Unlock instant, AI-driven research and patent intelligence for your innovation.

Electromagnetic wave shielding film and preparation method thereof

A technology of shielding film and electromagnetic wave, applied in the field of electronics, can solve the problems of affecting the stability and shielding effect of electromagnetic shielding film, poor bonding between film layers, and high overall thickness of electromagnetic shielding film

Inactive Publication Date: 2020-10-27
SHENZHEN KNQ SCI & TECH CO LTD
View PDF10 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a preparation method of electromagnetic shielding film, aiming to solve the problem that the existing electromagnetic shielding film preparation method makes the overall thickness of the prepared electromagnetic shielding film higher, and the bonding tightness between the film layers is not good, which affects the electromagnetic shielding film. Technical issues such as stability and shielding effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electromagnetic wave shielding film and preparation method thereof
  • Electromagnetic wave shielding film and preparation method thereof
  • Electromagnetic wave shielding film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0055] The embodiment of the present invention provides a method for preparing an electromagnetic wave shielding film, comprising the following steps:

[0056] S10. Obtain a carrier layer and an insulating slurry, and deposit the insulating slurry on the carrier layer to obtain an insulating layer;

[0057] S20. Obtain a metal material, and deposit the metal material on the surface of the insulation layer away from the carrier layer by means of sputtering and electroplating to obtain a metal shielding layer;

[0058] S30. Obtain a conductive adhesive material, and deposit the conductive adhesive material on the surface of the metal shielding layer away from the insulating layer to obtain a conductive adhesive layer.

[0059] In the preparation method of the electromagnetic shielding film provided by the embodiment of the present invention, firstly, the insulating slurry is deposited on the carrier layer to prepare the insulating layer. Compared with directly obtaining the form...

Embodiment 1

[0097] An electromagnetic shielding film, comprising the steps of:

[0098] ① Obtain a carrier layer, a mixture of PFA resin and matte polyimide, and deposit the mixture of PFA resin and matte polyimide on the carrier layer to obtain an insulating layer with a thickness of 3 microns;

[0099]②Obtain silicon and gold-silver alloy, put silicon and gold-silver alloy in a vacuum degree not greater than 1*10 -3 Pa, the sputtering speed is 0.5-5m / min, the sputtering current is 3-7A, and the inert gas flow rate is 30-60ppm under the condition of vacuum sputtering 1 micron, and then electroplating to 5 microns to obtain a metal shielding layer with a thickness of 5 microns;

[0100] ③ Obtain a conductive adhesive material, and deposit the conductive adhesive material on the surface of the metal shielding layer away from the insulating layer to obtain a conductive adhesive layer with a thickness of 5 microns; wherein, the resin of the conductive adhesive contains 30-45 % rubber, 10-2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of electronics and particularly relates to a preparation method of an electromagnetic wave shielding film. The preparation method comprises the following steps of obtaining a carrier layer and insulating slurry, and depositing the insulating slurry onto the carrier layer, so that an insulating layer is obtained; obtaining a metal material, and depositing the metal material onto the surface of the side, away from the carrier layer, of the insulating layer through sputtering and electroplating, so that a metal shielding layer is obtained; and obtaining a conducting adhesive material, and depositing the conducting adhesive material onto the surface of the side, away from the insulating layer, of the metal shielding layer, so that a conducting adhesive layer is obtained. By means of the preparation method of the electromagnetic shielding film, an overall film layer of the obtained electromagnetic shielding film is small in thickness; the electromagnetic shielding film is more applicable to a flexible device; film layers are bonded closely; and the electromagnetic shielding film is good in ductility, high in electromagnetic transmission speed, low in loss and more excellent in shielding performance.

Description

technical field [0001] The invention belongs to the technical field of electronics, and in particular relates to an electromagnetic wave shielding film and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, electronic products are gradually developing toward miniaturization, light weight, portability, and high-density assembly, which greatly promotes the development of electronic components. The integration of semiconductor chips is getting higher and higher. The number of input and output ports (I / O) per unit area of ​​the device is increasing. The improvement of integration puts forward higher requirements for electronic packaging technology, requiring thinner electronic components and better conductivity. In addition, in order to avoid signal interference caused by electromagnetic radiation and threats to human health, electronic products are required to have better electromagnetic shielding performance. T...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/02C23C14/20C25D3/38C23C14/58C23F17/00H05K9/00
CPCC23C14/34C23C14/024C23C14/205C25D3/38C23C14/58C23F17/00H05K9/0084
Inventor 由龙赵伟业张林杰
Owner SHENZHEN KNQ SCI & TECH CO LTD