilize the temperature of the reducing agent solution At 60°C; add 580L of deionized water to the reactor, turn on the stirring motor and set the rotation speed to 150r / min, turn on the heating device to stabilize the temperature of the deionized water at 60°C, and then add 1.5kg of number-average molecular weight to the reactor The polyacrylic acid is 2000, under the action of stirring, the polyacrylic acid is fully dissol...

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Abstract

The invention provides a preparation method of silver powder with low heat shrinkage rate. The preparation method comprises the steps that a silver nitrate water solution and a reducing agent solutionare simultaneously added into a dispersing agent water solution to obtain silver powder particles, then after the surface of the silver powder is coated with a surfactant, the silver powder particlesproduce mutual impact, collision and friction shearing by jet stream, so as to achieve the surface smoothness and dispersion treatment of the silver powder, finally a high-energy pulse current is utilized to provide high energy in a very short time to promote the recrystallization of the silver powder in a faster way at a lower temperature, the crystal defects of the silver powder is improved, and the silver powder particles are prevented from agglomerating. The heat shrinkage rate of the prepared silver powder is less than 5% at 700 DEG C, good degree of sphericity and dispersity are achieved, the particle size D100 is not more than 5 [mu]m, the tap density is not less than 4 g / cm<3>, and a broad application prospect in the field of miniaturization and high-reliability circuits is achieved.

Description

technical field [0001] The invention belongs to the technical field of metal powder manufacture, and in particular relates to a method for preparing silver powder with low heat shrinkage rate for electronic paste. Background technique [0002] Electronic paste is a mixed system of solid particles composed of powdered conductive metal, inorganic or polymer binder suspended in an organic carrier and an organic liquid. This fluid material is applied to electronic components by printing and other methods to form modules with specific electrical functions, and is the basic material of various electronic components. [0003] According to different sintering temperatures, electronic paste can be divided into low-temperature curing type and high-temperature sintering type. The low-temperature curing type paste shrinks and crimps the conductive filler through the curing of the resin, thereby ensuring the conduction of the circuit; the high-temperature sintering type paste volatilize...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00
CPCB22F9/24B22F1/065B22F1/14B22F1/142
Inventor 高振威鹿宁吴高鹏陆冬梅田发香王大林马倩李艳殷美
Owner 西安宏星电子浆料科技股份有限公司
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