Copper-nickel-tin-silver-boron alloy and preparation method thereof

A copper-nickel-tin, silver-boron technology, applied in the field of copper-nickel-tin-silver-boron alloy and its preparation, can solve the problems of high preparation cost, work hardening, high deformation resistance and the like

Active Publication Date: 2020-10-27
KINKOU SUZHOU COPPER IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Due to the high content of Ni and Sn, segregation is easily generated during the casting process, which affects the subsequent plastic deformation
[0006] (2) Large deformation resistance
[0007] Due to the high strength of the alloy itself, the phenomenon of work hardening is serious, which brings challenges to plastic deformation. Most of the processing of Cu-Ni-Sn multi-element alloy foil requires multi-pass rolling and annealing, and it is very easy to crack
[0008] (3) High preparation cost
[0009] Due to problems such as segregation and deformation resistance, the preparation process of Cu-Ni-Sn multi-element alloy foil is longer and the production cost is higher
[0010] In fact, besides the mass production of the above-mentioned process methods in the world, many domestic enterprises and copper processing enterprises in Japan and Europe have failed in trial production for many times, resulting in the current monopoly of the product by Materion Brush in the United States

Method used

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  • Copper-nickel-tin-silver-boron alloy and preparation method thereof
  • Copper-nickel-tin-silver-boron alloy and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0042] Finished product physical property table obtained by the preparation method of the present invention

[0043] Elastic Modulus Poisson's ratio Conductivity Thermal conductivity density Permeability 144Kn / mm 2

Embodiment 1

[0046] Step 1. Mix and heat 14.5% nickel, 7.5% tin, 0.1% boron, 0.1% silver, 0.1% impurities and the balance copper to obtain a melt, then stir evenly, and the heating temperature is 1150 ℃;

[0047] Step 2. The melt is introduced into the transfer bag 1, and the melt falls into the water-cooled copper mold 2 through the through hole 11 at the bottom of the transfer bag 1. The outer side of the transfer bag 1 is provided with a heat preservation cover with a heating function. The evenly distributed through holes 11 at the bottom of the transfer package 1 are inclined, and the inclined direction is inclined to one side;

[0048] Step 3: The melt is cooled and solidified in the rotating water-cooled copper mold 2. The maximum depth of the melt in the water-cooled copper mold 2 is 60% of the height of the water-cooled copper mold 2. The melt in the water-cooled copper mold 2 is gradually solidified from bottom to top. The water-cooled copper mold 2 is obliquely installed on the ...

Embodiment 2

[0051] Step 1. Mix and heat 15% nickel, 8% tin, 0.5% boron, 0.2% silver, 0.12% impurities and the balance copper to obtain a melt, then stir evenly, and the heating temperature is 1250 ℃;

[0052]Step 2. The melt is introduced into the transfer bag 1, and the melt falls into the water-cooled copper mold 2 through the through hole 11 at the bottom of the transfer bag 1. The outer side of the transfer bag 1 is provided with a heat preservation cover with a heating function. The evenly distributed through holes 11 at the bottom of the transfer bag 1 are inclined, and the direction of inclination is to incline towards the bottom of the transfer bag 1;

[0053] Step 3, the melt is cooled and solidified in the rotating water-cooled copper mold 2, the maximum depth of the melt in the water-cooled copper mold 2 is 55% of the height of the water-cooled copper mold 2, and the melt in the water-cooled copper mold 2 is gradually solidified from bottom to top, The water-cooled copper mold...

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PUM

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Abstract

The invention discloses a copper-nickel-tin-silver-boron alloy and a preparation method thereof. The alloy is composed of nickel, tin, boron, silver, copper and the like. The preparation method of thealloy comprises the steps that the alloy is mixed and heated into a melt, and then the melt enters a rotating water-cooling copper mold through a diversion bag to be cooled into a blank; and a finished product is obtained by the blank through solid solution heat treatment and spinodal decomposition heat treatment. According to the method, the technical barrier faced by machining deformation of amulti-element alloy foil is broken through, and meanwhile the electric conductivity and the strength of the multi-element alloy foil are improved.

Description

technical field [0001] The invention relates to the field of metal material processing technology, in particular to a copper-nickel-tin-silver-boron alloy and a preparation method thereof. Background technique [0002] The Cu-Ni-Sn multi-element alloy in the related art has advantages such as high strength, excellent stress relaxation, corrosion resistance, thermal conductivity and electrical conductivity. This alloy is an ideal substitute material for beryllium bronze, and not only has the same It also has the advantages of good thermal stress relaxation resistance, non-toxic and environmental protection that beryllium bronze does not have, and has a very wide application prospect. [0003] The Cu-Ni-Sn multi-element alloy foil in the related art is generally prepared by semi-continuous casting + multi-pass rolling deformation. This kind of method has the following problems: [0004] (1) Serious segregation [0005] Due to the high content of Ni and Sn, segregation is eas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C1/02C22F1/08
CPCC22C1/02C22C9/06C22F1/08
Inventor 韩坦朱戴博王富涛陈峰刘洪涛陈红
Owner KINKOU SUZHOU COPPER IND CO LTD
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